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SX1276IMLTRT

Low Power Long Range Transceiver

The SX1276IMLTRT is a low power long range transceiver from Semtech. View the full SX1276IMLTRT datasheet below including key specifications, absolute maximum ratings.

Manufacturer

Semtech

Package

28-VQFN Exposed Pad

Lifecycle

Active

Key Specifications

ParameterValue
Current - Receiving10.8mA ~ 12mA
Current - Receiving10.8mA ~ 12mA
Current - Receiving10.8mA ~ 12mA
Current - Receiving10.8mA ~ 12mA
Current - Transmitting20mA ~ 120mA
Current - Transmitting20mA ~ 120mA
Current - Transmitting20mA ~ 120mA
Current - Transmitting20mA ~ 120mA
Data Rate (Max)300kbps
Data Rate (Max)300kbps
Data Rate (Max)300kbps
Data Rate (Max)300kbps
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
Frequency137MHz ~ 1.02GHz
GPIO6
GPIO6
GPIO6
GPIO6
ModulationFSK, GFSK, GMSK, MSK, OOK
ModulationFSK, GFSK, GMSK, MSK, OOK
ModulationFSK, GFSK, GMSK, MSK, OOK
ModulationFSK, GFSK, GMSK, MSK, OOK
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C
Package / Case28-VQFN Exposed Pad
PackagingMouseReel
PackagingMouseReel
Power - Output20dBm
Power - Output20dBm
Power - Output20dBm
Power - Output20dBm
ProtocolLoRa™
RF Family/Standard802.15.4
RF Family/Standard802.15.4
RF Family/Standard802.15.4
RF Family/Standard802.15.4
Sensitivity-148dBm
Sensitivity-148dBm
Sensitivity-148dBm
Sensitivity-148dBm
Serial InterfacesSPI
Serial InterfacesSPI
Serial InterfacesSPI
Serial InterfacesSPI
Standard Pack Qty3000
Standard Pack Qty3000
Supplier Device Package28-QFN (6x6)
Supplier Device Package28-QFN (6x6)
Supplier Device Package28-QFN (6x6)
Supplier Device Package28-QFN (6x6)
TypeTxRx Only
TypeTxRx Only
TypeTxRx Only
TypeTxRx Only
Supply Voltage1.8V ~ 3.7V

Overview

Part: Semtech SX1276/77/78/79

Type: Low Power Long Range Transceiver

Description: The Semtech SX1276/77/78/79 are low power long range transceivers featuring LoRa™ modulation, operating from 137 MHz to 1020 MHz with a maximum link budget of 168 dB, +20 dBm RF output, and -148 dBm sensitivity.

Operating Conditions:

  • Supply voltage: 1.8–3.7 V
  • Operating temperature: -40 to +85 °C
  • Frequency range: 137 MHz to 1020 MHz

Absolute Maximum Ratings:

  • Max supply voltage: 3.9 V
  • Max junction/storage temperature: -55 to +150 °C

Key Specs:

  • Frequency Range: 137 MHz to 1020 MHz
  • LoRa™ Sensitivity: -148 dBm
  • Maximum RF Output Power: +20 dBm (100 mW)
  • LoRa™ RX Current: 9.9 mA (Typ)
  • Register Retention Current: 200 nA (Typ)
  • Programmable Bit Rate: up to 300 kbps
  • Frequency Synthesizer Resolution: 61 Hz
  • Maximum Link Budget: 168 dB

Features:

  • LoRa™ Modem
  • 168 dB maximum link budget
  • +20 dBm - 100 mW constant RF output vs. V supply
  • High sensitivity: down to -148 dBm
  • Low RX current of 9.9 mA, 200 nA register retention
  • FSK, GFSK, MSK, GMSK, LoRa™ and OOK modulation
  • Built-in temperature sensor and low battery indicator

Applications:

  • Automated Meter Reading.
  • Home and Building Automation.
  • Wireless Alarm and Security Systems.
  • Industrial Monitoring and Control
  • Long range Irrigation Systems

Package:

