ESP32S3
The ESP32S3 is an electronic component from Espressif Systems. View the full ESP32S3 datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Espressif Systems
Category
RF / WirelessOverview
Part: ESP32-S3 Series, Espressif Type: Low-power MCU-based System-on-Chip (SoC) Description: ESP32-S3 is a low-power MCU-based system-on-chip (SoC) that supports 2.4 GHz Wi-Fi and Bluetooth Low Energy, featuring a dual-core Xtensa 32-bit LX7 processor up to 240 MHz, 512 KB SRAM, and 384 KB ROM.
Operating Conditions:
- Supply voltage: 3.0–3.6 V (VDD3P3)
- Operating temperature: -40 to +105 °C
- Max CPU clock frequency: 240 MHz
- Wi-Fi standard: IEEE 802.11b/g/n (2.4 GHz)
- Bluetooth standard: Bluetooth LE 5
Absolute Maximum Ratings:
- Max supply voltage: -0.3 to 3.9 V (VDD3P3)
- Max junction/storage temperature: -40 to +150 °C
Key Specs:
- CPU: Xtensa dual-core 32-bit LX7 microprocessor, up to 240 MHz
- Internal Memory: 512 KB SRAM, 384 KB ROM, 16 KB SRAM in RTC
- Wi-Fi Data Rate: Up to 150 Mbps (1T1R mode)
- Bluetooth LE Speeds: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
- Programmable GPIOs: 45
- Analog-to-Digital Converters: 2 × 12-bit SAR ADCs, up to 20 channels
- Digital Interfaces: 4 × SPI, 3 × UART, 2 × I2C, 2 × I2S, 1 × USB OTG (full-speed), 1 × TWAI (CAN)
- CoreMark Score: 1 core at 240 MHz: 613.86 CoreMark; 2 cores at 240 MHz: 1181.60 CoreMark
Features:
- Integrated 2.4 GHz Wi-Fi (IEEE 802.11b/g/n) and Bluetooth LE 5
- Xtensa 32-bit LX7 dual-core processor with FPU and SIMD instructions
- Multiple low-power modes with ULP coprocessors (RISC-V and FSM)
- Hardware cryptographic accelerators (AES-128/256, Hash, RSA, HMAC, digital signature)
- Rich set of peripheral interfaces including USB OTG, CAN, LCD, Camera
Applications:
- Smart Home (Light control, Smart button, Smart plug)
- Industrial Automation (Industrial robot, Mesh network, HMI)
- Health Care (Health monitor, Baby monitor)
- Consumer Electronics (Smart watch, OTT devices, Wi-Fi/Bluetooth speaker)
- Generic Low-power IoT Sensor Hubs and Data Loggers
Package:
- QFN56 (7×7 mm)
Features
- Support for RV32IMC instruction set
- Thirty-two 32-bit general-purpose registers
- 32-bit multiplier and divider
- Support for interrupts
- Booted by the CPU, its dedicated timer, or RTC GPIO
Applications
With low power consumption, ESP32-S3 is an ideal choice for IoT devices in the following areas:
- Smart Home
- -Light control
- -Smart button
- -Smart plug
- Industrial Automation
- -Industrial robot
- -Mesh network
- -Human machine interface (HMI)
- Health Care
- -Health monitor
- Analog interfaces:
- -2 × 12-bit SAR ADCs, up to 20 channels
- -1 × temperature sensor
- -14 × touch sensing IOs
- Timers:
- -4 × 54-bit general-purpose timers
- -1 × 52-bit system timer
- -3 × watchdog timers
Pin Configuration
