Skip to main content

ESP32-S3

Wireless SoC

The ESP32-S3 is a wireless soc from Espressif Systems. View the full ESP32-S3 datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.

Manufacturer

Espressif Systems

Package

QFN56

Lifecycle

Active

Key Specifications

ParameterValue
Data Rate (Max)150Mbps
Data Rate (Max)150Mbps
Data Rate (Max)150Mbps
Data Rate (Max)150Mbps
Data Rate (Max)150Mbps
Data Rate (Max)150Mbps
Data Rate (Max)150Mbps
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
Frequency2.412GHz ~ 2.484GHz
GPIO30
GPIO30
GPIO30
GPIO30
GPIO30
GPIO30
GPIO30
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 105°C
Package / Case56-VFQFN Exposed Pad
PackagingCut Tape
PackagingCut Tape
PackagingCut Tape
PackagingCut Tape
PackagingCut Tape
Power - Output21dBm
Power - Output21dBm
Power - Output21dBm
Power - Output21dBm
Power - Output21dBm
Power - Output21dBm
Power - Output21dBm
Protocol802.11b/g/n, Bluetooth v5.0
RF Family/StandardBluetooth, WiFi
RF Family/StandardBluetooth, WiFi
RF Family/StandardBluetooth, WiFi
RF Family/StandardBluetooth, WiFi
RF Family/StandardBluetooth, WiFi
RF Family/StandardBluetooth, WiFi
RF Family/StandardBluetooth, WiFi
Sensitivity-98.4dBm
Sensitivity-98.4dBm
Sensitivity-98.4dBm
Sensitivity-98.4dBm
Sensitivity-98.4dBm
Sensitivity-98.4dBm
Sensitivity-98.4dBm
Serial InterfacesI2C, I2S, SPI, UART, USB
Serial InterfacesI2C, I2S, SPI, UART, USB
Serial InterfacesI2C, I2S, SPI, UART, USB
Serial InterfacesI2C, I2S, SPI, UART, USB
Serial InterfacesI2C, I2S, SPI, UART, USB
Serial InterfacesI2C, I2S, SPI, UART, USB
Serial InterfacesI2C, I2S, SPI, UART, USB
Standard Pack Qty2000
Standard Pack Qty2000
Standard Pack Qty2000
Standard Pack Qty2000
Standard Pack Qty2000
Supplier Device Package56-QFN (7x7)
Supplier Device Package56-QFN (7x7)
Supplier Device Package56-QFN (7x7)
Supplier Device Package56-QFN (7x7)
Supplier Device Package56-QFN (7x7)
Supplier Device Package56-QFN (7x7)
Supplier Device Package56-QFN (7x7)
TypeTxRx + MCU
TypeTxRx + MCU
TypeTxRx + MCU
TypeTxRx + MCU
TypeTxRx + MCU
TypeTxRx + MCU
TypeTxRx + MCU
Supply Voltage3.3V

Overview

Part: ESP32-S3 Series, Espressif Type: Low-power MCU-based System-on-Chip (SoC) Description: ESP32-S3 is a low-power MCU-based system-on-chip (SoC) that supports 2.4 GHz Wi-Fi and Bluetooth Low Energy, featuring a dual-core Xtensa 32-bit LX7 processor up to 240 MHz, 512 KB SRAM, and 384 KB ROM.

Operating Conditions:

  • Supply voltage: 3.0–3.6 V (VDD3P3)
  • Operating temperature: -40 to +105 °C
  • Max CPU clock frequency: 240 MHz
  • Wi-Fi standard: IEEE 802.11b/g/n (2.4 GHz)
  • Bluetooth standard: Bluetooth LE 5

Absolute Maximum Ratings:

  • Max supply voltage: -0.3 to 3.9 V (VDD3P3)
  • Max junction/storage temperature: -40 to +150 °C

Key Specs:

  • CPU: Xtensa dual-core 32-bit LX7 microprocessor, up to 240 MHz
  • Internal Memory: 512 KB SRAM, 384 KB ROM, 16 KB SRAM in RTC
  • Wi-Fi Data Rate: Up to 150 Mbps (1T1R mode)
  • Bluetooth LE Speeds: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
  • Programmable GPIOs: 45
  • Analog-to-Digital Converters: 2 × 12-bit SAR ADCs, up to 20 channels
  • Digital Interfaces: 4 × SPI, 3 × UART, 2 × I2C, 2 × I2S, 1 × USB OTG (full-speed), 1 × TWAI (CAN)
  • CoreMark Score: 1 core at 240 MHz: 613.86 CoreMark; 2 cores at 240 MHz: 1181.60 CoreMark

Features:

  • Integrated 2.4 GHz Wi-Fi (IEEE 802.11b/g/n) and Bluetooth LE 5
  • Xtensa 32-bit LX7 dual-core processor with FPU and SIMD instructions
  • Multiple low-power modes with ULP coprocessors (RISC-V and FSM)
  • Hardware cryptographic accelerators (AES-128/256, Hash, RSA, HMAC, digital signature)
  • Rich set of peripheral interfaces including USB OTG, CAN, LCD, Camera

Applications:

