ESP32-D0WD-V3/ESP32
The ESP32-D0WD-V3/ESP32 is an electronic component from Espressif Systems. View the full ESP32-D0WD-V3/ESP32 datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Espressif Systems
Overview
Part: Espressif ESP32-WROOM-32E / ESP32-WROOM-32UE
Type: Wi-Fi + Bluetooth + Bluetooth LE MCU module
Description: Powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU modules built around Xtensa dual-core 32-bit LX6 microprocessor, offering 4/8/16 MB flash, up to 240 MHz clock speed, and 26 GPIOs, suitable for a wide variety of IoT applications.
Operating Conditions:
- Supply voltage: 3.0–3.6 V
- Operating temperature: -40 to 105 °C
- CPU clock frequency: 80 MHz to 240 MHz
- Wi-Fi bit rate: up to 150 Mbps
Absolute Maximum Ratings:
- Max supply voltage: 3.6 V
- Max junction/storage temperature: 105 °C
Key Specs:
- CPU: Xtensa dual-core 32-bit LX6 microprocessor
- CPU Clock Frequency: 80 MHz to 240 MHz
- ROM: 448 KB
- SRAM: 520 KB (plus 16 KB in RTC)
- Flash: 4/8/16 MB SPI flash
- Optional PSRAM: 2 MB (for ESP32-D0WDR2-V3 embedded)
- Wi-Fi Standard: 802.11b/g/n
- Bluetooth Standard: V4.2 BR/EDR and Bluetooth LE
- Input Current (I_IH / I_IL): 50 nA (Max)
Features:
- Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz
- 448 KB ROM, 520 KB SRAM, 16 KB SRAM in RTC, optional 2 MB PSRAM
- 2.4 GHz Wi-Fi (802.11b/g/n, up to 150 Mbps)
- Bluetooth V4.2 BR/EDR and Bluetooth LE
- Rich set of peripherals: SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI (CAN)
- On-board PCB antenna (ESP32-WROOM-32E) or external antenna connector (ESP32-WROOM-32UE)
- 26 GPIOs
Applications:
- Generic Low-power IoT Sensor Hub
- Generic Low-power IoT Data Loggers
- Cameras for Video Streaming
- Over-the-top (OTT) Devices
- Speech Recognition
- Image Recognition
- Mesh Network
- Home Automation
- Smart Building
- Industrial Automation
- Smart Agriculture
- Audio Applications
- Health Care Applications
- Wi-Fi-enabled Toys
- Wearable Electronics
- Retail & Catering Applications
Package:
- ESP32-WROOM-32E: 18.0 × 25.5 × 3.1 mm
- ESP32-WROOM-32UE: 18.0 × 19.2 × 3.2 mm
Applications
- Generic Low-power IoT Sensor Hub
- Generic Low-power IoT Data Loggers
- Cameras for Video Streaming
- Over-the-top (OTT) Devices
- Speech Recognition
- Image Recognition
- Mesh Network
- Home Automation
- Smart Building
- Industrial Automation
- Smart Agriculture
- Audio Applications
- Health Care Applications
- Wi-Fi-enabled Toys
- Wearable Electronics
- Retail & Catering Applications
Pin Configuration
The module has 38 pins. See pin definitions in Table 3.
For peripheral pin configurations, please refer to ESP32 Series Datasheet .
Table 3: Pin Definitions
| Name | No. | Type 1 | Function |
|---|---|---|---|
| GND | 1 | P | Ground |
| 3V3 | 2 | P | Power supply |
| EN | 3 | I | High: On; enables the chip Low: Off; the chip shuts down Note: Do not leave the pin floating. |
| SENSOR_VP | 4 | I | GPIO36, ADC1_CH0, RTC_GPIO0 |
| SENSOR_VN | 5 | I | GPIO39, ADC1_CH3, RTC_GPIO3 |
| IO34 | 6 | I | GPIO34, ADC1_CH6, RTC_GPIO4 |
| IO35 | 7 | I | GPIO35, ADC1_CH7, RTC_GPIO5 |
| IO32 | 8 | I/O | GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 |
| IO33 | 9 | I/O | GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 |
| IO25 | 10 | I/O | GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 |
| IO26 | 11 | I/O | GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 |
| IO27 | 12 | I/O | GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV |
| IO14 | 13 | I/O | GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 |
| IO12 | 14 | I/O | GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 |
| GND | 15 | P | Ground |
| IO13 | 16 | I/O | GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER |
| NC | 17 | - | See note 2 |
| NC | 18 | - | See note 2 |
| NC | 19 | - | See note 2 |
| NC | 20 | - | See note 2 |
| NC | 21 | - | See note 2 |
| NC | 22 | - | See note 2 |
| IO15 | 23 | I/O | GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 |
| IO2 | 24 | I/O | GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 |
| IO0 | 25 | I/O | GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK |
| IO4 | 26 | I/O | GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER |
| IO16 3 | 27 | I/O | GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT |
| IO17 | 28 | I/O | GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 |
| IO5 | 29 | I/O | GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK |
| IO18 | 30 | I/O | GPIO18, VSPICLK, HS1_DATA7 |
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Table 3 - cont'd from previous page
