ESP32-WROOM-32

Part: ESP32-WROOM-32 (ESP-WROOM-32) from Espressif Systems

Type: Wi-Fi+BT+BLE MCU module

Key Specs:

• CPU clock frequency: 80 MHz to 240 MHz
• Sleep current: less than 5 µA
• Data rate: up to 150 Mbps
• Output power: 20.5 dBm

Features:

• Two individually controlled CPU cores
• Low-power co-processor
• Capacitive touch sensors
• Hall sensors
• SD card interface
• Ethernet
• High-speed SPI
• UART
• I2S
• I2C
• Bluetooth, Bluetooth LE, and Wi-Fi integration
• freeRTOS with LwIP operating system
• TLS 1.2 with hardware acceleration
• Secure (encrypted) over the air (OTA) upgrade

Applications:

• Low-power sensor networks
• Voice encoding
• Music streaming
• MP3 decoding
• Battery powered and wearable electronics applications

Package:

• null

ESP32-WROOM-32 (ESP-WROOM-32) has 38 pins. See pin definitions in Table 2.

Table 2: Pin Definitions

Name	No.	Type	Function
GND	1	P	Ground
3V3	2	P	Power supply.
EN	3	I	Chip-enable signal. Active high.
SENSOR_VP	4	I	GPIO36, SENSOR_VP, ADC_H, ADC1_CH0, RTC_GPIO0
SENSOR_VN	5	I	GPIO39, SENSOR_VN, ADC1_CH3, ADC_H, RTC_GPIO3
IO34	6	I	GPIO34, ADC1_CH6, RTC_GPIO4
IO35	7	I	GPIO35, ADC1_CH7, RTC_GPIO5
			GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
IO32	8	I/O	TOUCH9, RTC_GPIO9
			GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,
IO33	9	I/O	TOUCH8, RTC_GPIO8
IO25	10	I/O	GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26	11	I/O	GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27	12	I/O	GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV

| Name | No. | Type | Function | |----------|----------------------------------------------------------------------------------|------|---------------------------------------------------------------------|--|--|--| | IO14 | 13 | I/O | GPIO14,
ADC2_CH6,
TOUCH6,
RTC_GPIO16,
MTMS,
HSPICLK, | | | | | HS2_CLK, SD_CLK, EMAC_TXD2 | | IO12 | 14 | I/O | GPIO12,
ADC2_CH5,
TOUCH5,
RTC_GPIO15,
MTDI,
HSPIQ, | | | | | HS2_DATA2, SD_DATA2, EMAC_TXD3 | | GND | 15 | P | Ground | | IO13 | 16 | I/O | GPIO13,
ADC2_CH4,
TOUCH4,
RTC_GPIO14,
MTCK,
HSPID, | | | | | HS2_DATA3, SD_DATA3, EMAC_RX_ER | | SHD/SD2* | 17 | I/O | GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD | | SWP/SD3* | 18 | I/O | GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD | | SCS/CMD* | 19 | I/O | GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS | | SCK/CLK* | 20 | I/O | GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS | | SDO/SD0* | 21 | I/O | GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS | | SDI/SD1* | 22 | I/O | GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS | | IO15 | GPIO15,
ADC2_CH3,
TOUCH3,
MTDO,
HSPICS0,
RTC_GPIO13,
23
I/O | | | | | HS2_CMD, SD_CMD, EMAC_RXD3 | | IO2 | GPIO2,
ADC2_CH2,
TOUCH2,
RTC_GPIO12,
HSPIWP, HS2_DATA0,
24
I/O | | | | | SD_DATA0 | | IO0 | 25 | I/O | GPIO0,
ADC2_CH1,
TOUCH1,
RTC_GPIO11,
CLK_OUT1, | | | | | EMAC_TX_CLK | | IO4 | 26 | I/O | GPIO4,
ADC2_CH0,
TOUCH0,
RTC_GPIO10,
HSPIHD, HS2_DATA1, | | | | | SD_DATA1, EMAC_TX_ER | | IO16 | 27 | I/O | GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT | | IO17 | 28 | I/O | GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 | | IO5 | 29 | I/O | GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK | | IO18 | 30 | I/O | GPIO18, VSPICLK, HS1_DATA7 | | IO19 | 31 | I/O | GPIO19, VSPIQ, U0CTS, EMAC_TXD0 | | NC | 32 | - | - | | IO21 | 33 | I/O | GPIO21, VSPIHD, EMAC_TX_EN | | RXD0 | 34 | I/O | GPIO3, U0RXD, CLK_OUT2 | | TXD0 | 35 | I/O | GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 | | IO22 | 36 | I/O | GPIO22, VSPIWP, U0RTS, EMAC_TXD1 | | IO23 | 37 | I/O | GPIO23, VSPID, HS1_STROBE | | GND | 38 | P | Ground |

Note:

^* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected to the integrated SPI flash integrated on ESP32-WROOM-32 (ESP-WROOM-32) and are not recommended for other uses.

Note:

The specifications in this chapter have been tested under the following general condition: VDD = 3.3V, T*^A* = 27°C, unless otherwise specified.