  • Smart Home (Light control, Smart button, Smart plug)
  • Industrial Automation (Industrial robot, Mesh network, HMI)
  • Health Care (Health monitor, Baby monitor)
  • Consumer Electronics (Smart watch, OTT devices, Wi-Fi/Bluetooth speaker)
  • Generic Low-power IoT Sensor Hubs and Data Loggers

Package:

  • QFN56 (7×7 mm)

Features

  • Support for RV32IMC instruction set
  • Thirty-two 32-bit general-purpose registers
  • 32-bit multiplier and divider
  • Support for interrupts
  • Booted by the CPU, its dedicated timer, or RTC GPIO

Applications

With low power consumption, ESP32-S3 is an ideal choice for IoT devices in the following areas:

  • Smart Home
  • -Light control
  • -Smart button
  • -Smart plug
  • Industrial Automation
  • -Industrial robot
  • -Mesh network
  • -Human machine interface (HMI)
  • Health Care
  • -Health monitor
  • Analog interfaces:
  • -2 × 12-bit SAR ADCs, up to 20 channels
  • -1 × temperature sensor
  • -14 × touch sensing IOs
  • Timers:
  • -4 × 54-bit general-purpose timers
  • -1 × 52-bit system timer
  • -3 × watchdog timers

Pin Configuration

ESP32-S3-WROOM-1-N16 Pinout (56-VFQFN Exposed Pad)

Pin NumberPin NameTypePower DomainDescription
1LNA_INI/O-Low Noise Amplifier (RF LNA) input and output signal
2VDD3P3PA-Analog power supply
3VDD3P3PA-Analog power supply
4CHIP_PUIVDD3P3_RTCHigh: on, enables the chip. Low: off, the chip powers off. Do not leave floating.
5GPIO0I/O/TVDD3P3_RTCRTC_GPIO0
6GPIO1I/O/TVDD3P3_RTCRTC_GPIO1, TOUCH1, ADC1_CH0
7GPIO2I/O/TVDD3P3_RTCRTC_GPIO2, TOUCH2, ADC1_CH1
8GPIO3I/O/TVDD3P3_RTCRTC_GPIO3, TOUCH3, ADC1_CH2
9GPIO4I/O/TVDD3P3_RTCRTC_GPIO4, TOUCH4, ADC1_CH3
10GPIO5I/O/TVDD3P3_RTCRTC_GPIO5, TOUCH5, ADC1_CH4
11GPIO6I/O/TVDD3P3_RTCRTC_GPIO6, TOUCH6, ADC1_CH5
12GPIO7I/O/TVDD3P3_RTCRTC_GPIO7, TOUCH7, ADC1_CH6
13GPIO8I/O/TVDD3P3_RTCRTC_GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1
14GPIO9I/O/TVDD3P3_RTCRTC_GPIO9, TOUCH9, ADC1_CH8, SUBSPIHD, FSPIHD
15GPIO10I/O/TVDD3P3_RTCRTC_GPIO10, TOUCH10, ADC1_CH9, FSPIIO4, SUBSPICS0, FSPICS0
16GPIO11I/O/TVDD3P3_RTCRTC_GPIO11, TOUCH11, ADC2_CH0, FSPIIO5, SUBSPID, FSPID
17GPIO12I/O/TVDD3P3_RTCRTC_GPIO12, TOUCH12, ADC2_CH1, FSPIIO6, SUBSPICLK, FSPICLK
18GPIO13I/O/TVDD3P3_RTCRTC_GPIO13, TOUCH13, ADC2_CH2, FSPIIO7, SUBSPIQ, FSPIQ
19GPIO14I/O/TVDD3P3_RTCRTC_GPIO14, TOUCH14, ADC2_CH3, FSPIDQS, SUBSPIWP, FSPIWP
20VDD3P3_RTCPA-Analog power supply
21XTAL_32K_PI/O/TVDD3P3_RTCRTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
22XTAL_32K_NI/O/TVDD3P3_RTCRTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
23GPIO17I/O/TVDD3P3_RTCRTC_GPIO17, GPIO17, U1TXD, ADC2_CH6
24GPIO18I/O/TVDD3P3_RTCRTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3
25GPIO19I/O/TVDD3P3_RTCRTC_GPIO19
26GPIO20I/O/TVDD3P3_RTCRTC_GPIO20
27GPIO21I/O/TVDD3P3_RTCRTC_GPIO21
28SPICS1I/O/TVDD_SPISPICS1
29VDD_SPIPD-Output power supply: 1.8 V or VDD3P3_RTC
30SPIHDI/O/TVDD_SPISPIHD
31SPIWPI/O/TVDD_SPISPIWP
32SPICS0I/O/TVDD_SPISPICS0
33SPICLKI/O/TVDD_SPISPICLK
34SPIQI/O/TVDD_SPISPIQ
35SPIDI/O/TVDD_SPISPID
36SPICLK_NI/O/TVDD_SPISPICLK_N_DIFF, GPIO48
37SPICLK_PI/O/TVDD_SPISPICLK_P_DIFF, GPIO47
38GPIO33I/O/TVDD3P3_CPU / VDD_SPISPIIO4
39GPIO34I/O/TVDD3P3_CPU / VDD_SPISPIIO5
40GPIO35I/O/TVDD3P3_CPU / VDD_SPISPIIO6
41GPIO36I/O/TVDD3P3_CPU / VDD_SPISPIIO7
42GPIO37I/O/TVDD3P3_CPU / VDD_SPISPIDQS
43GPIO38I/O/TVDD3P3_CPUGPIO38
44MTCKI/O/TVDD3P3_CPUMTCK
45MTDOI/O/TVDD3P3_CPUMTDO
46VDD3P3_CPUPD-Input power supply for CPU IO
47MTDII/O/TVDD3P3_CPUMTDI
48MTMSI/O/TVDD3P3_CPUMTMS
49U0TXDI/O/TVDD3P3_CPUU0TXD
50U0RXDI/O/TVDD3P3_CPUU0RXD
51GPIO45I/O/TVDD3P3_CPUGPIO45
52GPIO46I/O/TVDD3P3_CPUGPIO46
53XTAL_N--External crystal output
54XTAL_P--External crystal input
55VDDA1PA-Analog power supply
56VDDA2PA-Analog power supply
57GNDG-Ground

