ESP32-WROOM-32

Wi-Fi+BT+BLE MCU module

The ESP32-WROOM-32 is a wi-fi+bt+ble mcu module from Espressif Systems. View the full ESP32-WROOM-32 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Official ESP32-WROOM-32 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Espressif Systems

ESP32-WROOM-32 Key Specifications

Parameter	Value
CPU	dual-core 32-bit Xtensa LX6, up to 240 MHz
Memory	448 KB ROM, 520 KB SRAM, 8 KB RTC SRAM
Flash	4 MB external SPI flash
Wi-Fi	802.11b/g/n, 2412–2484 MHz, up to 150 Mbps (802.11n)
Bluetooth	V4.2 BR/EDR and Bluetooth LE; Class-1, class-2 and class-3 transmitter
GPIO	up to 32, including 5 strapping GPIOs
Power-up timing	3.3 V rails stable at least 50 μs before CHIP_PU goes high; CHIP_PU low for at least 50 μs to reset
Module size	18 × 25.5 × 3.1 mm

ESP32-WROOM-32 Overview

Part: ESP32-WROOM-32 — Espressif

Type: Wi-Fi + Bluetooth / Bluetooth LE MCU Module

Description: 2.4 GHz Wi-Fi (802.11b/g/n, up to 150 Mbps) and Bluetooth V4.2 BR/EDR + LE module based on the ESP32-D0WDQ6 dual-core Xtensa LX6 CPU at up to 240 MHz, with 4 MB SPI flash and an on-board PCB antenna.

Operating Conditions:

Supply voltage: 3.0–3.6 V (3.3 V typical)
Operating temperature: -40 to 85 °C
Current delivered by external power supply: at least 0.5 A

Absolute Maximum Ratings:

Max supply voltage (VDD33): 3.6 V (min -0.3 V)
Cumulative IO output current: 1,100 mA
Storage temperature: -40 to 105 °C

Key Specs:

CPU: dual-core 32-bit Xtensa LX6, up to 240 MHz
Memory: 448 KB ROM, 520 KB SRAM, 8 KB RTC SRAM
Flash: 4 MB external SPI flash
Wi-Fi: 802.11b/g/n, 2412–2484 MHz, up to 150 Mbps (802.11n)
Bluetooth: V4.2 BR/EDR and Bluetooth LE; Class-1, class-2 and class-3 transmitter
GPIO: up to 32, including 5 strapping GPIOs
Power-up timing: 3.3 V rails stable at least 50 μs before CHIP_PU goes high; CHIP_PU low for at least 50 μs to reset
Module size: 18 × 25.5 × 3.1 mm

Features:

On-module 40 MHz crystal oscillator and 4 MB SPI flash
On-board PCB antenna
A-MPDU/A-MSDU aggregation and 0.4 μs guard interval support
Peripherals: SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, capacitive touch sensor, ADC, DAC, TWAI® (ISO 11898-1 compatible)
Low-power coprocessor can monitor peripherals while the CPU is powered off
Strapping-pin and eFuse boot configuration (boot mode, VDD_SDIO voltage, U0TXD printing, SDIO slave timing, JTAG source)
Green certification: REACH/RoHS

Applications:

Smart Home
Industrial Automation
Health Care
Consumer Electronics
Smart Agriculture
POS Machines
Service Robot
Audio Devices
Low-power IoT sensor hubs and data loggers
Cameras for video streaming
Speech and image recognition
SDIO Wi-Fi + Bluetooth networking card

Package:

Castellated-pad SMD module, 38 pins, 18 × 25.5 × 3.1 mm

ESP32-WROOM-32 Features

Programmable data transfer length, in multiples of 1 byte
Four-line full-duplex/half-duplex communication and three-line half-duplex communication support
Master mode and slave mode
Programmable CPOL and CPHA
Programmable clock

For details, see ESP32 Technical Reference Manual > Chapter SPI Controller .

For SPI, the pins are multiplexed with GPIO6 ~ GPIO11 via the IO MUX. For HSPI, the pins are multiplexed with GPIO2, GPIO4, GPIO12 ~ GPIO15 via the IO MUX. For VSPI, the pins are multiplexed with GPIO5, GPIO18 ~ GPIO19, GPIO21 ~ GPIO23 via the IO MUX.

For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix .

ESP32-WROOM-32 Applications

Smart Home
Industrial Automation
Health Care
Consumer Electronics
Smart Agriculture
POS Machines
Service Robot
Audio Devices
Generic Low-power IoT Sensor Hubs
Generic Low-power IoT Data Loggers
Cameras for Video Streaming
Speech Recognition
Image Recognition
SDIO Wi-Fi + Bluetooth Networking Card

ESP32-WROOM-32 Pin Configuration

ESP32-WROOM-32 has 38 pins. See pin definitions in T able 2.

