ESP32-WROVER
Wi-Fi + Bluetooth + Bluetooth LE MCU ModuleThe ESP32-WROVER is a wi-fi + bluetooth + bluetooth le mcu module from Espressif Systems. View the full ESP32-WROVER datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Official ESP32-WROVER datasheet (PDF) — the source this page was extracted from.
Manufacturer
Espressif SystemsCategory
RF / WirelessESP32-WROVER Key Specifications
| Parameter | Value |
|---|---|
| CPU | Dual-core, 80 MHz to 240 MHz adjustable |
| Wi-Fi | 802.11 b/g/n, up to 150 Mbps |
| Bluetooth | v4.2 BR/EDR and Bluetooth LE |
| Interfaces | SD card, UART, SPI, SDIO, I2C, I2S, LED PWM, Motor PWM, IR, pulse counter, GPIO, capacitive touch, ADC, DAC, TWAI (CAN 2.0) |
| Output Power | 20 dBm at antenna |
| Flash Options | 4 MB, 8 MB, 16 MB (Quad SPI) |
| PSRAM Options | 2 MB or 8 MB (Quad SPI) |
| Sleep Current | <5 µA |
| Supply Voltage | 3.0V to 3.6V |
| Integrated Crystal | 40 MHz |
| Package Dimensions | 18.00 x 31.40 x 3.30 mm (±0.15 mm) |
| Operating Temperature | -40°C to 85°C |
| Wi-Fi Frequency Range | 2412 MHz to 2484 MHz |
| Moisture Sensitivity Level | MSL 3 |
| Bluetooth Receiver Sensitivity | -97 dBm (NZIF receiver) |
| Minimum Supply Current Capability | 500 mA |
ESP32-WROVER Overview
Part: ESP32-WROVER-E & ESP32-WROVER-IE — Espressif Type: Wi-Fi + Bluetooth + Bluetooth LE MCU Module
Description: Powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU modules based on the ESP32-D0WD-V3 or ESP32-D0WDR2-V3 chip, featuring two Xtensa 32-bit LX6 microprocessors, adjustable CPU clock from 80 MHz to 240 MHz, integrated 4 MB to 16 MB Quad SPI Flash, and 2 MB or 8 MB Quad SPI PSRAM.
Operating Conditions:
- Supply voltage: 3.0–3.6 V
- Operating temperature: -40 to 85 °C
- Minimum current delivered by power supply: 0.5 A
Absolute Maximum Ratings:
- Max supply voltage: 3.6 V
- Max continuous current: 1100 mA (Cumulative IO output current)
- Max junction/storage temperature: 105 °C
Key Specs:
- CPU: Two Xtensa 32-bit LX6 microprocessors
- CPU clock frequency: 80 MHz to 240 MHz
- Internal ROM: 448 KB
- On-chip SRAM: 520 KB
- Wi-Fi Protocols: 802.11 b/g/n (up to 150 Mbps)
- Bluetooth Protocols: Bluetooth v4.2 BR/EDR and Bluetooth LE
- Bluetooth LE Receiver Sensitivity: -97 dBm (NZIF receiver)
- Integrated crystal: 40 MHz
Features:
- Wi-Fi (802.11 b/g/n)
- Bluetooth v4.2 BR/EDR and Bluetooth LE
- Integrated 4 MB, 8 MB, or 16 MB Quad SPI Flash
- Integrated 2 MB or 8 MB Quad SPI PSRAM
- Rich set of peripherals: SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI (CAN Specification 2.0)
- Low-power coprocessor
- Sleep current less than 5 μA
- Secure (encrypted) over the air (OTA) upgrade support
- FreeRTOS with LwIP operating system
- TLS 1.2 with hardware acceleration
Applications:
- Low-power sensor networks
- Voice encoding
- Music streaming
- MP3 decoding
- Battery powered and wearable electronics
Package:
- ESP32-WROVER-E: 18.0 x 31.4 x 3.3 mm (with PCB antenna)
- ESP32-WROVER-IE: 18.0 x 31.4 x 3.3 mm (with external antenna connector)
ESP32-WROVER Pin Configuration
The module has 38 pins. See pin definitions in Table 4.
