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ESP32

Ultra-low-power SoC

The ESP32 is a ultra-low-power soc from Espressif Systems. View the full ESP32 datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.

Manufacturer

Espressif Systems

Package

ESP32-S3-WROOM-1

Key Specifications

ParameterValue
CPUXtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz
ROM448 KB
SRAM520 KB (main) + 16 KB (RTC)
PSRAMUp to 2 MB (optional)
Flash Memory4 MB, 8 MB, or 16 MB SPI flash
Wi-Fi Standard802.11b/g/n
Supply Voltage Range3.0V to 3.6V
Wi-Fi Frequency Range2412 MHz to 2484
Operating Temperature Range-40°C to 85°C (standard), -40°C to 105°C (high-temp)

Overview

Part: ESP32-S3 Series, Espressif Type: Low-power MCU-based System-on-Chip (SoC) Description: ESP32-S3 is a low-power MCU-based system-on-chip (SoC) that supports 2.4 GHz Wi-Fi and Bluetooth Low Energy, featuring a dual-core Xtensa 32-bit LX7 processor up to 240 MHz, 512 KB SRAM, and 384 KB ROM.

Operating Conditions:

  • Supply voltage: 3.0–3.6 V (VDD3P3)
  • Operating temperature: -40 to +105 °C
  • Max CPU clock frequency: 240 MHz
  • Wi-Fi standard: IEEE 802.11b/g/n (2.4 GHz)
  • Bluetooth standard: Bluetooth LE 5

Absolute Maximum Ratings:

  • Max supply voltage: -0.3 to 3.9 V (VDD3P3)
  • Max junction/storage temperature: -40 to +150 °C

Key Specs:

  • CPU: Xtensa dual-core 32-bit LX7 microprocessor, up to 240 MHz
  • Internal Memory: 512 KB SRAM, 384 KB ROM, 16 KB SRAM in RTC
  • Wi-Fi Data Rate: Up to 150 Mbps (1T1R mode)
  • Bluetooth LE Speeds: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
  • Programmable GPIOs: 45
  • Analog-to-Digital Converters: 2 × 12-bit SAR ADCs, up to 20 channels
  • Digital Interfaces: 4 × SPI, 3 × UART, 2 × I2C, 2 × I2S, 1 × USB OTG (full-speed), 1 × TWAI (CAN)
  • CoreMark Score: 1 core at 240 MHz: 613.86 CoreMark; 2 cores at 240 MHz: 1181.60 CoreMark

Features:

  • Integrated 2.4 GHz Wi-Fi (IEEE 802.11b/g/n) and Bluetooth LE 5
  • Xtensa 32-bit LX7 dual-core processor with FPU and SIMD instructions
  • Multiple low-power modes with ULP coprocessors (RISC-V and FSM)
  • Hardware cryptographic accelerators (AES-128/256, Hash, RSA, HMAC, digital signature)
  • Rich set of peripheral interfaces including USB OTG, CAN, LCD, Camera

Applications:

  • Smart Home (Light control, Smart button, Smart plug)
  • Industrial Automation (Industrial robot, Mesh network, HMI)
  • Health Care (Health monitor, Baby monitor)
  • Consumer Electronics (Smart watch, OTT devices, Wi-Fi/Bluetooth speaker)
  • Generic Low-power IoT Sensor Hubs and Data Loggers

Package:

  • QFN56 (7×7 mm)

Features

  • Support for RV32IMC instruction set
  • Thirty-two 32-bit general-purpose registers
  • 32-bit multiplier and divider
  • Support for interrupts
  • Booted by the CPU, its dedicated timer, or RTC GPIO

Applications

With low power consumption, ESP32-S3 is an ideal choice for IoT devices in the following areas:

  • Smart Home
  • -Light control
  • -Smart button
  • -Smart plug
  • Industrial Automation
  • -Industrial robot
  • -Mesh network
  • -Human machine interface (HMI)
  • Health Care
  • -Health monitor
  • Analog interfaces:
  • -2 × 12-bit SAR ADCs, up to 20 channels
  • -1 × temperature sensor
  • -14 × touch sensing IOs
  • Timers:
  • -4 × 54-bit general-purpose timers
  • -1 × 52-bit system timer
  • -3 × watchdog timers