  • QFN 28 Package
  • Wafer Form

Features

  • LoRa TM Modem
  • 168 dB maximum link budget
  • +20 dBm - 100 mW constant RF output vs. V supply
  • +14 dBm high efficiency PA
  • Programmable bit rate up to 300 kbps
  • High sensitivity: down to -148 dBm
  • Bullet-proof front end: IIP3 = -11 dBm
  • Excellent blocking immunity
  • Low RX current of 9.9 mA, 200 nA register retention
  • Fully integrated synthesizer with a resolution of 61 Hz
  • FSK, GFSK, MSK, GMSK, LoRa TM and OOK modulation
  • Built-in bit synchronizer for clock recovery
  • Preamble detection
  • 127 dB Dynamic Range RSSI
  • Automatic RF Sense and CAD with ultra-fast AFC
  • Packet engine up to 256 bytes with CRC
  • Built-in temperature sensor and low battery indicator

Applications

  • Automated Meter Reading.

  • Home and Building Automation.

  • Wireless Alarm and Security Systems.

  • Industrial Monitoring and Control

  • Long range Irrigation Systems

  • Section Section Page

    1. General Description................................................................................................................................................. 9
  • 1.1. Simplified Block Diagram................................................................................................................................. 9

  • 1.2. Product Versions ............................................................................................................................................10

  • 1.3. Pin Diagram ................................................................................................................................................... 10

  • 1.4. Pin Description ...............................................................................................................................................11

  • 1.5. Package Marking ...........................................................................................................................................12

    1. Electrical Characteristics ....................................................................................................................................... 13
  • 2.1. ESD Notice .................................................................................................................................................... 13

  • 2.2. Absolute Maximum Ratings ........................................................................................................................... 13

  • 2.3. Operating Range............................................................................................................................................ 13

  • 2.4. Thermal Properties ........................................................................................................................................ 13

  • 2.5. Chip Specification ..........................................................................................................................................14

  • 2.5.1. Power Consumption.................................................................................................................................. 14

  • 2.5.2. Frequency Synthesis................................................................................................................................. 14

  • 2.5.3. FSK/OOK Mode Receiver .........................................................................................................................16

  • 2.5.4. FSK/OOK Mode Transmitter ..................................................................................................................... 17

  • 2.5.5. Electrical Specification for LoRaTM Modulation ........................................................................................19

  • 2.5.6. Digital Specification ...................................................................................................................................22

    1. SX1276/77/78/79 Features.................................................................................................................................... 23
  • 3.1. LoRaTM Modem............................................................................................................................................ 24

  • 3.2. FSK/OOK Modem.......................................................................................................................................... 24

    1. SX1276/77/78/79 Digital Electronics ..................................................................................................................... 25
  • 4.1. The LoRaTM Modem..................................................................................................................................... 25

  • 4.1.1. Link Design Using the LoRaTM Modem ....................................................................................................26

  • 4.1.2. LoRaTM Digital Interface ...........................................................................................................................34

  • 4.1.3. Operation of the LoRaTM Modem............................................................................................................. 36

  • 4.1.4. Frequency Settings ...................................................................................................................................37

  • 4.1.5. Frequency Error Indication........................................................................................................................ 37

  • 4.1.6. LoRaTM Modem State Machine Sequences .............................................................................................38

  • 4.1.7. Modem Status Indicators........................................................................................................................... 46

  • 4.2. FSK/OOK Modem.......................................................................................................................................... 46

  • 4.2.1. Bit Rate Setting ......................................................................................................................................... 46

  • 4.2.2. FSK/OOK Transmission............................................................................................................................ 47

  • 4.2.3. FSK/OOK Reception ................................................................................................................................. 48

  • 4.2.4. Operating Modes in FSK/OOK Mode........................................................................................................ 54

  • 4.2.5. Startup Times ............................................................................................................................................56

  • 4.2.6. Receiver Startup Options .......................................................................................................................... 59

  • 4.2.7. Receiver Restart Methods......................................................................................................................... 60

  • 4.2.8. Top Level Sequencer ................................................................................................................................ 61