Table 2: Pin Description
| Name | No. | Type | Power Domain | Function | Function | Function | Function | Function | Function |
|---|---|---|---|---|---|---|---|---|---|
| LNA_IN | 1 | I/O | - | Low Noise Amplifier (RF LNA) input and output signal | Low Noise Amplifier (RF LNA) input and output signal | Low Noise Amplifier (RF LNA) input and output signal | Low Noise Amplifier (RF LNA) input and output signal | Low Noise Amplifier (RF LNA) input and output signal | Low Noise Amplifier (RF LNA) input and output signal |
| VDD3P3 | 2 | P A | - | Analog power supply | Analog power supply | Analog power supply | Analog power supply | Analog power supply | Analog power supply |
| VDD3P3 | 3 | P A | - | Analog power supply | Analog power supply | Analog power supply | Analog power supply | Analog power supply | Analog power supply |
| CHIP_PU | 4 | I | VDD3P3_RTC | High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the CHIP_PU pin floating. | High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the CHIP_PU pin floating. | High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the CHIP_PU pin floating. | High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the CHIP_PU pin floating. | High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the CHIP_PU pin floating. | High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the CHIP_PU pin floating. |
| GPIO0 | 5 | I/O/T | VDD3P3_RTC | RTC_GPIO0, | GPIO0 | GPIO0 | GPIO0 | GPIO0 | GPIO0 |
| GPIO1 | 6 | I/O/T | VDD3P3_RTC | RTC_GPIO1, | GPIO1 , | TOUCH1, | ADC1_CH0 | ||
| GPIO2 | 7 | I/O/T | VDD3P3_RTC | RTC_GPIO2, | GPIO2 , | TOUCH2, | ADC1_CH1 | ||
| GPIO3 | 8 | I/O/T | VDD3P3_RTC | RTC_GPIO3, | GPIO3 , | TOUCH3, | ADC1_CH2 | ||
| GPIO4 | 9 | I/O/T | VDD3P3_RTC | RTC_GPIO4, | GPIO4 , | TOUCH4, | ADC1_CH3 | ||
| GPIO5 | 10 | I/O/T | VDD3P3_RTC | RTC_GPIO5, | GPIO5 , | TOUCH5, | ADC1_CH4 | ||
| GPIO6 | 11 | I/O/T | VDD3P3_RTC | RTC_GPIO6, | GPIO6 , | TOUCH6, | ADC1_CH5 | ||
| GPIO7 | 12 | I/O/T | VDD3P3_RTC | RTC_GPIO7, | GPIO7 , | TOUCH7, | ADC1_CH6 | ||
| GPIO8 | 13 | I/O/T | VDD3P3_RTC | RTC_GPIO8, | GPIO8 , | TOUCH8, | ADC1_CH7, SUBSPICS1 | ||
| GPIO9 | 14 | I/O/T | VDD3P3_RTC | RTC_GPIO9, | GPIO9 , | TOUCH9, | ADC1_CH8, SUBSPIHD, | FSPIHD | FSPIHD |
| GPIO10 | 15 | I/O/T | VDD3P3_RTC | RTC_GPIO10, | GPIO10 , | TOUCH10, | ADC1_CH9, FSPIIO4, | SUBSPICS0, | FSPICS0 |
| GPIO11 | 16 | I/O/T | VDD3P3_RTC | RTC_GPIO11, | GPIO11 , | TOUCH11, | ADC2_CH0, FSPIIO5, | SUBSPID, | FSPID |
| GPIO12 | 17 | I/O/T | VDD3P3_RTC | RTC_GPIO12, | GPIO12 , | TOUCH12, | ADC2_CH1, FSPIIO6, | SUBSPICLK, | FSPICLK |
| GPIO13 | 18 | I/O/T | VDD3P3_RTC | RTC_GPIO13, | GPIO13 , | TOUCH13, | ADC2_CH2, FSPIIO7, | SUBSPIQ, | FSPIQ |
| GPIO14 | 19 | I/O/T | VDD3P3_RTC | RTC_GPIO14, | GPIO14 , | TOUCH14, | ADC2_CH3, FSPIDQS, | SUBSPIWP, | FSPIWP |