Notes

  • Pin numbers extracted directly from the "No." column in the datasheet pin description table.
  • Type abbreviations: I/O/T = Input/Output/Touchpad capable; PA = Power Analog; PD = Power Digital; G = Ground; I = Input.
  • GPIO1–GPIO14 and GPIO17–GPIO21 support capacitive touch sensing (TOUCH0–TOUCH14).
  • GPIO1–GPIO14, GPIO17–GPIO18 support ADC1 and ADC2 channels.
  • MTCK, MTDO, MTDI, MTMS are JTAG pins.
  • U0TXD/U0RXD are UART0 pins; U1TXD/U1RXD are UART1 pins (on GPIO17/GPIO18).
  • SPI pins (SPICS0, SPIHD, SPIWP, SPICLK, SPIQ, SPID) are for internal flash/PSRAM.
  • FSPI pins (GPIO9–GPIO14, GPIO33–GPIO37) support flexible SPI for external flash/PSRAM.
  • CHIP_PU must not be left floating; pull high to enable the chip.

Electrical Characteristics

Table 17: DC Characteristics (3.3 V, 25 °C)

SymbolParameterMinTypMaxUnit
C INPin capacitance-2-pF
V IHHigh-level input voltage0.75 × VDD 1-VDD 1 + 0.3V
V ILLow-level input voltage-0.3-0.25 × VDD 1V
I IHHigh-level input current--50nA
I ILLow-level input current--50nA
V OH 2High-level output voltage0.8 × VDD 1--V
V OL 2Low-level output voltage--0.1 × VDD 1V
I OHHigh-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3)-40-mA
I OLLow-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3)-28-mA
R PUInternal weak pull-up resistor-45-k Ω
R PDInternal weak pull-down resistor-45-k Ω
V IH _ nRSTChip reset release voltage (CHIP_PU voltage is within the specified range)0.75 × VDD 1-VDD 1 + 0.3V
V IL _ nRSTChip reset voltage (CHIP_PU voltage is within the specified range)-0.3-0.25 × VDD 1V

Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device.

Table 14: Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU, VDD_SPIVoltage applied to power supply pins per power domain-0.33.6V
I output *Cumulative IO output current-1500mA
T STOREStorage temperature-40150°C

Recommended Operating Conditions

Table 15: Recommended Operating Conditions

SymbolParameterParameterMinTypMaxUnit
VDDA, VDD3P3 VDD3P3_RTCVoltage applied to power supply pins per power domainVoltage applied to power supply pins per power domain33.33.6V
VDD_SPI (working as input power supply) 1--1.83.33.6V
VDD3P3_CPU 2, 3Voltage applied to power supply pinVoltage applied to power supply pin33.33.6V
I VDD 4Current delivered by external power supplyCurrent delivered by external power supply0.5--A
T AAmbient temperatureESP32-S3-40-105°C
T AAmbient temperatureESP32-S3FN8-40-85°C
T AAmbient temperatureESP32-S3R2-40-85°C
T AAmbient temperatureESP32-S3R8-40-65°C
T AAmbient temperatureESP32-S3R8V-40-65°C

Package Information

Figure 8: QFN56 (7×7 mm) Package

Table 38: Receiver Characteristics ­ Bluetooth LE 500 Kbps

  • The pins of the chip are numbered in an anti-clockwise direction from Pin 1 in the top view.
  • For information about tape, reel, and product marking, please refer to Espressif Chip-Packing Information .

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
ESP32Espressif SystemsESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm)
ESP32-S3FH4R2Espressif Systems56-VFQFN Exposed Pad
ESP32-S3FN8Espressif Systems56-VFQFN Exposed Pad
ESP32-S3R2Espressif SystemsQFN56
ESP32-S3R8Espressif Systems56-VFQFN Exposed Pad
ESP32-S3R8VEspressif SystemsQFN56
ESP32S3Espressif Systems
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

Get structured datasheet data via API

Get started free