ESP32-WROOM-32E-N4

ESP32WROOM32E ESP32WROOM32UE

Manufacturer

espressif

Overview

Part: ESP32WROOM32E ESP32WROOM32UE from Espressif

Type: Wi-Fi + Bluetooth + Bluetooth LE MCU module

Key Specs:

  • CPU Clock Frequency: up to 240 MHz
  • Flash Memory: 4/8/16 MB SPI flash
  • SRAM: 520 KB
  • ROM: 448 KB
  • Operating Voltage: 3.0 ~ 3.6 V
  • WiFi Bit Rate (802.11n): up to 150 Mbps
  • Operating Ambient Temperature: –40 ~ 85 °C, or –40 ~ 105 °C (for 4/8 MB flash versions)

Features:

  • Built around ESP32 series of SoCs (ESP32-D0WD-V3 or ESP32-D0WDR2-V3)
  • Xtensa dual-core 32-bit LX6 microprocessor
  • 16 KB SRAM in RTC
  • 2 MB PSRAM available with ESP32-D0WDR2-V3
  • 2.4 GHz WiFi (802.11b/g/n)
  • A-MPDU and A-MSDU aggregation
  • 0.4 µs guard interval support
  • Bluetooth V4.2 BR/EDR and Bluetooth LE specification
  • Class-1, class-2 and class-3 transmitter
  • AFH, CVSD and SBC support
  • Rich set of peripherals: SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI® (compatible with ISO 11898-1, i.e. CAN Specification 2.0)
  • 40 MHz crystal oscillator
  • Antenna options: On-board PCB antenna (ESP32-WROOM-32E) or external antenna via a connector (ESP32-WROOM-32UE)
  • Bluetooth certification: BQB
  • Green certification: REACH/RoHS
  • Supports FreeRTOS with LwIP, TLS 1.2 with hardware acceleration
  • Secure (encrypted) over the air (OTA) upgrade

Applications:

  • Generic Low-power IoT Sensor Hub
  • Generic Low-power IoT Data Loggers
  • Cameras for Video Streaming
  • Over-the-top (OTT) Devices
  • Speech Recognition
  • Image Recognition
  • Mesh Network
  • Home Automation
  • Smart Building
  • Industrial Automation
  • Smart Agriculture
  • Audio Applications
  • Health Care Applications
  • Wi-Fi-enabled Toys
  • Wearable Electronics
  • Retail & Catering

Features

CPU and OnChip Memory

  • ESP32-D0WD-V3 or ESP32-D0WDR2-V3 embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz
  • 448 KB ROM
  • 520 KB SRAM
  • 16 KB SRAM in RTC
  • ESP32-D0WDR2-V3 also provides 2 MB PSRAM

WiFi

  • 802.11b/g/n
  • Bit rate: 802.11n up to 150 Mbps
  • A-MPDU and A-MSDU aggregation
  • 0.4 µs guard interval support
  • Center frequency range of operating channel: 2412 ~ 2484 MHz

Bluetooth

  • Bluetooth V4.2 BR/EDR and Bluetooth LE specification
  • Class-1, class-2 and class-3 transmitter
  • AFH
  • CVSD and SBC

Peripherals

• SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI® (compatible with ISO 11898-1, i.e. CAN Specification 2.0)

Integrated Components on Module

  • 40 MHz crystal oscillator
  • 4/8/16 MB SPI flash

Antenna Options

  • ESP32-WROOM-32E: On-board PCB antenna
  • ESP32-WROOM-32UE: external antenna via a connector

Operating Conditions

  • Operating voltage/Power supply: 3.0 ~ 3.6 V
  • Operating ambient temperature:
    • 85 °C version: –40 ~ 85 °C
    • 105 °C version: –40 ~ 105 °C. Note that only the modules embedded with a 4/8 MB flash support this version.

Certification

Reliability Test

• HTOL/HTSL/uHAST/TCT/ESD

Applications

  • Generic Low-power IoT Sensor Hub

  • Generic Low-power IoT Data Loggers

  • Cameras for Video Streaming

  • Over-the-top (OTT) Devices

  • Speech Recognition

  • Image Recognition

  • Mesh Network

  • Home Automation

  • Smart Building

  • Industrial Automation

  • Smart Agriculture

  • Audio Applications

  • Health Care Applications

  • Wi-Fi-enabled Toys

  • Wearable Electronics

  • Retail & Catering Applications

Pin Configuration

The module has 38 pins. See pin definitions in Table 3.

For peripheral pin configurations, please refer to ESP32 Series Datasheet.

Table 3: Pin Definitions

NameNo.Type1Function
GND1PGround
3V32PPower supply
High: On; enables the chip
EN3ILow: Off; the chip shuts down
Note: Do not leave the pin floating.
SENSOR_VP4IGPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN5IGPIO39, ADC1_CH3, RTC_GPIO3
IO346IGPIO34, ADC1_CH6, RTC_GPIO4
IO357IGPIO35, ADC1_CH7, RTC_GPIO5
IO328I/OGPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
IO339I/OGPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output),
ADC1_CH5, TOUCH8, RTC_GPIO8
IO2510I/OGPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO2611I/OGPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO2712I/OGPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO1413I/OGPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,
HS2_CLK, SD_CLK, EMAC_TXD2
IO1214I/OGPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ,
HS2_DATA2, SD_DATA2, EMAC_TXD3
GND15PGround
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID,
IO1316I/OHS2_DATA3, SD_DATA3, EMAC_RX_ER
NC17-See note 2
NC18-See note 2
NC19-See note 2
NC20-See note 2
NC21-See note 2
NC22-See note 2
IO1523I/OGPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13,
HS2_CMD, SD_CMD, EMAC_RXD3
IO224I/OGPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
IO025I/OGPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1,
EMAC_TX_CLK
IO426I/OGPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
IO16327I/OGPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO1728I/OGPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO529I/OGPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
I/OGPIO18, VSPICLK, HS1_DATA7

Name No. Type1 Function IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0 NC 32 - - IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2 TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1 IO23 37 I/O GPIO23, VSPID, HS1_STROBE GND 38 P Ground

Table 3 – cont'd from previous page

Electrical Characteristics

4.1 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 6: Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDD33Power supply voltage–0.33.6V
TST OREStorage temperature–40105°C

* Please see Appendix IO MUX of ESP32 Series Datasheet for IO's power domain.

4.2 Recommended Operating Conditions

Table 7: Recommended Operating Conditions

SymbolParameterTypMaxUnit
VDD33Power supply voltage3.33.6V
IV DDCurrent delivered by external power supplyA
85 °C version85
TOperating ambient temperature
105 °C version
–40105°C

Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 6: Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDD33Power supply voltage–0.33.6V
TST OREStorage temperature–40105°C

* Please see Appendix IO MUX of ESP32 Series Datasheet for IO's power domain.

Recommended Operating Conditions

Table 7: Recommended Operating Conditions

SymbolParameterTypMaxUnit
VDD33Power supply voltage3.33.6V
IV DDCurrent delivered by external power supplyA
85 °C version85
TOperating ambient temperature
105 °C version
–40105°C
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