| VDD3P3_RTC | 20 | P A | - | Analog power supply | Analog power supply | Analog power supply | Analog power supply | Analog power supply | Analog power supply |
| XTAL_32K_P | 21 | I/O/T | VDD3P3_RTC | RTC_GPIO15, | GPIO15 , | U0RTS, | ADC2_CH4, XTAL_32K_P | ||
| XTAL_32K_N | 22 | I/O/T | VDD3P3_RTC | RTC_GPIO16, | GPIO16 , | U0CTS, | ADC2_CH5, XTAL_32K_N | ||
| GPIO17 | 23 | I/O/T | VDD3P3_RTC | RTC_GPIO17, | GPIO17 , | U1TXD, | ADC2_CH6 | ||
| GPIO18 | 24 | I/O/T | VDD3P3_RTC | RTC_GPIO18, | GPIO18 , | U1RXD, | ADC2_CH7, CLK_OUT3 |
| Name | No. | Type | Power Domain | Function |
|---|---|---|---|---|
| GPIO19 | 25 | I/O/T | VDD3P3_RTC | RTC_GPIO19, |
| GPIO20 | 26 | I/O/T | VDD3P3_RTC | RTC_GPIO20, |
| GPIO21 | 27 | I/O/T | VDD3P3_RTC | RTC_GPIO21, |
| SPICS1 | 28 | I/O/T | VDD_SPI | SPICS1, |
| VDD_SPI | 29 | P D | - | Output power supply: 1.8 V or VDD3P3_RTC |
| SPIHD | 30 | I/O/T | VDD_SPI | SPIHD , |
| SPIWP | 31 | I/O/T | VDD_SPI | SPIWP , |
| SPICS0 | 32 | I/O/T | VDD_SPI | SPICS0 , |
| SPICLK | 33 | I/O/T | VDD_SPI | SPICLK , |
| SPIQ | 34 | I/O/T | VDD_SPI | SPIQ , |
| SPID | 35 | I/O/T | VDD_SPI | SPID , |
| SPICLK_N | 36 | I/O/T | VDD_SPI | SPICLK_N_DIFF, GPIO48 , |
| SPICLK_P | 37 | I/O/T | VDD_SPI | SPICLK_P_DIFF, GPIO47 , |
| GPIO33 | 38 | I/O/T | VDD3P3_CPU / VDD_SPI | SPIIO4, |
| GPIO34 | 39 | I/O/T | VDD3P3_CPU / VDD_SPI | SPIIO5, |
| GPIO35 | 40 | I/O/T | VDD3P3_CPU / VDD_SPI | SPIIO6, |
| GPIO36 | 41 | I/O/T | VDD3P3_CPU / VDD_SPI | SPIIO7, |
| GPIO37 | 42 | I/O/T | VDD3P3_CPU / VDD_SPI | SPIDQS, |
| GPIO38 | 43 | I/O/T | VDD3P3_CPU | GPIO38 , |
| MTCK | 44 | I/O/T | VDD3P3_CPU | MTCK , |
| MTDO | 45 | I/O/T | VDD3P3_CPU | MTDO , |
| VDD3P3_CPU | 46 | P D | - | Input power supply for CPU IO |
| MTDI | 47 | I/O/T | VDD3P3_CPU | MTDI , |
| MTMS | 48 | I/O/T | VDD3P3_CPU | MTMS , |
| U0TXD | 49 | I/O/T | VDD3P3_CPU | U0TXD , |
| U0RXD | 50 | I/O/T | VDD3P3_CPU | U0RXD , |
| GPIO45 | 51 | I/O/T | VDD3P3_CPU | GPIO45 |
| GPIO46 | 52 | I/O/T | VDD3P3_CPU | GPIO46 |
| XTAL_N | 53 | - | - | External crystal output |
15
| Name | No. | Type | Power Domain | Function |
|---|---|---|---|---|
| XTAL_P | 54 | - | - | External crystal input |
| VDDA1 | 55 | P A | - | Analog power supply |
| VDDA2 | 56 | P A | - | Analog power supply |
| GND | 57 | G | - | Ground |
Electrical Characteristics
Table 17: DC Characteristics (3.3 V, 25 °C)
| Symbol | Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| C IN | Pin capacitance | - | 2 | - | pF |
| V IH | High-level input voltage | 0.75 × VDD 1 | - | VDD 1 + 0.3 | V |
| V IL | Low-level input voltage | -0.3 | - | 0.25 × VDD 1 | V |
| I IH | High-level input current | - | - | 50 | nA |
| I IL | Low-level input current | - | - | 50 | nA |
| V OH 2 | High-level output voltage | 0.8 × VDD 1 | - | - | V |
