ESP32-WROVER-IE-N8R8

Wi-Fi + Bluetooth + Bluetooth LE MCU Module

The ESP32-WROVER-IE-N8R8 is a wi-fi + bluetooth + bluetooth le mcu module from Espressif Systems. View the full ESP32-WROVER-IE-N8R8 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

ESP32-WROVER-IE-N8R8 shares its datasheet with ESP32-WROVER, whose page lists every part number it covers.

Official ESP32-WROVER-IE-N8R8 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Espressif Systems

ESP32-WROVER-IE-N8R8 Key Specifications

Parameter	Value
Flash	8 MB (Quad SPI)
PSRAM	8 MB (Quad SPI)
Wi-Fi	802.11 b/g/n, up to 150 Mbps
Antenna	External antenna connector
Bluetooth	v4.2 BR/EDR and Bluetooth LE
CPU Clock	80 MHz to 240 MHz (dual core)
Interfaces	SD card, UART, SPI, SDIO, I2C, I2S, LED PWM, Motor PWM, IR, pulse counter, GPIO, capacitive touch, ADC, DAC, TWAI (CAN 2.0)
Sleep Current	<5 µA
Supply Voltage	3.0V to 3.6V
Module Dimensions	18.00 x 31.40 x 3.30 mm
Integrated Crystal	40 MHz
Operating Temperature	-40°C to 85°C
Wi-Fi Frequency Range	2412 MHz to 2484 MHz
Output Power At Antenna	20 dBm
Moisture Sensitivity Level	MSL 3
Bluetooth Receiver Sensitivity	-97 dBm
Minimum Supply Current Capability	500 mA

ESP32-WROVER-IE-N8R8 Overview

Part: ESP32-WROVER-E & ESP32-WROVER-IE — Espressif Type: Wi-Fi + Bluetooth + Bluetooth LE MCU Module

Description: Powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU modules based on the ESP32-D0WD-V3 or ESP32-D0WDR2-V3 chip, featuring two Xtensa 32-bit LX6 microprocessors, adjustable CPU clock from 80 MHz to 240 MHz, integrated 4 MB to 16 MB Quad SPI Flash, and 2 MB or 8 MB Quad SPI PSRAM.

Operating Conditions:

Supply voltage: 3.0–3.6 V
Operating temperature: -40 to 85 °C
Minimum current delivered by power supply: 0.5 A

Absolute Maximum Ratings:

Max supply voltage: 3.6 V
Max continuous current: 1100 mA (Cumulative IO output current)
Max junction/storage temperature: 105 °C

Key Specs:

CPU: Two Xtensa 32-bit LX6 microprocessors
CPU clock frequency: 80 MHz to 240 MHz
Internal ROM: 448 KB
On-chip SRAM: 520 KB
Wi-Fi Protocols: 802.11 b/g/n (up to 150 Mbps)
Bluetooth Protocols: Bluetooth v4.2 BR/EDR and Bluetooth LE
Bluetooth LE Receiver Sensitivity: -97 dBm (NZIF receiver)
Integrated crystal: 40 MHz

Features:

Wi-Fi (802.11 b/g/n)
Bluetooth v4.2 BR/EDR and Bluetooth LE
Integrated 4 MB, 8 MB, or 16 MB Quad SPI Flash
Integrated 2 MB or 8 MB Quad SPI PSRAM
Rich set of peripherals: SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI (CAN Specification 2.0)
Low-power coprocessor
Sleep current less than 5 μA
Secure (encrypted) over the air (OTA) upgrade support
FreeRTOS with LwIP operating system
TLS 1.2 with hardware acceleration

Applications:

Low-power sensor networks
Voice encoding
Music streaming
MP3 decoding
Battery powered and wearable electronics

Package:

ESP32-WROVER-E: 18.0 x 31.4 x 3.3 mm (with PCB antenna)
ESP32-WROVER-IE: 18.0 x 31.4 x 3.3 mm (with external antenna connector)

ESP32-WROVER-IE-N8R8 Pin Configuration

The module has 38 pins. See pin definitions in Table 4.

Table 4: Pin Definitions

Name	No.	Type	Function
GND	1	P	Ground
3V3	2	P	Power supply
EN	3	I	Module-enable signal. Active high.
SENSOR_VP	4	I	GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN	5	I	GPIO39, ADC1_CH3, RTC_GPIO3
IO34	6	I	GPIO34, ADC1_CH6, RTC_GPIO4
IO35	7	I	GPIO35, ADC1_CH7, RTC_GPIO5
IO32	8	I/O	GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9
IO33	9	I/O	GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8
IO25	10	I/O	GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26	11	I/O	GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27	12	I/O	GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO14	13	I/O	GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2
IO12	14	I/O	GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3
GND	15	P	Ground
IO13	16	I/O	GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER
NC *	17	-	-
NC *	18	-	-
NC *	19	-	-
NC *	20	-	-
NC *	21	-	-
NC *	22	-	-
IO15	23	-	GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3
IO2	24	I/O	GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0
IO0	25	I/O	GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
IO4	26	I/O	GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER
NC	27	-	-
NC	28	-	-
IO5	29	I/O	GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18	30	I/O	GPIO18, VSPICLK, HS1_DATA7
IO19	31	I/O	GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC	32	-	-
IO21	33	I/O	GPIO21, VSPIHD, EMAC_TX_EN

