SX1276
Low Power Long Range TransceiverThe SX1276 is a low power long range transceiver from Semtech. View the full SX1276 datasheet below including key specifications, pinout, absolute maximum ratings.
Official SX1276 datasheet (PDF) — the source this page was extracted from.
SX1276 Key Specifications
| Parameter | Value |
|---|---|
| IIP3 | -11 dBm |
| Interface | SPI |
| Modulation | FSK, GFSK, MSK, GMSK, LoRa, OOK |
| RX Current | 9.9 mA |
| Sensitivity | down to -148 dBm |
| Packet Engine | up to 256 bytes with CRC |
| Frequency Range | 137 MHz to 1020 MHz |
| Max Output Power | +20 dBm |
| RSSI Dynamic Range | 127 dB |
| Maximum Link Budget | 168 dB |
| Operating Temperature | -40°C to +85°C |
| Programmable Bit Rate | up to 300 kbps |
| Synthesizer Resolution | 61 Hz |
| High Efficiency PA Output | +14 dBm |
| Register Retention Current | 200 nA |
SX1276 Overview
Part: SX1276/77/78/79 — Semtech
Type: Sub-GHz LoRa / FSK / OOK Transceiver
Description: 137–1020 MHz low-power long-range transceiver with LoRa modem, sensitivity down to -148 dBm, +20 dBm PA, 168 dB maximum link budget and bit rates up to 300 kbps.
Operating Conditions:
- Supply voltage: -0.5 to 3.9 V is the absolute maximum; the recommended operating-range table is not included in the provided text
- Operating temperature: -40 to +85 °C (QFN 28 package operating range)
- Frequency range: 137–1020 MHz
- Programmable bit rate: up to 300 kbps
Absolute Maximum Ratings:
- Max supply voltage (VDDmr): 3.9 V (min -0.5 V)
- Max junction temperature (Tj): +125 °C
- Temperature (Tmr): -55 to +115 °C
- Max RF input level: +10 dBm
Key Specs:
- Receiver sensitivity: down to -148 dBm (LoRa)
- Maximum link budget: 168 dB
- RX current: 9.9 mA; register retention 200 nA
- Maximum RF output: +20 dBm (100 mW), constant vs. supply voltage
- High-efficiency PA: +14 dBm
- Input IP3: -11 dBm
- RSSI dynamic range: 127 dB
- Synthesizer resolution: 61 Hz
Features:
- LoRa modem for long-range spread spectrum communication
- FSK, GFSK, MSK, GMSK, LoRa and OOK modulation
- Built-in bit synchronizer for clock recovery
- Preamble detection
- Automatic RF Sense and CAD with ultra-fast AFC
- Packet engine up to 256 bytes with CRC
- Built-in temperature sensor and low battery indicator
- Excellent blocking immunity
- Supports WMBus and IEEE 802.15.4g in (G)FSK modes
Applications:
- Automated meter reading
- Home and building automation
- Wireless alarm and security systems
- Industrial monitoring and control
- Long range irrigation systems
Package:
- QFN 28, Pb-free, halogen-free, RoHS/WEEE compliant
- Wafer form (SX1276WS)
SX1276 Features
- LoRa TM Modem
- 168 dB maximum link budget
- +20 dBm - 100 mW constant RF output vs. V supply
- +14 dBm high efficiency PA
- Programmable bit rate up to 300 kbps
- High sensitivity: down to -148 dBm
- Bullet-proof front end: IIP3 = -11 dBm
- Excellent blocking immunity
- Low RX current of 9.9 mA, 200 nA register retention
- Fully integrated synthesizer with a resolution of 61 Hz
- FSK, GFSK, MSK, GMSK, LoRa TM and OOK modulation
- Built-in bit synchronizer for clock recovery
- Preamble detection
- 127 dB Dynamic Range RSSI
- Automatic RF Sense and CAD with ultra-fast AFC
- Packet engine up to 256 bytes with CRC
- Built-in temperature sensor and low battery indicator
SX1276 Applications
- Automated Meter Reading.
- Home and Building Automation.
- Wireless Alarm and Security Systems.