Pin Configuration

ESP32-WROOM-32E Pinout

Pin NumberPin NameTypeFunction
1GNDPGround
23V3PPower supply
3ENIChip-enable signal. Active high.
4SENSOR_VPIGPIO36, SENSOR_VP, ADC_H, ADC1_CH0, RTC_GPIO0
5SENSOR_VNIGPIO39, SENSOR_VN, ADC1_CH3, ADC_H, RTC_GPIO3
6IO34IGPIO34, ADC1_CH6, RTC_GPIO4
7IO35IGPIO35, ADC1_CH7, RTC_GPIO5
8IO32I/OGPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9
9IO33I/OGPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8
10IO25I/OGPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
11IO26I/OGPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
12IO27I/OGPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
13IO14I/OGPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2
14IO12I/OGPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3
15GNDPGround
16IO13I/OGPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER
17SHD/SD2I/OGPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
18SWP/SD3I/OGPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
19SCS/CMDI/OGPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
20SCK/CLKI/OGPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
21SDO/SD0I/OGPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
22SDI/SD1I/OGPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
23IO15I/OGPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3
24IO2I/OGPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0
25IO0I/OGPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
26IO4I/OGPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER
27IO16I/OGPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
28IO17I/OGPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
29IO5I/OGPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
30IO18I/OGPIO18, VSPICLK, HS1_DATA7
31IO19I/OGPIO19, VSPIQ, U0CTS, EMAC_TXD0
32NCNo Connect
33IO21I/OGPIO21, VSPIHD, EMAC_TX_EN
34RXD0I/OGPIO3, U0RXD, CLK_OUT2
35TXD0I/OGPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
36IO22I/OGPIO22, VSPIWP, U0RTS, EMAC_TXD1
37IO23I/OGPIO23, VSPID, HS1_STROBE
38GNDPGround

Notes

  • SPI Flash Pins (GPIO6–GPIO11): Pins 20–22 and 17–19 (SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3, SCS/CMD) are connected to the integrated SPI flash and are not recommended for other uses.
  • Pin 32 (NC): No Connect pin; reserved.
  • Total pins: 38 (18.0 × 25.5 × 3.1 mm module package).

Electrical Characteristics

Table 17: DC Characteristics (3.3 V, 25 °C)

SymbolParameterMinTypMaxUnit
C INPin capacitance-2-pF
V IHHigh-level input voltage0.75 × VDD 1-VDD 1 + 0.3V
V ILLow-level input voltage-0.3-0.25 × VDD 1V
I IHHigh-level input current--50nA
I ILLow-level input current--50nA
V OH 2High-level output voltage0.8 × VDD 1--V
V OL 2Low-level output voltage--0.1 × VDD 1V
I OHHigh-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3)-40-mA
I OLLow-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3)-28-mA
R PUInternal weak pull-up resistor-45-k Ω
R PDInternal weak pull-down resistor-45-k Ω
V IH _ nRSTChip reset release voltage (CHIP_PU voltage is within the specified range)0.75 × VDD 1-VDD 1 + 0.3V
V IL _ nRSTChip reset voltage (CHIP_PU voltage is within the specified range)-0.3-0.25 × VDD 1V

Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device.

Table 14: Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU, VDD_SPIVoltage applied to power supply pins per power domain-0.33.6V
I output *Cumulative IO output current-1500mA
T STOREStorage temperature-40150°C

Recommended Operating Conditions

Table 15: Recommended Operating Conditions

SymbolParameterParameterMinTypMaxUnit
VDDA, VDD3P3 VDD3P3_RTCVoltage applied to power supply pins per power domainVoltage applied to power supply pins per power domain33.33.6V
VDD_SPI (working as input power supply) 1--1.83.33.6V
VDD3P3_CPU 2, 3Voltage applied to power supply pinVoltage applied to power supply pin33.33.6V
I VDD 4Current delivered by external power supplyCurrent delivered by external power supply0.5--A
T AAmbient temperatureESP32-S3-40-105°C
T AAmbient temperatureESP32-S3FN8-40-85°C
T AAmbient temperatureESP32-S3R2-40-85°C
T AAmbient temperatureESP32-S3R8-40-65°C
T AAmbient temperatureESP32-S3R8V-40-65°C

Package Information

Figure 8: QFN56 (7×7 mm) Package

Table 38: Receiver Characteristics ­ Bluetooth LE 500 Kbps

  • The pins of the chip are numbered in an anti-clockwise direction from Pin 1 in the top view.
  • For information about tape, reel, and product marking, please refer to Espressif Chip-Packing Information .

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
ESP32-S3Espressif Systems56-VFQFN Exposed Pad
ESP32-S3FH4R2Espressif Systems56-VFQFN Exposed Pad
ESP32-S3FN8Espressif Systems56-VFQFN Exposed Pad
ESP32-S3R2Espressif SystemsQFN56
ESP32-S3R8Espressif Systems56-VFQFN Exposed Pad
ESP32-S3R8VEspressif SystemsQFN56
ESP32S3Espressif Systems
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