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ESP32-D0WD-V3/ESP32

Wi-Fi + Bluetooth + Bluetooth LE MCU Module

The ESP32-D0WD-V3/ESP32 is a wi-fi + bluetooth + bluetooth le mcu module from Espressif Systems. View the full ESP32-D0WD-V3/ESP32 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

ESP32-D0WD-V3/ESP32 shares its datasheet with ESP32-WROOM-32E-N4, whose page lists every part number it covers.

Official ESP32-D0WD-V3/ESP32 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Espressif Systems

Category

Microcontrollers (MCU)

ESP32-D0WD-V3/ESP32 Key Specifications

ParameterValue
CPUDual-core Xtensa 32-bit LX6, 80 MHz to 240 MHz
ROM448 KB
Wi-Fi802.11 b/g/n, up to 150 Mbps, 2412-2484 MHz
EFuse1 Kbit
Crystal40 MHz
RTC SRAM8 KB FAST + 8 KB SLOW
Bluetoothv4.2 BR/EDR and Bluetooth LE
InterfacesSD card, UART, SPI, SDIO, I2C, I2S, LED PWM, Motor PWM, IR, pulse counter, GPIO, capacitive touch, ADC, DAC, TWAI (CAN 2.0)
On-Chip SRAM520 KB
Sleep Current< 5 uA
Supply Voltage3.0V to 3.6V
Operating Temperature-40 C to 85 C
Output Power At Antenna20 dBm
Bluetooth Receiver Sensitivity-97 dBm (NZIF receiver)
Module Dimensions (WROVER-E/IE)18.0 x 31.4 x 3.3 mm
Minimum Supply Current Capability500 mA

ESP32-D0WD-V3/ESP32 Overview

Part: Espressif ESP32-WROOM-32E / ESP32-WROOM-32UE

Type: Wi-Fi + Bluetooth + Bluetooth LE MCU module

Description: Powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU modules built around Xtensa dual-core 32-bit LX6 microprocessor, offering 4/8/16 MB flash, up to 240 MHz clock speed, and 26 GPIOs, suitable for a wide variety of IoT applications.

Operating Conditions:

  • Supply voltage: 3.0–3.6 V
  • Operating temperature: -40 to 105 °C
  • CPU clock frequency: 80 MHz to 240 MHz
  • Wi-Fi bit rate: up to 150 Mbps

Absolute Maximum Ratings:

  • Max supply voltage: 3.6 V
  • Max junction/storage temperature: 105 °C

Key Specs:

  • CPU: Xtensa dual-core 32-bit LX6 microprocessor
  • CPU Clock Frequency: 80 MHz to 240 MHz
  • ROM: 448 KB
  • SRAM: 520 KB (plus 16 KB in RTC)
  • Flash: 4/8/16 MB SPI flash
  • Optional PSRAM: 2 MB (for ESP32-D0WDR2-V3 embedded)
  • Wi-Fi Standard: 802.11b/g/n
  • Bluetooth Standard: V4.2 BR/EDR and Bluetooth LE
  • Input Current (I_IH / I_IL): 50 nA (Max)

Features:

  • Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz
  • 448 KB ROM, 520 KB SRAM, 16 KB SRAM in RTC, optional 2 MB PSRAM
  • 2.4 GHz Wi-Fi (802.11b/g/n, up to 150 Mbps)
  • Bluetooth V4.2 BR/EDR and Bluetooth LE
  • Rich set of peripherals: SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI (CAN)
  • On-board PCB antenna (ESP32-WROOM-32E) or external antenna connector (ESP32-WROOM-32UE)
  • 26 GPIOs

Applications:

  • Generic Low-power IoT Sensor Hub
  • Generic Low-power IoT Data Loggers
  • Cameras for Video Streaming
  • Over-the-top (OTT) Devices
  • Speech Recognition
  • Image Recognition
  • Mesh Network
  • Home Automation
  • Smart Building
  • Industrial Automation
  • Smart Agriculture
  • Audio Applications
  • Health Care Applications
  • Wi-Fi-enabled Toys
  • Wearable Electronics
  • Retail & Catering Applications

Package:

  • ESP32-WROOM-32E: 18.0 × 25.5 × 3.1 mm
  • ESP32-WROOM-32UE: 18.0 × 19.2 × 3.2 mm

ESP32-D0WD-V3/ESP32 Applications

  • Generic Low-power IoT Sensor Hub
  • Generic Low-power IoT Data Loggers
  • Cameras for Video Streaming
  • Over-the-top (OTT) Devices
  • Speech Recognition
  • Image Recognition
  • Mesh Network
  • Home Automation
  • Smart Building
  • Industrial Automation
  • Smart Agriculture
  • Audio Applications
  • Health Care Applications
  • Wi-Fi-enabled Toys
  • Wearable Electronics
  • Retail & Catering Applications

ESP32-D0WD-V3/ESP32 Pin Configuration

The module has 38 pins. See pin definitions in Table 3.