Table 4: Pin Definitions
| Name | No. | Type | Function |
|---|---|---|---|
| GND | 1 | P | Ground |
| 3V3 | 2 | P | Power supply |
| EN | 3 | I | Module-enable signal. Active high. |
| SENSOR_VP | 4 | I | GPIO36, ADC1_CH0, RTC_GPIO0 |
| SENSOR_VN | 5 | I | GPIO39, ADC1_CH3, RTC_GPIO3 |
| IO34 | 6 | I | GPIO34, ADC1_CH6, RTC_GPIO4 |
| IO35 | 7 | I | GPIO35, ADC1_CH7, RTC_GPIO5 |
| IO32 | 8 | I/O | GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 |
| IO33 | 9 | I/O | GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 |
| IO25 | 10 | I/O | GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 |
| IO26 | 11 | I/O | GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 |
| IO27 | 12 | I/O | GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV |
| IO14 | 13 | I/O | GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 |
| IO12 | 14 | I/O | GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 |
| GND | 15 | P | Ground |
| IO13 | 16 | I/O | GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER |
| NC * | 17 | - | - |
| NC * | 18 | - | - |
| NC * | 19 | - | - |
| NC * | 20 | - | - |
| NC * | 21 | - | - |
| NC * | 22 | - | - |
| IO15 | 23 | - | GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 |
| IO2 | 24 | I/O | GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 |
| IO0 | 25 | I/O | GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK |
| IO4 | 26 | I/O | GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER |
| NC | 27 | - | - |
| NC | 28 | - | - |
| IO5 | 29 | I/O | GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK |
| IO18 | 30 | I/O | GPIO18, VSPICLK, HS1_DATA7 |
| IO19 | 31 | I/O | GPIO19, VSPIQ, U0CTS, EMAC_TXD0 |
| NC | 32 | - | - |
| IO21 | 33 | I/O | GPIO21, VSPIHD, EMAC_TX_EN |
| Name | No. | Type | Function |
|---|---|---|---|
| RXD0 | 34 | I/O | GPIO3, U0RXD, CLK_OUT2 |
| TXD0 | 35 | I/O | GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 |
| IO22 | 36 | I/O | GPIO22, VSPIWP, U0RTS, EMAC_TXD1 |
| IO23 | 37 | I/O | GPIO23, VSPID, HS1_STROBE |
| GND | 38 | P | Ground |
ESP32-WROVER Electrical Characteristics
Table 9: DC Characteristics (3.3 V, 25 °C)
| Symbol | Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| C IN | Pin capacitance | - | 2 | - | pF |
| V IH | High-level input voltage | 0.75×VDD 1 | - | VDD 1 +0.3 | V |
| V IL | Low-level input voltage | -0.3 | - | 0.25×VDD 1 | V |
| I IH | High-level input current | - | - | 50 | nA |
| I IL | Low-level input current | - | - | 50 | nA |
| V OH | High-level output voltage | 0.8×VDD 1 | - | - | V |
| V OL | Low-level output voltage | - | - | 0.1×VDD 1 | V |
| Symbol | Parameter | Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| I OH | High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum) | VDD3P3_CPU power domain 1 , 2 | - | 40 | - | mA |
| I OH | High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum) | VDD3P3_RTC power domain 1 , 2 | - | 40 | - | mA |
| I OH | High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum) | VDD_SDIO power domain 1 , 3 | - | 20 | - | mA |
| I OL | Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum) | Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum) | - | 28 | - | mA |
| R PU | Resistance of internal pull-up resistor | Resistance of internal pull-up resistor | - | 45 | - | k Ω |
| R PD | Resistance of internal pull-down resistor | Resistance of internal pull-down resistor | - | 45 | - | k Ω |
| V IL _ nRST | Low-level input voltage of CHIP_PU to shut down the chip | Low-level input voltage of CHIP_PU to shut down the chip | - | - | 0.6 | V |
ESP32-WROVER Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions.
Table 7: Absolute Maximum Ratings
| Symbol | Parameter | Min | Max | Unit |
|---|---|---|---|---|
| VDD33 | Power supply voltage | -0.3 | 3.6 | V |
| I output 1 | Cumulative IO output current | - | 1100 | mA |
| T store | Storage temperature | -40 | 105 | °C |
- Please see Appendix IO_MUX in ESP32 Datasheet for IO's power domain.
ESP32-WROVER Recommended Operating Conditions
Table 8: Recommended Operating Conditions
| Symbol | Parameter | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| VDD33 | Power supply voltage | 3 | 3.3 | 3.6 | V |
| I VDD | Current delivered by external power supply | 0.5 | - | - | A |
| T | Operating temperature | -40 | - | 85 | °C |
ESP32-WROVER Package Information
This section provides the following resources for your reference:
- Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 12 Recommended PCB Land Pattern .
- Source files of recommended PCB land patterns to measure dimensions not covered in Figure 12. You can view the source files for ESP32-WROVER-E and ESP32-WROVER-IE with Autodesk Viewer.
- 3D models of ESP32-WROVER-E and ESP32-WROVER-IE. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt).
Figure 12: Recommended PCB Land Pattern
Variants on the same datasheet
These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.
| Part Number | Manufacturer | Package |
|---|---|---|
| ESP32 | Espressif Systems | ESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm) |
| ESP32-D0WD-V3 | Espressif Systems | 48-VFQFN Exposed Pad |
| ESP32-D0WD-V3/ESP32 | Espressif Systems | — |
| ESP32-WROVER-E-N16R2 | Espressif Systems | |
| ESP32-WROVER-E-N16R8 | Espressif Systems | — |
| ESP32-WROVER-E-N4R2 | Espressif Systems | — |
| ESP32-WROVER-E-N4R8 | Espressif Systems | 38-SMD Module |
| ESP32-WROVER-E-N8R2 | Espressif Systems | — |
| ESP32-WROVER-E-N8R8 | Espressif Systems | |
| ESP32-WROVER-IE | Espressif Systems | 18.00 mm x 31.40 mm x 3.30 mm |
| ESP32-WROVER-IE-N16R2 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
| ESP32-WROVER-IE-N16R8 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
| ESP32-WROVER-IE-N4R2 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
| ESP32-WROVER-IE-N4R8 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
| ESP32-WROVER-IE-N8R2 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
| ESP32-WROVER-IE-N8R8 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
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All RF / Wireless datasheetsAll Espressif Systems datasheets (86)
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