CC1101
RF TransceiverThe CC1101 is a rf transceiver from Texas Instruments. View the full CC1101 datasheet below including pinout, electrical characteristics, absolute maximum ratings.
Manufacturer
Texas Instruments
Category
RF / WirelessOverview
Part: CC1101
Type: Low-Power Sub-1 GHz RF Transceiver
Description: CC1101 is a low-cost sub-1 GHz RF transceiver designed for very low-power wireless applications, supporting frequency bands from 300-348 MHz, 387-464 MHz, and 779-928 MHz, with a configurable data rate up to 600 kbps and programmable output power up to +12 dBm.
Operating Conditions:
Absolute Maximum Ratings:
Key Specs:
- RX Sensitivity: -116 dBm at 0.6 kBaud, 433 MHz, 1% packet error rate
- RX Sensitivity: -112 dBm at 1.2 kBaud, 868 MHz, 1% packet error rate
- RX Current Consumption: 14.7 mA (1.2 kBaud, 868 MHz)
- Programmable Output Power: up to +12 dBm
- Programmable Data Rate: 0.6 to 600 kbps
- Frequency Bands: 300-348 MHz, 387-464 MHz, 779-928 MHz
- Sleep Mode Current Consumption: 200 nA
- Startup Time (sleep to RX or TX mode): 240 μs
- Frequency Synthesizer Settling Time: 75 μs
Features:
- High sensitivity
- Low current consumption
- Programmable output power
- Supports 2-FSK, 4-FSK, GFSK, MSK, OOK, and flexible ASK modulation formats
- Fast settling frequency synthesizer
- Automatic Frequency Compensation (AFC)
- Integrated analog temperature sensor
- Flexible packet handling with on-chip support for sync word detection, address check, flexible packet length, and automatic CRC
- Efficient SPI interface
- Digital RSSI output
- Wake-on-radio functionality
- Separate 64-byte RX and TX data FIFOs
- Small QLP 4x4 mm package, 20 pins
Applications:
- Ultra low-power wireless applications operating in the 315/433/868/915 MHz ISM/SRD bands
- Wireless alarm and security systems
- Industrial monitoring and control
- Wireless sensor networks
- AMR - Automatic Meter Reading
- Home and building automation
- Wireless MBUS
Package:
- QLP 4x4 mm package, 20 pins
Features
- 2-FSK, 4-FSK, GFSK, and MSK supported as well as OOK and flexible ASK shaping
- Suitable for frequency hopping systems due to a fast settling frequency synthesizer; 75 μs settling time
- Automatic Frequency Compensation (AFC) can be used to align the frequency synthesizer to the received signal centre frequency
- Integrated analog temperature sensor
Applications
- Ultra low-power wireless applications operating in the 315/433/868/915 MHz ISM/SRD bands
- Wireless alarm and security systems
- Industrial monitoring and control
Pin Configuration
CC1101 Pinout
Package: 20-pin QFN (0.4 mm pitch)
| Pin # | Pin Name | Pin Type | Description |
|---|---|---|---|
| 1 | SCLK | Digital Input | Serial configuration interface, clock input |
| 2 | SO (GDO1) | Digital Output | Serial configuration interface, data output; optional general output pin when CSn is high |
| 3 | GDO2 | Digital Output | Digital output pin: test signals, FIFO status, clear channel indicator, clock output (down-divided from XOSC) |
| 4 | DVDD | Power (Digital) | 1.8–3.6 V digital power supply for digital I/O and digital core voltage regulator |
| 5 | DCOUPL | Power (Digital) | 1.6–2.0 V digital power supply output for decoupling (CC1101 only) |
| 6 | GDO0 (ATEST) | Digital I/O | Digital output: test signals, FIFO status, clear channel indicator, clock output, RX data; digital input: TX data; analog test I/O |
| 7 | CSn | Digital Input | Serial configuration interface, chip select |
| 8 | XOSC_Q1 | Analog I/O | Crystal oscillator pin 1 or external clock input |
| 9 | AVDD | Power (Analog) | 1.8–3.6 V analog power supply |
| 10 | XOSC_Q2 | Analog I/O | Crystal oscillator pin 2 |
| 11 | AVDD | Power (Analog) | 1.8–3.6 V analog power supply |
| 12 | RF_P | RF I/O | Positive RF input (RX LNA) / positive RF output (TX PA) |
| 13 | RF_N | RF I/O | Negative RF input (RX LNA) / negative RF output (TX PA) |
| 14 | AVDD | Power (Analog) | 1.8–3.6 V analog power supply |
| 15 | AVDD | Power (Analog) | 1.8–3.6 V analog power supply |
| 16 | GND | Ground (Analog) | Analog ground |
| 17 | RBIAS | Analog I/O | External bias resistor for reference current |
| 18 | DGUARD | Power (Digital) | Power supply for digital noise isolation |
| 19 | GND | Ground (Digital) | Digital ground for noise isolation |
| 20 | SI | Digital Input | Serial configuration interface, data input |
Notes
- Exposed die attach pad: Must be connected to solid ground plane (main ground connection for the chip).