For peripheral pin configurations, please refer to ESP32 Series Datasheet .

Table 3: Pin Definitions

NameNo.Type 1Function
GND1PGround
3V32PPower supply
EN3IHigh: On; enables the chip Low: Off; the chip shuts down Note: Do not leave the pin floating.
SENSOR_VP4IGPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN5IGPIO39, ADC1_CH3, RTC_GPIO3
IO346IGPIO34, ADC1_CH6, RTC_GPIO4
IO357IGPIO35, ADC1_CH7, RTC_GPIO5
IO328I/OGPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9
IO339I/OGPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8
IO2510I/OGPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO2611I/OGPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO2712I/OGPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO1413I/OGPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2
IO1214I/OGPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3
GND15PGround
IO1316I/OGPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER
NC17-See note 2
NC18-See note 2
NC19-See note 2
NC20-See note 2
NC21-See note 2
NC22-See note 2
IO1523I/OGPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3
IO224I/OGPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0
IO025I/OGPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
IO426I/OGPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER
IO16 327I/OGPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO1728I/OGPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO529I/OGPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO1830I/OGPIO18, VSPICLK, HS1_DATA7

Cont'd on next page

Table 3 - cont'd from previous page

NameNo.Type 1Function
IO1931I/OGPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC32--
IO2133I/OGPIO21, VSPIHD, EMAC_TX_EN
RXD034I/OGPIO3, U0RXD, CLK_OUT2
TXD035I/OGPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO2236I/OGPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO2337I/OGPIO23, VSPID, HS1_STROBE
GND38PGround

ESP32-D0WD-V3/ESP32 Electrical Characteristics

Table 8: DC Characteristics (3.3 V, 25 °C)

SymbolParameterMinTypMaxUnit
C INPin capacitance-2-pF
V IHHigh-level input voltage0.75 × VDD 1-VDD 1 + 0.3V
V ILLow-level input voltage-0.3-0.25 × VDD 1V
I IHHigh-level input current--50nA
I ILLow-level input current--50nA
V OHHigh-level output voltage0.8 × VDD 1--V
V OLLow-level output voltage--0.1 × VDD 1V

Cont'd on next page

of

Table 8 - cont'd from previous page

SymbolParameterMin TypMax Unit
I OHHigh-level source current (VDD 1 = 3.3 V,VDD3P3_CPU power domain 1, 2-40-
I OHV OH >= 2.64 V,VDD3P3_RTC power domain 1, 2-40-
I OHoutput drive strength set to the maximum)VDD_SDIO power domain 1, 3-20-
I OLLow-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum)Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum)-28-
R PUResistance of internal pull-up resistorResistance of internal pull-up resistor-45-
R PDResistance of internal pull-down resistorResistance of internal pull-down resistor-45-
V IL _ nRSTLow-level input voltage of CHIP_PU to shut down the chipLow-level input voltage of CHIP_PU to shut down the chip--0.6

ESP32-D0WD-V3/ESP32 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 6: Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDD33Power supply voltage-0.33.6V
T STOREStorage temperature-40105°C

ESP32-D0WD-V3/ESP32 Recommended Operating Conditions

Table 7: Recommended Operating Conditions

SymbolParameterMin TypMaxUnit
VDD33Power supply voltagePower supply voltage33.33.6V
I VDDCurrent delivered by external power supplyCurrent delivered by external power supply0.5--A
TOperating ambient temperature85 °C version 105 °C version-40-85 105°C

ESP32-D0WD-V3/ESP32 Package Information

This section provides the following resources for your reference:

  • Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 10 ESP32-WROOM-32E Recommended PCB Land Pattern and Figure 11 ESP32-WROOM-32UE Recommended PCB Land Pattern .
  • Source files of recommended PCB land patterns to measure dimensions not covered in Figure 10 and Figure 11. You can view the source files for ESP32-WROOM-32E and ESP32-WROOM-32UE with Autodesk Viewer.
  • 3D models of ESP32-WROOM-32E and ESP32-WROOM-32UE. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). 䕓倳㈭坒住䴭㌲䔠䱡湤⁐慴瑥牮

Figure 10: ESP32­WROOM­32E Recommended PCB Land Pattern

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Figure 11: ESP32­WROOM­32UE Recommended PCB Land Pattern

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All Microcontrollers (MCU) datasheetsAll Espressif Systems datasheets (86)

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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