- Industrial Monitoring and Control
- Long range Irrigation Systems
DATASHEET
- Section Section Page
-
- General Description................................................................................................................................................. 9
- 1.1. Simplified Block Diagram................................................................................................................................. 9
- 1.2. Product Versions ............................................................................................................................................10
- 1.3. Pin Diagram ................................................................................................................................................... 10
- 1.4. Pin Description ...............................................................................................................................................11
- 1.5. Package Marking ...........................................................................................................................................12
-
- Electrical Characteristics ....................................................................................................................................... 13
- 2.1. ESD Notice .................................................................................................................................................... 13
- 2.2. Absolute Maximum Ratings ........................................................................................................................... 13
- 2.3. Operating Range............................................................................................................................................ 13
- 2.4. Thermal Properties ........................................................................................................................................ 13
- 2.5. Chip Specification ..........................................................................................................................................14
- 2.5.1. Power Consumption.................................................................................................................................. 14
- 2.5.2. Frequency Synthesis................................................................................................................................. 14
- 2.5.3. FSK/OOK Mode Receiver .........................................................................................................................16
- 2.5.4. FSK/OOK Mode Transmitter ..................................................................................................................... 17
- 2.5.5. Electrical Specification for LoRaTM Modulation ........................................................................................19
- 2.5.6. Digital Specification ...................................................................................................................................22
-
- SX1276/77/78/79 Features.................................................................................................................................... 23
- 3.1. LoRaTM Modem............................................................................................................................................ 24
- 3.2. FSK/OOK Modem.......................................................................................................................................... 24
-
- SX1276/77/78/79 Digital Electronics ..................................................................................................................... 25
- 4.1. The LoRaTM Modem..................................................................................................................................... 25
- 4.1.1. Link Design Using the LoRaTM Modem ....................................................................................................26
- 4.1.2. LoRaTM Digital Interface ...........................................................................................................................34
- 4.1.3. Operation of the LoRaTM Modem............................................................................................................. 36
- 4.1.4. Frequency Settings ...................................................................................................................................37
- 4.1.5. Frequency Error Indication........................................................................................................................ 37
- 4.1.6. LoRaTM Modem State Machine Sequences .............................................................................................38
- 4.1.7. Modem Status Indicators........................................................................................................................... 46
- 4.2. FSK/OOK Modem.......................................................................................................................................... 46
- 4.2.1. Bit Rate Setting ......................................................................................................................................... 46
- 4.2.2. FSK/OOK Transmission............................................................................................................................ 47
- 4.2.3. FSK/OOK Reception ................................................................................................................................. 48
- 4.2.4. Operating Modes in FSK/OOK Mode........................................................................................................ 54
- 4.2.5. Startup Times ............................................................................................................................................56
- 4.2.6. Receiver Startup Options .......................................................................................................................... 59
- 4.2.7. Receiver Restart Methods......................................................................................................................... 60
- 4.2.8. Top Level Sequencer ................................................................................................................................ 61
DATASHEET
- Section Page
- 4.2.9. Data Processing in FSK/OOK Mode......................................................................................................... 65
- 4.2.10. FIFO ........................................................................................................................................................66
- 4.2.11. Digital IO Pins Mapping ...........................................................................................................................69
- 4.2.12. Continuous Mode ....................................................................................................................................70
- 4.2.13. Packet Mode ........................................................................................................................................... 71
- 4.2.14. io-homecontrol® Compatibility Mode ...................................................................................................... 79
- 4.3. SPI Interface ..................................................................................................................................................80
- SX1276/77/78/79 Analog & RF Frontend Electronics............................................................................................ 81
- 5.1. Power Supply Strategy .................................................................................................................................. 81
- 5.2. Low Battery Detector ..................................................................................................................................... 81
- 5.3. Frequency Synthesis ..................................................................................................................................... 81
- 5.3.1. Crystal Oscillator ....................................................................................................................................... 81
- 5.3.2. CLKOUT Output........................................................................................................................................ 82
- 5.3.3. PLL............................................................................................................................................................ 82
