BG95M3LA-64-SGNS

Part: Quectel BG95 Series

Type: LTE Cat M1/ Cat NB2/ EGPRS Module

Key Specs:

• LTE Cat M1 Downlink Data Rate: 588 kbps
• LTE Cat M1 Uplink Data Rate: 1119 kbps
• Form Factor: 23.6 mm × 19.9 mm × 2.2 mm
• Operating Temperature: -35 °C to +75 °C
• Extended Temperature: -40 °C to +85 °C

Features:

• Multi-mode LPWA (LTE Cat M1/Cat NB2/EGPRS)
• Integrated GNSS
• 3GPP Rel-14 compliant
• Ultra-low power consumption (up to 70% reduction in PSM leakage, 85% reduction in eDRX current consumption)
• Integrated RAM/flash
• ARM Cortex A7 processor supporting ThreadX
• Hardware-based security features
• Cortex A7 TrustZone engine
• Pin-to-pin compatibility with Quectel LTE Cat 4 modules EG91/EG95, LTE Cat M1/Cat NB1/EGPRS module BG96, NB-IoT module BC95, UMTS/HSPA modules UG95/UG96 and GSM/GPRS module M95
• Cost-effective SMT form factor
• LGA package for automated manufacturing
• Rich set of Internet protocols
• Industry-standard interfaces
• Abundant functions
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules
• Support VoLTE (Cat M1 only), CS voice for GSM, QuecOpen, eSIM
• Fast time-to-market (reference designs, evaluation tools, technical support)
• Robust mounting and interfaces
• Embedded Abundant Protocols
• DFOTA
• USB 2.0 Interface
• Quectel Enhanced AT Commands

Applications:

• Wireless POS
• Smart metering
• Tracking
• Wearable devices
• M2M applications

Package:

• SMT form factor: 23.6 mm × 19.9 mm × 2.2 mm
• LGA package

• Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules
• Integrated RAM and flash in the baseband chipset
• Comprehensive set of hardware-based security features
• Support VoLTE* (Cat M1 only), CS voice* for GSM, QuecOpen® , eSIM, etc.
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design-in time and development efforts
• Compact SMT form factor ideal for size-constrained applications with tight space
• Robust mounting and interfaces

LTE Cat M1 & Cat NB2

Embedded Abundant Protocols

Ultra-low Power Consumption

EGPRS LGA Package

DFOTA USB 2.0 Interface

Quectel Enhanced AT Commands

Integrated RAM/ Flash in Chipset

Rev.: V1.5 | Status: Released