DATASHEET

  • Section Page
  • 4.2.9. Data Processing in FSK/OOK Mode......................................................................................................... 65
  • 4.2.10. FIFO ........................................................................................................................................................66
  • 4.2.11. Digital IO Pins Mapping ...........................................................................................................................69
  • 4.2.12. Continuous Mode ....................................................................................................................................70
  • 4.2.13. Packet Mode ........................................................................................................................................... 71
  • 4.2.14. io-homecontrol® Compatibility Mode ...................................................................................................... 79
  • 4.3. SPI Interface ..................................................................................................................................................80
  • SX1276/77/78/79 Analog & RF Frontend Electronics............................................................................................ 81
  • 5.1. Power Supply Strategy .................................................................................................................................. 81
  • 5.2. Low Battery Detector ..................................................................................................................................... 81
  • 5.3. Frequency Synthesis ..................................................................................................................................... 81
  • 5.3.1. Crystal Oscillator ....................................................................................................................................... 81
  • 5.3.2. CLKOUT Output........................................................................................................................................ 82
  • 5.3.3. PLL............................................................................................................................................................ 82
  • 5.3.4. RC Oscillator ............................................................................................................................................. 82
  • 5.4. Transmitter Description ..................................................................................................................................83
  • 5.4.1. Architecture Description ............................................................................................................................ 83
  • 5.4.2. RF Power Amplifiers.................................................................................................................................. 83
  • 5.4.3. High Power +20 dBm Operation ............................................................................................................... 84
  • 5.4.4. Over Current Protection ............................................................................................................................85
  • 5.5. Receiver Description...................................................................................................................................... 85
  • 5.5.1. Overview ................................................................................................................................................... 85
  • 5.5.2. Receiver Enabled and Receiver Active States.......................................................................................... 85
  • 5.5.3. Automatic Gain Control In FSK/OOK Mode.............................................................................................. 85
  • 5.5.4. RSSI in FSK/OOK Mode........................................................................................................................... 86
  • 5.5.5. RSSI and SNR in LoRaTM Mode.............................................................................................................. 87
  • 5.5.6. Channel Filter ............................................................................................................................................ 88
  • 5.5.7. Temperature Measurement....................................................................................................................... 89
  • Description of the Registers................................................................................................................................... 90
  • 6.1. Register Table Summary............................................................................................................................... 90
  • 6.2. FSK/OOK Mode Register Map .......................................................................................................................93
  • 6.3. Band Specific Additional Registers.............................................................................................................. 106
  • 6.4. LoRaTM Mode Register Map....................................................................................................................... 108
  • Application 116
  • Information ........................................................................................................................................ 7.1. Crystal Resonator Specification................................................................................................................... 116
  • 7.2. Reset of the Chip ......................................................................................................................................... 116
  • 7.2.1. POR......................................................................................................................................................... 116
  • 7.2.2. Manual Reset ..........................................................................................................................................117
  • 7.3. Top Sequencer: Listen Mode Examples...................................................................................................... 117

DATASHEET

  • Section Page
  • 7.3.1. Wake on Preamble Interrupt ................................................................................................................... 117
  • 7.3.2. Wake on SyncAddress Interrupt ..............................................................................................................120
  • 7.4. Top Sequencer: Beacon Mode ....................................................................................................................123
  • 7.4.1. Timing diagram........................................................................................................................................ 123
  • 7.4.2. Sequencer Configuration......................................................................................................................... 123
  • 7.5. Example CRC Calculation ...........................................................................................................................125
  • 7.6. Example Temperature Reading ...................................................................................................................126
    1. Packaging Information......................................................................................................................................... 128
  • 8.1. Package Outline Drawing ............................................................................................................................ 128
  • 8.2. Recommended Land Pattern....................................................................................................................... 129
  • 8.3. Tape & Reel Information.............................................................................................................................. 130
  • 8.4. Wafer Delivery ............................................................................................................................................. 130