- 5.3.4. RC Oscillator ............................................................................................................................................. 82
- 5.4. Transmitter Description ..................................................................................................................................83
- 5.4.1. Architecture Description ............................................................................................................................ 83
- 5.4.2. RF Power Amplifiers.................................................................................................................................. 83
- 5.4.3. High Power +20 dBm Operation ............................................................................................................... 84
- 5.4.4. Over Current Protection ............................................................................................................................85
- 5.5. Receiver Description...................................................................................................................................... 85
- 5.5.1. Overview ................................................................................................................................................... 85
- 5.5.2. Receiver Enabled and Receiver Active States.......................................................................................... 85
- 5.5.3. Automatic Gain Control In FSK/OOK Mode.............................................................................................. 85
- 5.5.4. RSSI in FSK/OOK Mode........................................................................................................................... 86
- 5.5.5. RSSI and SNR in LoRaTM Mode.............................................................................................................. 87
- 5.5.6. Channel Filter ............................................................................................................................................ 88
- 5.5.7. Temperature Measurement....................................................................................................................... 89
- Description of the Registers................................................................................................................................... 90
- 6.1. Register Table Summary............................................................................................................................... 90
- 6.2. FSK/OOK Mode Register Map .......................................................................................................................93
- 6.3. Band Specific Additional Registers.............................................................................................................. 106
- 6.4. LoRaTM Mode Register Map....................................................................................................................... 108
- Application Information ........................................................................................................................................ 116
- 7.2. Reset of the Chip ......................................................................................................................................... 116
- 7.2.1. POR......................................................................................................................................................... 116
- 7.2.2. Manual Reset ..........................................................................................................................................117
- 7.3. Top Sequencer: Listen Mode Examples...................................................................................................... 117
DATASHEET
- Section Page
- 7.3.1. Wake on Preamble Interrupt ................................................................................................................... 117
- 7.3.2. Wake on SyncAddress Interrupt ..............................................................................................................120
- 7.4. Top Sequencer: Beacon Mode ....................................................................................................................123
- 7.4.1. Timing diagram........................................................................................................................................ 123
- 7.4.2. Sequencer Configuration......................................................................................................................... 123
- 7.5. Example CRC Calculation ...........................................................................................................................125
- 7.6. Example Temperature Reading ...................................................................................................................126
-
- Packaging Information......................................................................................................................................... 128
- 8.1. Package Outline Drawing ............................................................................................................................ 128
- 8.2. Recommended Land Pattern....................................................................................................................... 129
- 8.3. Tape & Reel Information.............................................................................................................................. 130
- 8.4. Wafer Delivery ............................................................................................................................................. 130
SX1276 Pin Configuration
| Pin | Name | Type | Description |
|---|---|---|---|
| 1 | RFI_LF | I | RF input for bands 2&3 |
| 2 | VR_ANA | - | Regulated supply voltage for analogue circuitry |
| 3 | VBAT_ANA | - | Supply voltage for analogue circuitry |
| 4 | VR_DIG | - | Regulated supply voltage for digital blocks |
| 5 | XTA | I/O | XTAL connection or TCXO input |
| 6 | XTB | I/O | XTAL connection |
| 7 | NRESET | I/O | Reset trigger input |
| 8 | DIO0 | I/O | Digital I/O, software configured |
| 9 | DIO1/DCLK | I/O | Digital I/O, software configured |
| 10 | DIO2/DATA | I/O | Digital I/O, software configured |
| 11 | DIO3 | I/O | Digital I/O, software configured |
| 12 | DIO4 | I/O | Digital I/O, software configured |
| 13 | DIO5 | I/O | Digital I/O, software configured |
| 14 | VBAT_DIG | - | Supply voltage for digital blocks |
| 15 | GND | - | Ground |
| 16 | SCK | I | SPI Clock input |
| 17 | MISO | O | SPI Data output |
| 18 | MOSI | I | SPI Data input |
| 19 | NSS | I | SPI Chip select input |
| 20 | RXTX/RF_MOD | O | Rx/Tx switch control: high in Tx |
| 21 | RFI_HF (GND) | I (-) | RF input for band 1 (Ground) |
| 22 | RFO_HF (GND) | O (-) | RF output for band 1 (Ground) |
| 23 | GND | - | Ground |
| 24 | VBAT_RF | - | Supply voltage for RF blocks |
| 25 | VR_PA | - | Regulated supply for the PA |
| 26 | GND | - | Ground |
| 27 | PA_BOOST | O | Optional high-power PA output, all frequency bands |
| 28 | RFO_LF | O | RF output for bands 2&3 |
SX1276 Absolute Maximum Ratings
Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability.
Table 3 Absolute Maximum Ratings
| Symbol | Description | Min | Max | Unit |
|---|---|---|---|---|
| VDDmr | Supply Voltage | -0.5 | 3.9 | V |
| Tmr | Temperature | -55 | +115 | ° C |
| Tj | Junction temperature | - | +125 | ° C |
| Pmr | RF Input Level | - | +10 | dBm |
Note Specific ratings apply to +20 dBm operation (see Section 5.4.3).
SX1276 Thermal Information
Table 5 Thermal Properties
| Symbol | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| THETA_JA | Package θ ja (Junction to ambient) | - | 22.185 | - | °C/W |
| THETA_JC | Package θ jc (Junction to case ground paddle) | - | 0.757 | - | °C/W |
Table 5 Thermal Properties
DATASHEET
SX1276 Package Information
The SX1276/77/78/79 is available in a 28-lead QFN package as shown in Figure 57.
Figure 57. Package Outline Drawing
DATASHEET
SX1276 Ordering Information
| Part Number | Package | Temperature Range | Packing | MOQ / Multiple |
|---|---|---|---|---|
| SX1276IMLTRT | QFN-28 | -40°C to +85°C | T&R | 3000 pieces |
| SX1277IMLTRT | QFN-28 | -40°C to +85°C | T&R | 3000 pieces |
| SX1278IMLTRT | QFN-28 | -40°C to +85°C | T&R | 3000 pieces |
| SX1279IMLTRT | QFN-28 | -40°C to +85°C | T&R | 3000 pieces |
| SX1276WS | Wafer Form | null | Wafer Form | 1 Wafer (2000 dies) |
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