| Name | No. | Type 1 | Function |
|---|---|---|---|
| IO19 | 31 | I/O | GPIO19, VSPIQ, U0CTS, EMAC_TXD0 |
| NC | 32 | - | - |
| IO21 | 33 | I/O | GPIO21, VSPIHD, EMAC_TX_EN |
| RXD0 | 34 | I/O | GPIO3, U0RXD, CLK_OUT2 |
| TXD0 | 35 | I/O | GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 |
| IO22 | 36 | I/O | GPIO22, VSPIWP, U0RTS, EMAC_TXD1 |
| IO23 | 37 | I/O | GPIO23, VSPID, HS1_STROBE |
| GND | 38 | P | Ground |
Electrical Characteristics
Table 8: DC Characteristics (3.3 V, 25 °C)
| Symbol | Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| C IN | Pin capacitance | - | 2 | - | pF |
| V IH | High-level input voltage | 0.75 × VDD 1 | - | VDD 1 + 0.3 | V |
| V IL | Low-level input voltage | -0.3 | - | 0.25 × VDD 1 | V |
| I IH | High-level input current | - | - | 50 | nA |
| I IL | Low-level input current | - | - | 50 | nA |
| V OH | High-level output voltage | 0.8 × VDD 1 | - | - | V |
| V OL | Low-level output voltage | - | - | 0.1 × VDD 1 | V |
Cont'd on next page
of
Table 8 - cont'd from previous page
| Symbol | Parameter | Min Typ | Max Unit | ||
|---|---|---|---|---|---|
| I OH | High-level source current (VDD 1 = 3.3 V, | VDD3P3_CPU power domain 1, 2 | - | 40 | - |
| I OH | V OH >= 2.64 V, | VDD3P3_RTC power domain 1, 2 | - | 40 | - |
| I OH | output drive strength set to the maximum) | VDD_SDIO power domain 1, 3 | - | 20 | - |
| I OL | Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum) | Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum) | - | 28 | - |
| R PU | Resistance of internal pull-up resistor | Resistance of internal pull-up resistor | - | 45 | - |
| R PD | Resistance of internal pull-down resistor | Resistance of internal pull-down resistor | - | 45 | - |
| V IL _ nRST | Low-level input voltage of CHIP_PU to shut down the chip | Low-level input voltage of CHIP_PU to shut down the chip | - | - | 0.6 |
Absolute Maximum Ratings
Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 6: Absolute Maximum Ratings
| Symbol | Parameter | Min | Max | Unit |
|---|---|---|---|---|
| VDD33 | Power supply voltage | -0.3 | 3.6 | V |
| T STORE | Storage temperature | -40 | 105 | °C |
Recommended Operating Conditions
Table 7: Recommended Operating Conditions
| Symbol | Parameter | Min Typ | Max | Unit | ||
|---|---|---|---|---|---|---|
| VDD33 | Power supply voltage | Power supply voltage | 3 | 3.3 | 3.6 | V |
| I VDD | Current delivered by external power supply | Current delivered by external power supply | 0.5 | - | - | A |
| T | Operating ambient temperature | 85 °C version 105 °C version | -40 | - | 85 105 | °C |
Package Information
This section provides the following resources for your reference:
- Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 10 ESP32-WROOM-32E Recommended PCB Land Pattern and Figure 11 ESP32-WROOM-32UE Recommended PCB Land Pattern .
- Source files of recommended PCB land patterns to measure dimensions not covered in Figure 10 and Figure 11. You can view the source files for ESP32-WROOM-32E and ESP32-WROOM-32UE with Autodesk Viewer.
- 3D models of ESP32-WROOM-32E and ESP32-WROOM-32UE. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). 䕓倳㈭坒住䴭㌲䔠䱡湤⁐慴瑥牮
Figure 10: ESP32WROOM32E Recommended PCB Land Pattern
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Figure 11: ESP32WROOM32UE Recommended PCB Land Pattern
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| ESP32 | Espressif Systems | ESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm) |
| ESP32-D0WD-V3 | Espressif Systems | 48-VFQFN Exposed Pad |
| ESP32-WROOM-32E | Espressif Systems | — |
| ESP32-WROOM-32E-H4 | Espressif Systems | Module |
| ESP32-WROOM-32E-H8 | Espressif Systems | Module |
| ESP32-WROOM-32E-N16 | Espressif Systems | Module |
| ESP32-WROOM-32E-N16R2 | Espressif Systems | Module |
| ESP32-WROOM-32E-N4 | Espressif Systems | Module |
| ESP32-WROOM-32E-N4R2 | Espressif Systems | Module |
| ESP32-WROOM-32E-N8 | Espressif Systems | Module |
| ESP32-WROOM-32E-N8R2 | Espressif Systems | Module |
| ESP32-WROOM-32UE | Espressif Systems | — |
| ESP32-WROOM-32UE-H4 | Espressif Systems | — |
| ESP32-WROOM-32UE-H8 | Espressif Systems | — |
| ESP32-WROOM-32UE-N16 | Espressif Systems | — |
| ESP32-WROOM-32UE-N16R2 | Espressif Systems | — |
| ESP32-WROOM-32UE-N4 | Espressif Systems | 38-SMD Module |
| ESP32-WROOM-32UE-N4R2 | Espressif Systems | — |
| ESP32-WROOM-32UE-N8 | Espressif Systems | — |
| ESP32-WROOM-32UE-N8R2 | Espressif Systems | — |
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