ESP32-WROOM-32E-N4
ESP32WROOM32E ESP32WROOM32UE
Manufacturer
espressif
Overview
Part: ESP32WROOM32E ESP32WROOM32UE from Espressif
Type: Wi-Fi + Bluetooth + Bluetooth LE MCU module
Key Specs:
- CPU Clock Frequency: up to 240 MHz
- Flash Memory: 4/8/16 MB SPI flash
- SRAM: 520 KB
- ROM: 448 KB
- Operating Voltage: 3.0 ~ 3.6 V
- WiFi Bit Rate (802.11n): up to 150 Mbps
- Operating Ambient Temperature: –40 ~ 85 °C, or –40 ~ 105 °C (for 4/8 MB flash versions)
Features:
- Built around ESP32 series of SoCs (ESP32-D0WD-V3 or ESP32-D0WDR2-V3)
- Xtensa dual-core 32-bit LX6 microprocessor
- 16 KB SRAM in RTC
- 2 MB PSRAM available with ESP32-D0WDR2-V3
- 2.4 GHz WiFi (802.11b/g/n)
- A-MPDU and A-MSDU aggregation
- 0.4 µs guard interval support
- Bluetooth V4.2 BR/EDR and Bluetooth LE specification
- Class-1, class-2 and class-3 transmitter
- AFH, CVSD and SBC support
- Rich set of peripherals: SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI® (compatible with ISO 11898-1, i.e. CAN Specification 2.0)
- 40 MHz crystal oscillator
- Antenna options: On-board PCB antenna (ESP32-WROOM-32E) or external antenna via a connector (ESP32-WROOM-32UE)
- Bluetooth certification: BQB
- Green certification: REACH/RoHS
- Supports FreeRTOS with LwIP, TLS 1.2 with hardware acceleration
- Secure (encrypted) over the air (OTA) upgrade
Applications:
- Generic Low-power IoT Sensor Hub
- Generic Low-power IoT Data Loggers
- Cameras for Video Streaming
- Over-the-top (OTT) Devices
- Speech Recognition
- Image Recognition
- Mesh Network
- Home Automation
- Smart Building
- Industrial Automation
- Smart Agriculture
- Audio Applications
- Health Care Applications
- Wi-Fi-enabled Toys
- Wearable Electronics
- Retail & Catering
Features
CPU and OnChip Memory
- ESP32-D0WD-V3 or ESP32-D0WDR2-V3 embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz
- 448 KB ROM
- 520 KB SRAM
- 16 KB SRAM in RTC
- ESP32-D0WDR2-V3 also provides 2 MB PSRAM
WiFi
- 802.11b/g/n
- Bit rate: 802.11n up to 150 Mbps
- A-MPDU and A-MSDU aggregation
- 0.4 µs guard interval support
- Center frequency range of operating channel: 2412 ~ 2484 MHz
Bluetooth
- Bluetooth V4.2 BR/EDR and Bluetooth LE specification
- Class-1, class-2 and class-3 transmitter
- AFH
- CVSD and SBC
Peripherals
• SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI® (compatible with ISO 11898-1, i.e. CAN Specification 2.0)
Integrated Components on Module
- 40 MHz crystal oscillator
- 4/8/16 MB SPI flash
Antenna Options
- ESP32-WROOM-32E: On-board PCB antenna
- ESP32-WROOM-32UE: external antenna via a connector
Operating Conditions
- Operating voltage/Power supply: 3.0 ~ 3.6 V
- Operating ambient temperature:
- 85 °C version: –40 ~ 85 °C
- 105 °C version: –40 ~ 105 °C. Note that only the modules embedded with a 4/8 MB flash support this version.
Certification
- Bluetooth certification: BQB
- RF certification: See certificates for ESP32-WROOM-32E and ESP32-WROOM-32UE
- Green certification: REACH/RoHS
Reliability Test
• HTOL/HTSL/uHAST/TCT/ESD
Applications
-
Generic Low-power IoT Sensor Hub
-
Generic Low-power IoT Data Loggers
-
Cameras for Video Streaming
-
Over-the-top (OTT) Devices
-
Speech Recognition
-
Image Recognition
-
Mesh Network
-
Home Automation
-
Smart Building
-
Industrial Automation
-
Smart Agriculture
-
Audio Applications
-
Health Care Applications
-
Wi-Fi-enabled Toys
-
Wearable Electronics
-
Retail & Catering Applications
Pin Configuration
The module has 38 pins. See pin definitions in Table 3.