For peripheral pin configurations, please refer to Section 4.2 Digital Peripherals .

Table 2: Pin Definitions

Name	No.	Type 1	Function
GND	1	P	Ground
3V3	2	P	Power supply
EN	3	I	Module-enable signal. Active high.
SENSOR_VP	4	I	GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN	5	I	GPIO39, ADC1_CH3, RTC_GPIO3
IO34	6	I	GPIO34, ADC1_CH6, RTC_GPIO4
IO35	7	I	GPIO35, ADC1_CH7, RTC_GPIO5
IO32	8	I/O	GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9
IO33	9	I/O	GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8
IO25	10	I/O	GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26	11	I/O	GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7 , EMAC_RXD1
IO27	12	I/O	GPIO27 , ADC2_CH7, TOUCH7, RTC_GPIO17 , EMAC_RX_DV
IO14	13	I/O	GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2
IO12	14	I/O	GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3
GND	15	P	Ground
IO13	16	I/O	GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER
SHD/SD2 2	17	I/O	GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3 2	18	I/O	GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD 2	19	I/O	GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
SCK/CLK 2	20	I/O	GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0 2	21	I/O	GPIO7 , SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1 2	22	I/O	GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
IO15	23	I/O	GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3
IO2	24	I/O	GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0
IO0	25	I/O	GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
IO4	26	I/O	GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER
IO16	27	I/O	GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17	28	I/O	GPIO17 , HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5	29	I/O	GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18	30	I/O	GPIO18, VSPICLK, HS1_DATA7
IO19	31	I/O	GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC	32	-	-
IO21	33	I/O	GPIO21, VSPIHD, EMAC_TX_EN
RXD0	34	I/O	GPIO3, U0RXD, CLK_OUT2
TXD0	35	I/O	GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2

Table 2: Pin Definitions

Name	No.	Type 1	Function
IO22	36	I/O	GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23	37	I/O	GPIO23, VSPID, HS1_STROBE
GND	38	P	Ground

ESP32-WROOM-32 Electrical Characteristics

Table 14: DC Characteristics (3.3 V, 25 °C)

Symbol	Parameter	Parameter	Min	Typ	Max	Unit
C IN	Pin capacitance	Pin capacitance	-	2	-	pF
V IH	High-level input voltage	High-level input voltage	0.75×VDD 1	-	VDD 1 +0.3	V
V IL	Low-level input voltage	Low-level input voltage	-0.3	-	0.25×VDD 1	V
I IH	High-level input current	High-level input current	-	-	50	nA
I IL	Low-level input current	Low-level input current	-	-	50	nA
V OH	High-level output voltage	High-level output voltage	0.8×VDD 1	-	-	V
V OL	Low-level output voltage	Low-level output voltage	-	-	0.1×VDD 1	V
I OH	High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)	VDD3P3_CPU power domain 1 , 2	-	40	-	mA
I OH	High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)	VDD3P3_RTC power domain 1 , 2	-	40	-	mA
I OH	High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)	VDD_SDIO power domain 1 , 3	-	20	-	mA

Symbol	Parameter	Min	Typ	Max	Unit
I OL	Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum)	-	28	-	mA
R PU	Resistance of internal pull-up resistor	-	45	-	k Ω
R PD	Resistance of internal pull-down resistor	-	45	-	k Ω
V IH _ nRST	Chip reset release voltage (CHIP_PU voltage is within the specified range)	0.75×VDD 1	-	VDD 1 +0.3	V
V IL _ nRST	Low-level input voltage of CHIP_PU to shut down the chip	-	-	0.6	V

ESP32-WROOM-32 Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in T able 12 Absolute Maximum Ratings below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the T able 13 Recommended Operating Conditions .

Table 12: Absolute Maximum Ratings

Symbol	Parameter	Min	Max	Unit
VDD33	Power supply voltage	-0.3	3.6	V
I output 1	Cumulative IO output current	-	1,100	mA
T store	Storage temperature	-40	105	°C

Please see Appendix IO_MUX of ESP32 Datasheet for IO's power domain.

ESP32-WROOM-32 Recommended Operating Conditions

Table 13: Recommended Operating Conditions

Symbol	Parameter	Min	Typical	Max	Unit
VDD33	Power supply voltage	3.0	3.3	3.6	V
I VDD	Current delivered by external power supply	0.5	-	-	A
T	Operating ambient temperature	-40	-	85	°C

ESP32-WROOM-32 Package Information

This section provides the following resources for your reference:

Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 10.1 PCB Land Pattern .
Source files of recommended PCB land patterns to measure dimensions not covered in Figure 10.1. You can view the source files for ESP32-WROOM-32 with Autodesk Viewer.

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Figure 8: Recommended PCB Land Pattern

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