| V OL 2 | Low-level output voltage | - | - | 0.1 × VDD 1 | V |
| I OH | High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3) | - | 40 | - | mA |
| I OL | Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3) | - | 28 | - | mA |
| R PU | Internal weak pull-up resistor | - | 45 | - | k Ω |
| R PD | Internal weak pull-down resistor | - | 45 | - | k Ω |
| V IH _ nRST | Chip reset release voltage (CHIP_PU voltage is within the specified range) | 0.75 × VDD 1 | - | VDD 1 + 0.3 | V |
| V IL _ nRST | Chip reset voltage (CHIP_PU voltage is within the specified range) | -0.3 | - | 0.25 × VDD 1 | V |
Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device.
Table 14: Absolute Maximum Ratings
| Symbol | Parameter | Min | Max | Unit |
|---|---|---|---|---|
| VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU, VDD_SPI | Voltage applied to power supply pins per power domain | -0.3 | 3.6 | V |
| I output * | Cumulative IO output current | - | 1500 | mA |
| T STORE | Storage temperature | -40 | 150 | °C |
Recommended Operating Conditions
Table 15: Recommended Operating Conditions
| Symbol | Parameter | Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| VDDA, VDD3P3 VDD3P3_RTC | Voltage applied to power supply pins per power domain | Voltage applied to power supply pins per power domain | 3 | 3.3 | 3.6 | V |
| VDD_SPI (working as input power supply) 1 | - | - | 1.8 | 3.3 | 3.6 | V |
| VDD3P3_CPU 2, 3 | Voltage applied to power supply pin | Voltage applied to power supply pin | 3 | 3.3 | 3.6 | V |
| I VDD 4 | Current delivered by external power supply | Current delivered by external power supply | 0.5 | - | - | A |
| T A | Ambient temperature | ESP32-S3 | -40 | - | 105 | °C |
| T A | Ambient temperature | ESP32-S3FN8 | -40 | - | 85 | °C |
| T A | Ambient temperature | ESP32-S3R2 | -40 | - | 85 | °C |
| T A | Ambient temperature | ESP32-S3R8 | -40 | - | 65 | °C |
| T A | Ambient temperature | ESP32-S3R8V | -40 | - | 65 | °C |
Package Information
Figure 8: QFN56 (7×7 mm) Package
Table 38: Receiver Characteristics Bluetooth LE 500 Kbps
- The pins of the chip are numbered in an anti-clockwise direction from Pin 1 in the top view.
- For information about tape, reel, and product marking, please refer to Espressif Chip-Packing Information .
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| ESP32 | Espressif Systems | ESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm) |
| ESP32-S3 | Espressif Systems | 56-VFQFN Exposed Pad |
| ESP32-S3FH4R2 | Espressif Systems | 56-VFQFN Exposed Pad |
| ESP32-S3FN8 | Espressif Systems | 56-VFQFN Exposed Pad |
| ESP32-S3R2 | Espressif Systems | QFN56 |
| ESP32-S3R8 | Espressif Systems | 56-VFQFN Exposed Pad |
| ESP32-S3R8V | Espressif Systems | QFN56 |
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