5.1 Absolute Maximum Ratings

Table 5: Absolute Maximum Ratings

Parameter	Symbol	Min	Typ	Max	Unit
Power supply	VDD	2.7	3.3	3.6	V
Minimum current delivered by		0.5	-	-	A
power supply	IV DD
Input low voltage	VIL	-0.3	-	1 0.25×VIO	V
Input high voltage	VIH	1 0.75×VIO	-	1+0.3 VIO	V
Input leakage current	IIL	-	-	50	nA
Input pin capacitance	Cpad	-	-	2	pF
Output low voltage	VOL	-	-	1 0.1×VIO	V
Output high voltage	VOH	1 0.8×VIO	-	-	V
Maximum output drive capability	IMAX	-	-	40	mA
Storage temperature range	TST R	-40	-	85	°C
Operating temperature range	TOP R	-40	-	85	°C

^1. VIO is the power supply for a specific pad. More details can be found in the ESP32 Datasheet, Appendix IO_MUX. For example, the power supply for SD_CLK is the VDD_SDIO.

5.2 Wi-Fi Radio

Table 6: Wi-Fi Radio Characteristics

Description	Min	Typical	Max	Unit
Input frequency	2412	-	2484	MHz
Input reflection	-	-	-10	dB
	Tx power
Output power of PA for 72.2 Mbps	13	14	15	dBm
Output power of PA for 11b mode	19.5	20	20.5	dBm
	Sensitivity
DSSS, 1 Mbps	-	-98	-	dBm
CCK, 11 Mbps	-	-91	-	dBm
OFDM, 6 Mbps	-	-93	-	dBm
OFDM, 54 Mbps	-	-75	-	dBm
HT20, MCS0	-	-93	-	dBm
HT20, MCS7	-	-73	-	dBm

| Description | Min | Typical | Max | Unit | |---------------|----------------------------|---------|-----|------|--|--| | HT40, MCS0 | - | -90 | - | dBm | | HT40, MCS7 | - | -70 | - | dBm | | MCS32 | - | -89 | - | dBm | | | Adjacent channel rejection | | OFDM, 6 Mbps | - | 37 | - | dB | | OFDM, 54 Mbps | - | 21 | - | dB | | HT20, MCS0 | - | 37 | - | dB | | HT20, MCS7 | - | 20 | - | dB |

5.3 BLE Radio

5.3.1 Receiver

Table 7: Receiver Characteristics — BLE

Parameter	Conditions	Min	Typ	Max	Unit
Sensitivity @30.8% PER	-	-	-97	-	dBm
Maximum received signal @30.8% PER	-	0	-	-	dBm
Co-channel C/I	-	-	+10	-	dB
	F = F0 + 1 MHz	-	-5	-	dB
	F = F0 - 1 MHz	-	-5	-	dB
	F = F0 + 2 MHz	-	-25	-	dB
Adjacent channel selectivity C/I	F = F0 - 2 MHz	-	-35	-	dB
	F = F0 + 3 MHz	-	-25	-	dB
	F = F0 - 3 MHz	-	-45	-	dB
	30 MHz ~ 2000 MHz	-10	-	-	dBm
	2000 MHz ~ 2400 MHz	-27	-	-	dBm
Out-of-band blocking performance	2500 MHz ~ 3000 MHz	-27	-	-	dBm
	3000 MHz ~ 12.5 GHz	-10	-	-	dBm
Intermodulation	-	-36	-	-	dBm

5.3.2 Transmitter

Table 8: Transmitter Characteristics — BLE

Parameter	Conditions	Min	Typ	Max	Unit
RF transmit power	-	-	0	-	dBm
Gain control step	-	-	±3	-	dBm
RF power control range	-	-12	-	+12	dBm

Parameter	Conditions	Min	Typ	Max	Unit
Adjacent channel transmit power	F = F0 + 1 MHz	-	-14.6	-	dBm
	F = F0 - 1 MHz	-	-12.7	-	dBm
	F = F0 + 2 MHz	-	-44.3	-	dBm
	F = F0 - 2 MHz	-	-38.7	-	dBm
	F = F0 + 3 MHz	-	-49.2	-	dBm
	F = F0 - 3 MHz	-	-44.7	-	dBm
	F = F0 + > 3 MHz	-	-50	-	dBm
	F = F0 - > 3 MHz	-	-50	-	dBm
$\Delta f1_{avg}$	-	-	-	265	kHz
$\Delta f2$ max	-	247	-	-	kHz
$\Delta f 2_{\text{avg}}/\Delta f 1_{\text{avg}}$	-	-	-0.92	-	-
ICFT	-	-	-10	-	kHz
Drift rate	-	-	0.7	-	kHz/50 μs
Drift	-	-	2	-	kHz

5.4 Reflow Profile

Figure 2: Reflow Profile

Table 5: Absolute Maximum Ratings

Parameter	Symbol	Min	Typ	Max	Unit
Power supply	VDD	2.7	3.3	3.6	V
Minimum current delivered by		0.5	-	-	A
power supply	IV DD
Input low voltage	VIL	-0.3	-	1 0.25×VIO	V
Input high voltage	VIH	1 0.75×VIO	-	1+0.3 VIO	V
Input leakage current	IIL	-	-	50	nA
Input pin capacitance	Cpad	-	-	2	pF
Output low voltage	VOL	-	-	1 0.1×VIO	V
Output high voltage	VOH	1 0.8×VIO	-	-	V
Maximum output drive capability	IMAX	-	-	40	mA
Storage temperature range	TST R	-40	-	85	°C
Operating temperature range	TOP R	-40	-	85	°C

^1. VIO is the power supply for a specific pad. More details can be found in the ESP32 Datasheet, Appendix IO_MUX. For example, the power supply for SD_CLK is the VDD_SDIO.