DATASHEET

  • Section Page
  • Table 1. SX1276/77/78/79 Device Variants and Key Parameters .................................................................................10
  • Table 2. Pin Description ................................................................................................................................................11
  • Table 3. Absolute Maximum Ratings .............................................................................................................................13
  • Table 4. Operating Range .............................................................................................................................................13
  • Table 5. Thermal Properties ..........................................................................................................................................13
  • Table 6. Power Consumption Specification ...................................................................................................................14
  • Table 7. Frequency Synthesizer Specification ..............................................................................................................14
  • Table 8. FSK/OOK Receiver Specification ....................................................................................................................16
  • Table 9. Transmitter Specification .................................................................................................................................17
  • Table 10. LoRa Receiver Specification .........................................................................................................................19
  • Table 11. Digital Specification .......................................................................................................................................22
  • Table 12. Example LoRaTM Modem Performances, 868MHz Band .............................................................................25
  • Table 13. Range of Spreading Factors ..........................................................................................................................27
  • Table 14. Cyclic Coding Overhead ................................................................................................................................27
  • Table 15. LoRa Bandwidth Options ...............................................................................................................................28
  • Table 16. LoRaTM Operating Mode Functionality .........................................................................................................36
  • Table 17. LoRa CAD Consumption Figures ..................................................................................................................45
  • Table 18. DIO Mapping LoRaTM Mode .........................................................................................................................46
  • Table 19. Bit Rate Examples .........................................................................................................................................47
  • Table 20. Preamble Detector Settings ...........................................................................................................................53
  • Table 21. RxTrigger Settings to Enable Timeout Interrupts ..........................................................................................54
  • Table 22. Basic Transceiver Modes ..............................................................................................................................54
  • Table 23. Receiver Startup Time Summary ..................................................................................................................57
  • Table 24. Receiver Startup Options 25. Sequencer States ..........................................................................................................................................61 ..............................................................................................................................60
  • Table
  • Table 26. Sequencer Transition Options .......................................................................................................................62
  • Table 27. Sequencer Timer Settings .............................................................................................................................63
  • Table 28. Status of FIFO when Switching Between Different Modes of the Chip .........................................................67
  • Table 29. DIO Mapping, Continuous Mode ...................................................................................................................69
  • Table 30. DIO Mapping, Packet Mode ..........................................................................................................................69
  • Table 31. CRC Description ...........................................................................................................................................77
  • Table 32. Frequency Bands ..........................................................................................................................................82
  • Table 33. Power Amplifier Mode Selection Truth Table ................................................................................................83
  • Table 34. High Power Settings ......................................................................................................................................84
  • Table 35. Operating Range, +20dBm Operation ...........................................................................................................84
  • Table 36. Operating Range, +20dBm Operation ...........................................................................................................84
  • Table 37. Trimming of the OCP Current ........................................................................................................................85
  • Table 39. RssiSmoothing Options .................................................................................................................................86

DATASHEET

  • Section Page
  • Table 40. Available RxBw Settings ................................................................................................................................88
  • Table 41. Registers Summary .......................................................................................................................................90
  • Table 42. Register Map .................................................................................................................................................93
  • Table 43. Low Frequency Additional Registers ...........................................................................................................106
  • Table 44. High Frequency Additional Registers ..........................................................................................................107
  • Table 45. Crystal Specification ....................................................................................................................................116
  • Table 46. Listen Mode with PreambleDetect Condition Settings .................................................................................119
  • Table 47. Listen Mode with PreambleDetect Condition Recommended DIO Mapping ...............................................119
  • Table 48. Listen Mode with SyncAddress Condition Settings .....................................................................................122
  • Table 49. Listen Mode with PreambleDetect Condition Recommended DIO Mapping ...............................................122
  • Table 50. Beacon Mode Settings ................................................................................................................................124
  • Table 51. Revision History ...........................................................................................................................................131