- DCOUPL pin: Output only; intended for CC1101 decoupling only—cannot supply other devices.
- Multiple AVDD pins (9, 11, 14, 15): All must be connected to 1.8–3.6 V analog supply.
- SPI interface: SCLK (1), SI (20), SO (2), CSn (7).
- General-purpose outputs: GDO0 (6), GDO1/SO (2), GDO2 (3) can be configured for various functions.
Electrical Characteristics
TA = 25 C if nothing else stated.
Table 17: DC Characteristics
| Digital Inputs/Outputs | Min | Max | Unit | Condition |
|---|---|---|---|---|
| Logic "0" input voltage | 0 | 0.7 | V | |
| Logic "1" input voltage | VDD-0.7 | VDD | V | |
| Logic "0" output voltage | 0 | 0.5 | V | For up to 4 mA output current |
| Logic "1" output voltage | VDD-0.3 | VDD | V | For up to 4 mA output current |
| Logic "0" input current | N/A | -50 | nA | Input equals 0V |
| Logic "1" input current | N/A | 50 | nA | Input equals VDD |
Absolute Maximum Ratings
Under no circumstances must the absolute maximum ratings given in Table 1 be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device.
Table 1: Absolute Maximum Ratings
| Parameter | Min | Max | Units | Condition |
|---|---|---|---|---|
| Supply voltage | -0.3 | 3.9 | V | All supply pins must have the same voltage |
| Voltage on any digital pin | -0.3 | VDD + 0.3, max 3.9 | V | |
| Voltage on the pins RF_P, RF_N, DCOUPL, RBIAS | -0.3 | 2.0 | V | |
| Voltage ramp-up rate | 120 | kV/μs | ||
| Input RF level | +10 | dBm | ||
| Storage temperature range | -50 | 150 | C | |
| Solder reflow temperature | 260 | C | According to IPC/JEDEC J-STD-020 | |
| ESD | 750 | V | According to JEDEC STD 22, method A114, Human Body Model (HBM) | |
| ESD | 400 | V | According to JEDEC STD 22, C101C, Charged Device Model (CDM) |
Caution! ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage.
Table 1: Absolute Maximum Ratings
Typical Application
Only a few external components are required for using the CC1101 . The recommended application circuits for CC1101 are shown in Figure 10 and
Figure 11. The external components are described in Table 20, and typical values are given in Table 21.
The 315 MHz and 433 MHz CC1101EM reference design [1] use inexpensive multilayer inductors. The 868 MHz and 915 MHz CC1101EM reference design [2] use wire-
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| CC1101-Q1 | Texas Instruments | — |
| CC1101DK | Texas Instruments | — |
| CC1101DK433 | Texas Instruments | — |
| CC1101DK868 | Texas Instruments | — |
| CC1101DK868-915 | Texas Instruments | — |
| CC1101EM | Texas Instruments | — |
| CC1101EMK433 | Texas Instruments | — |
| CC1101EMK868 | Texas Instruments | — |
| CC1101RGP | Texas Instruments | 20-VFQFN Exposed Pad |
| CC1101RGP.B | Texas Instruments | — |
| CC1101RGPR | Texas Instruments | 20-VFQFN Exposed Pad |
| CC1101RGPR.A | Texas Instruments | — |
| CC1101RGPR.B | Texas Instruments | — |
| CC1101RGPRG4 | Texas Instruments | — |
| CC1101RGPT | Texas Instruments | 20-VFQFN Exposed Pad |
| CC1101RGPT.B | Texas Instruments | — |
| CC1101RTKR | — | — |
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