For peripheral pin configurations, please refer to ESP32 Series Datasheet.
Table 3: Pin Definitions
| Name | No. | Type1 | Function |
|---|---|---|---|
| GND | 1 | P | Ground |
| 3V3 | 2 | P | Power supply |
| High: On; enables the chip | |||
| EN | 3 | I | Low: Off; the chip shuts down |
| Note: Do not leave the pin floating. | |||
| SENSOR_VP | 4 | I | GPIO36, ADC1_CH0, RTC_GPIO0 |
| SENSOR_VN | 5 | I | GPIO39, ADC1_CH3, RTC_GPIO3 |
| IO34 | 6 | I | GPIO34, ADC1_CH6, RTC_GPIO4 |
| IO35 | 7 | I | GPIO35, ADC1_CH7, RTC_GPIO5 |
| IO32 | 8 | I/O | GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 |
| IO33 | 9 | I/O | GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 |
| IO25 | 10 | I/O | GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 |
| IO26 | 11 | I/O | GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 |
| IO27 | 12 | I/O | GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV |
| IO14 | 13 | I/O | GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 |
| IO12 | 14 | I/O | GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 |
| GND | 15 | P | Ground |
| GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, | |||
| IO13 | 16 | I/O | HS2_DATA3, SD_DATA3, EMAC_RX_ER |
| NC | 17 | - | See note 2 |
| NC | 18 | - | See note 2 |
| NC | 19 | - | See note 2 |
| NC | 20 | - | See note 2 |
| NC | 21 | - | See note 2 |
| NC | 22 | - | See note 2 |
| IO15 | 23 | I/O | GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 |
| IO2 | 24 | I/O | GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 |
| IO0 | 25 | I/O | GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK |
| IO4 | 26 | I/O | GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER |
| IO163 | 27 | I/O | GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT |
| IO17 | 28 | I/O | GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 |
| IO5 | 29 | I/O | GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK |
| I/O | GPIO18, VSPICLK, HS1_DATA7 |
Name No. Type1 Function IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0 NC 32 - - IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2 TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1 IO23 37 I/O GPIO23, VSPID, HS1_STROBE GND 38 P Ground
Table 3 – cont'd from previous page
Electrical Characteristics
4.1 Absolute Maximum Ratings
Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 6: Absolute Maximum Ratings
| Symbol | Parameter | Min | Max | Unit |
|---|---|---|---|---|
| VDD33 | Power supply voltage | –0.3 | 3.6 | V |
| TST ORE | Storage temperature | –40 | 105 | °C |
* Please see Appendix IO MUX of ESP32 Series Datasheet for IO's power domain.
4.2 Recommended Operating Conditions
Table 7: Recommended Operating Conditions
| Symbol | Parameter | Typ | Max | Unit | ||
|---|---|---|---|---|---|---|
| VDD33 | Power supply voltage | 3.3 | 3.6 | V | ||
| IV DD | Current delivered by external power supply | — | — | A | ||
| 85 °C version | 85 | |||||
| T | Operating ambient temperature 105 °C version | –40 | — | 105 | °C |
Absolute Maximum Ratings
Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 6: Absolute Maximum Ratings
| Symbol | Parameter | Min | Max | Unit |
|---|---|---|---|---|
| VDD33 | Power supply voltage | –0.3 | 3.6 | V |
| TST ORE | Storage temperature | –40 | 105 | °C |
* Please see Appendix IO MUX of ESP32 Series Datasheet for IO's power domain.
Recommended Operating Conditions
Table 7: Recommended Operating Conditions
| Symbol | Parameter | Typ | Max | Unit | ||
|---|---|---|---|---|---|---|
| VDD33 | Power supply voltage | 3.3 | 3.6 | V | ||
| IV DD | Current delivered by external power supply | — | — | A | ||
| 85 °C version | 85 | |||||
| T | Operating ambient temperature 105 °C version | –40 | — | 105 | °C |
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