DATASHEET

  • Section Page
  • Figure 1. Block Diagram .................................................................................................................................................9
  • Figure 2. Pin Diagrams .................................................................................................................................................10
  • Figure 3. Marking Diagram ...........................................................................................................................................12
  • Figure 4. SX1276/77/78/79 Block Schematic Diagram ................................................................................................23
  • Figure 5. LoRaTM Modem Connectivity .......................................................................................................................26
  • Figure 6. LoRaTM Packet Structure .............................................................................................................................29
  • Figure 7. Interrupts Generated in the Case of Successful Frequency Hopping Communication. ................................33
  • Figure 8. LoRaTM Data Buffer .....................................................................................................................................34
  • Figure 9. LoRaTM Modulation Transmission Sequence. .............................................................................................38
  • Figure 10. LoRaTM Receive Sequence. ......................................................................................................................39
  • Figure 11. LoRaTM CAD Flow .....................................................................................................................................43
  • Figure 12. CAD Time as a Function of Spreading Factor .............................................................................................44
  • Figure 13. Consumption Profile of the LoRa CAD Process ..........................................................................................45
  • Figure 14. OOK Peak Demodulator Description ...........................................................................................................49
  • Figure 15. Floor Threshold Optimization ......................................................................................................................50
  • Figure 16. Bit Synchronizer Description .......................................................................................................................51
  • Figure 17. Startup Process ...........................................................................................................................................56
  • Figure 18. Time to RSSI Sample ..................................................................................................................................57
  • Figure 19. Tx to Rx Turnaround ...................................................................................................................................58
  • Figure 20. Rx to Tx Turnaround ...................................................................................................................................58
  • Figure 21. Receiver Hopping ........................................................................................................................................59
  • Figure 22. Transmitter Hopping ....................................................................................................................................59
  • Figure 23. Timer1 and Timer2 Mechanism ...................................................................................................................63
  • Figure 24. Sequencer State Machine ...........................................................................................................................64
  • Figure 25. SX1276/77/78/79 Data Processing Conceptual View .................................................................................65
  • Figure 26. FIFO and Shift Register (SR) ......................................................................................................................66
  • Figure 27. FifoLevel IRQ Source Behavior ...................................................................................................................67
  • Figure 28. Sync Word Recognition ...............................................................................................................................68
  • Figure 29. Continuous Mode Conceptual View ............................................................................................................70
  • Figure 30. Tx Processing in Continuous Mode .............................................................................................................70
  • Figure 31. Rx Processing in Continuous Mode ............................................................................................................71
  • Figure 32. Packet Mode Conceptual View ...................................................................................................................72
  • Figure 33. Fixed Length Packet Format .......................................................................................................................73
  • Figure 34. Variable Length Packet Format ...................................................................................................................74
  • Figure 35. Unlimited Length Packet Format .................................................................................................................74
  • Figure 36. Manchester Encoding/Decoding .................................................................................................................78
  • Figure 37. Data Whitening Polynomial .........................................................................................................................79
  • Figure 38. SPI Timing Diagram (single access) ...........................................................................................................80
  • Figure 39. TCXO Connection .......................................................................................................................................81

Pin Configuration

Table 2 Pin Description

NumberNameTypeDescription
0GROUND-Exposed ground pad
1RFI_LFIRF input for bands 2&3
2VR_ANA-Regulated supply voltage for analogue circuitry
3VBAT_ANA-Supply voltage for analogue circuitry
4VR_DIG-Regulated supply voltage for digital blocks
5XTAI/OXTAL connection or TCXO input
6XTBI/OXTAL connection
7NRESETI/OReset trigger input
8DIO0I/ODigital I/O, software configured
9DIO1/DCLKI/ODigital I/O, software configured
10DIO2/DATAI/ODigital I/O, software configured
11DIO3I/ODigital I/O, software configured
12DIO4I/ODigital I/O, software configured
13DIO5I/ODigital I/O, software configured
14VBAT_DIG-Supply voltage for digital blocks
15GND-Ground
16SCKISPI Clock input
17MISOOSPI Data output
18MOSIISPI Data input
19NSSISPI Chip select input
20RXTX/RF_MODORx/Tx switch control: high in Tx
21RFI_HF (GND)I (-)RF input for band 1 (Ground)
22RFO_HF (GND)O (-)RF output for band 1 (Ground)
23GND-Ground
24VBAT_RF-Supply voltage for RF blocks
25VR_PA-Regulated supply for the PA
26GND-Ground
27PA_BOOSTOOptional high-power PA output, all frequency bands
28RFO_LFORF output for bands 2&3

DATASHEET

WIRELESS, SENSING & TIMING

Absolute Maximum Ratings

Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability.

Table 3 Absolute Maximum Ratings

SymbolDescriptionMinMaxUnit
VDDmrSupply Voltage-0.53.9V
TmrTemperature-55115° C
TjJunction temperature-125° C
PmrRF Input Level-10dBm

Note Specific ratings apply to +20 dBm operation (see Section 5.4.3).

Thermal Information

Table 5 Thermal Properties

SymbolDescriptionMinTypMaxUnit
THETA_JAPackage θ ja (Junction to ambient)-22.185-°C/W
THETA_JCPackage θ jc (Junction to case ground paddle)-0.757-°C/W

DATASHEET

Package Information

The SX1276/77/78/79 is available in a 28-lead QFN package as shown in Figure 57.

Figure 57. Package Outline Drawing

DATASHEET

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
SX1276Semtech
SX1276/77/78/79Semtech
SX1276/77/79Semtech
SX1276MB1LASSemtech CorporationModule
SX1276MB1MASSemtech CorporationModule
SX1276WSSemtech
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