ESP32-S3

Part: ESP32-S3 Series, Espressif Type: Low-power MCU-based System-on-Chip (SoC) Description: ESP32-S3 is a low-power MCU-based system-on-chip (SoC) that supports 2.4 GHz Wi-Fi and Bluetooth Low Energy, featuring a dual-core Xtensa 32-bit LX7 processor up to 240 MHz, 512 KB SRAM, and 384 KB ROM.

Operating Conditions:

• Supply voltage: 3.0–3.6 V (VDD3P3)
• Operating temperature: -40 to +105 °C
• Max CPU clock frequency: 240 MHz
• Wi-Fi standard: IEEE 802.11b/g/n (2.4 GHz)
• Bluetooth standard: Bluetooth LE 5

Absolute Maximum Ratings:

• Max supply voltage: -0.3 to 3.9 V (VDD3P3)
• Max junction/storage temperature: -40 to +150 °C

Key Specs:

• CPU: Xtensa dual-core 32-bit LX7 microprocessor, up to 240 MHz
• Internal Memory: 512 KB SRAM, 384 KB ROM, 16 KB SRAM in RTC
• Wi-Fi Data Rate: Up to 150 Mbps (1T1R mode)
• Bluetooth LE Speeds: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
• Programmable GPIOs: 45
• Analog-to-Digital Converters: 2 × 12-bit SAR ADCs, up to 20 channels
• Digital Interfaces: 4 × SPI, 3 × UART, 2 × I2C, 2 × I2S, 1 × USB OTG (full-speed), 1 × TWAI (CAN)
• CoreMark Score: 1 core at 240 MHz: 613.86 CoreMark; 2 cores at 240 MHz: 1181.60 CoreMark

Features:

• Integrated 2.4 GHz Wi-Fi (IEEE 802.11b/g/n) and Bluetooth LE 5
• Xtensa 32-bit LX7 dual-core processor with FPU and SIMD instructions
• Multiple low-power modes with ULP coprocessors (RISC-V and FSM)
• Hardware cryptographic accelerators (AES-128/256, Hash, RSA, HMAC, digital signature)
• Rich set of peripheral interfaces including USB OTG, CAN, LCD, Camera

Applications:

• Smart Home (Light control, Smart button, Smart plug)
• Industrial Automation (Industrial robot, Mesh network, HMI)
• Health Care (Health monitor, Baby monitor)
• Consumer Electronics (Smart watch, OTT devices, Wi-Fi/Bluetooth speaker)
• Generic Low-power IoT Sensor Hubs and Data Loggers

Package:

• QFN56 (7×7 mm)

• Support for RV32IMC instruction set
• Thirty-two 32-bit general-purpose registers
• 32-bit multiplier and divider
• Support for interrupts
• Booted by the CPU, its dedicated timer, or RTC GPIO

With low power consumption, ESP32-S3 is an ideal choice for IoT devices in the following areas:

• Smart Home
• -Light control
• -Smart button
• -Smart plug
• Industrial Automation
• -Industrial robot
• -Mesh network
• -Human machine interface (HMI)
• Health Care
• -Health monitor
• Analog interfaces:
• -2 × 12-bit SAR ADCs, up to 20 channels
• -1 × temperature sensor
• -14 × touch sensing IOs
• Timers:
• -4 × 54-bit general-purpose timers
• -1 × 52-bit system timer
• -3 × watchdog timers

ESP32-S3-WROOM-1-N16 Pinout

Package: 56-VFQFN Exposed Pad

Notes

• Type abbreviations: I/O/T = Input/Output/Tri-state; PA = Power Analog; PD = Power Digital; G = Ground
• CHIP_PU pin (4): Must not be left floating; tie to VDD3P3_RTC for normal operation or to GND to power down the chip.
• RTC GPIO pins: GPIO0–GPIO21 and XTAL_32K_P/XTAL_32K_N can function as RTC GPIO pins in low-power modes.
• Touch-capable pins: GPIO1–GPIO14 support capacitive touch sensing (TOUCH1–TOUCH14).
• ADC pins: GPIO1–GPIO14 and XTAL_32K_P/XTAL_32K_N support analog-to-digital conversion.
• SPI pins: Multiple SPI interfaces are available (FSPI, SUBSPI, SPICS0/SPICS1, etc.).
• JTAG pins: MTCK, MTDO, MTDI, MTMS support JTAG debugging.
• UART pins: U0TXD/U0RXD (UART0) and GPIO17/GPIO18 (UART1) support serial communication.
• Crystal pins: XTAL_P and XTAL_N connect to an external 40 MHz crystal; XTAL_32K_P and XTAL_32K_N optionally connect to a 32 kHz crystal.
• Exposed pad (pin 57): The exposed pad on the bottom of the package is connected to GND.

Table 17: DC Characteristics (3.3 V, 25 °C)

Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device.

Table 14: Absolute Maximum Ratings

Table 15: Recommended Operating Conditions

Figure 8: QFN56 (7×7 mm) Package

Table 38: Receiver Characteristics ­ Bluetooth LE 500 Kbps

• The pins of the chip are numbered in an anti-clockwise direction from Pin 1 in the top view.
• For information about tape, reel, and product marking, please refer to Espressif Chip-Packing Information .