Name	No.	Type	Function
RXD0	34	I/O	GPIO3, U0RXD, CLK_OUT2
TXD0	35	I/O	GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22	36	I/O	GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23	37	I/O	GPIO23, VSPID, HS1_STROBE
GND	38	P	Ground

ESP32-WROVER-IE-N8R8 Electrical Characteristics

Table 9: DC Characteristics (3.3 V, 25 °C)

Symbol	Parameter	Min	Typ	Max	Unit
C IN	Pin capacitance	-	2	-	pF
V IH	High-level input voltage	0.75×VDD 1	-	VDD 1 +0.3	V
V IL	Low-level input voltage	-0.3	-	0.25×VDD 1	V
I IH	High-level input current	-	-	50	nA
I IL	Low-level input current	-	-	50	nA
V OH	High-level output voltage	0.8×VDD 1	-	-	V
V OL	Low-level output voltage	-	-	0.1×VDD 1	V

Symbol	Parameter	Parameter	Min	Typ	Max	Unit
I OH	High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)	VDD3P3_CPU power domain 1 , 2	-	40	-	mA
I OH	High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)	VDD3P3_RTC power domain 1 , 2	-	40	-	mA
I OH	High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)	VDD_SDIO power domain 1 , 3	-	20	-	mA
I OL	Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum)	Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum)	-	28	-	mA
R PU	Resistance of internal pull-up resistor	Resistance of internal pull-up resistor	-	45	-	k Ω
R PD	Resistance of internal pull-down resistor	Resistance of internal pull-down resistor	-	45	-	k Ω
V IL _ nRST	Low-level input voltage of CHIP_PU to shut down the chip	Low-level input voltage of CHIP_PU to shut down the chip	-	-	0.6	V

ESP32-WROVER-IE-N8R8 Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions.

Table 7: Absolute Maximum Ratings

Symbol	Parameter	Min	Max	Unit
VDD33	Power supply voltage	-0.3	3.6	V
I output 1	Cumulative IO output current	-	1100	mA
T store	Storage temperature	-40	105	°C

Please see Appendix IO_MUX in ESP32 Datasheet for IO's power domain.

ESP32-WROVER-IE-N8R8 Recommended Operating Conditions

Table 8: Recommended Operating Conditions

Symbol	Parameter	Min	Typical	Max	Unit
VDD33	Power supply voltage	3	3.3	3.6	V
I VDD	Current delivered by external power supply	0.5	-	-	A
T	Operating temperature	-40	-	85	°C

ESP32-WROVER-IE-N8R8 Package Information

This section provides the following resources for your reference:

Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 12 Recommended PCB Land Pattern .
Source files of recommended PCB land patterns to measure dimensions not covered in Figure 12. You can view the source files for ESP32-WROVER-E and ESP32-WROVER-IE with Autodesk Viewer.
3D models of ESP32-WROVER-E and ESP32-WROVER-IE. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt).

Figure 12: Recommended PCB Land Pattern

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part Number	Manufacturer	Package
ESP32	Espressif Systems	ESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm)
ESP32-D0WD-V3	Espressif Systems	48-VFQFN Exposed Pad
ESP32-D0WD-V3/ESP32	Espressif Systems	—
ESP32-WROVER	Espressif Systems	—
ESP32-WROVER-E-N16R2	Espressif Systems
ESP32-WROVER-E-N16R8	Espressif Systems	—
ESP32-WROVER-E-N4R2	Espressif Systems	—
ESP32-WROVER-E-N4R8	Espressif Systems	38-SMD Module
ESP32-WROVER-E-N8R2	Espressif Systems	—
ESP32-WROVER-E-N8R8	Espressif Systems
ESP32-WROVER-IE	Espressif Systems	18.00 mm x 31.40 mm x 3.30 mm
ESP32-WROVER-IE-N16R2	Espressif Systems	Module (18.0 x 31.4 x 3.3 mm) with external antenna connector
ESP32-WROVER-IE-N16R8	Espressif Systems	Module (18.0 x 31.4 x 3.3 mm) with external antenna connector
ESP32-WROVER-IE-N4R2	Espressif Systems	Module (18.0 x 31.4 x 3.3 mm) with external antenna connector
ESP32-WROVER-IE-N4R8	Espressif Systems	Module (18.0 x 31.4 x 3.3 mm) with external antenna connector
ESP32-WROVER-IE-N8R2	Espressif Systems	Module (18.0 x 31.4 x 3.3 mm) with external antenna connector

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