ESP32-WROVER-E-N16R8
Wi-Fi + Bluetooth + Bluetooth LE MCU ModuleThe ESP32-WROVER-E-N16R8 is a wi-fi + bluetooth + bluetooth le mcu module from Espressif Systems. View the full ESP32-WROVER-E-N16R8 datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Espressif Systems
Category
Wi-Fi + Bluetooth + Bluetooth LE MCU Module
Overview
Part: ESP32-WROVER-E & ESP32-WROVER-IE — Espressif Type: Wi-Fi + Bluetooth + Bluetooth LE MCU Module
Description: Powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU modules based on the ESP32-D0WD-V3 or ESP32-D0WDR2-V3 chip, featuring two Xtensa 32-bit LX6 microprocessors, adjustable CPU clock from 80 MHz to 240 MHz, integrated 4 MB to 16 MB Quad SPI Flash, and 2 MB or 8 MB Quad SPI PSRAM.
Operating Conditions:
- Supply voltage: 3.0–3.6 V
- Operating temperature: -40 to 85 °C
- Minimum current delivered by power supply: 0.5 A
Absolute Maximum Ratings:
- Max supply voltage: 3.6 V
- Max continuous current: 1100 mA (Cumulative IO output current)
- Max junction/storage temperature: 105 °C
Key Specs:
- CPU: Two Xtensa 32-bit LX6 microprocessors
- CPU clock frequency: 80 MHz to 240 MHz
- Internal ROM: 448 KB
- On-chip SRAM: 520 KB
- Wi-Fi Protocols: 802.11 b/g/n (up to 150 Mbps)
- Bluetooth Protocols: Bluetooth v4.2 BR/EDR and Bluetooth LE
- Bluetooth LE Receiver Sensitivity: -97 dBm (NZIF receiver)
- Integrated crystal: 40 MHz
Features:
- Wi-Fi (802.11 b/g/n)
- Bluetooth v4.2 BR/EDR and Bluetooth LE
- Integrated 4 MB, 8 MB, or 16 MB Quad SPI Flash
- Integrated 2 MB or 8 MB Quad SPI PSRAM
- Rich set of peripherals: SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI (CAN Specification 2.0)
- Low-power coprocessor
- Sleep current less than 5 μA
- Secure (encrypted) over the air (OTA) upgrade support
- FreeRTOS with LwIP operating system
- TLS 1.2 with hardware acceleration
Applications:
- Low-power sensor networks
- Voice encoding
- Music streaming
- MP3 decoding
- Battery powered and wearable electronics
Package:
- ESP32-WROVER-E: 18.0 x 31.4 x 3.3 mm (with PCB antenna)
- ESP32-WROVER-IE: 18.0 x 31.4 x 3.3 mm (with external antenna connector)
Pin Configuration
The module has 38 pins. See pin definitions in Table 4.
Table 4: Pin Definitions
| Name | No. | Type | Function |
|---|---|---|---|
| GND | 1 | P | Ground |
| 3V3 | 2 | P | Power supply |
| EN | 3 | I | Module-enable signal. Active high. |
| SENSOR_VP | 4 | I | GPIO36, ADC1_CH0, RTC_GPIO0 |
| SENSOR_VN | 5 | I | GPIO39, ADC1_CH3, RTC_GPIO3 |
| IO34 | 6 | I | GPIO34, ADC1_CH6, RTC_GPIO4 |
| IO35 | 7 | I | GPIO35, ADC1_CH7, RTC_GPIO5 |
| IO32 | 8 | I/O | GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 |
| IO33 | 9 | I/O | GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 |
| IO25 | 10 | I/O | GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 |
| IO26 | 11 | I/O | GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 |
| IO27 | 12 | I/O | GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV |
| IO14 | 13 | I/O | GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 |
| IO12 | 14 | I/O | GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 |
| GND | 15 | P | Ground |
| IO13 | 16 | I/O | GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER |
| NC * | 17 | - | - |
| NC * | 18 | - | - |
| NC * | 19 | - | - |
| NC * | 20 | - | - |
| NC * | 21 | - | - |
| NC * | 22 | - | - |
| IO15 | 23 | - | GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 |
| IO2 | 24 | I/O | GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 |
| IO0 | 25 | I/O | GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK |
| IO4 | 26 | I/O | GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER |
| NC | 27 | - | - |
| NC | 28 | - | - |
| IO5 | 29 | I/O | GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK |
| IO18 | 30 | I/O | GPIO18, VSPICLK, HS1_DATA7 |
| IO19 | 31 | I/O | GPIO19, VSPIQ, U0CTS, EMAC_TXD0 |
| NC | 32 | - | - |
| IO21 | 33 | I/O | GPIO21, VSPIHD, EMAC_TX_EN |
| Name | No. | Type | Function |
|---|---|---|---|
| RXD0 | 34 | I/O | GPIO3, U0RXD, CLK_OUT2 |
| TXD0 | 35 | I/O | GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 |
| IO22 | 36 | I/O | GPIO22, VSPIWP, U0RTS, EMAC_TXD1 |
| IO23 | 37 | I/O | GPIO23, VSPID, HS1_STROBE |
| GND | 38 | P | Ground |
Electrical Characteristics
Table 9: DC Characteristics (3.3 V, 25 °C)
| Symbol | Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| C IN | Pin capacitance | - | 2 | - | pF |
| V IH | High-level input voltage | 0.75×VDD 1 | - | VDD 1 +0.3 | V |
| V IL | Low-level input voltage | -0.3 | - | 0.25×VDD 1 | V |
| I IH | High-level input current | - | - | 50 | nA |
| I IL | Low-level input current | - | - | 50 | nA |
| V OH | High-level output voltage | 0.8×VDD 1 | - | - | V |
| V OL | Low-level output voltage | - | - | 0.1×VDD 1 | V |
| Symbol | Parameter | Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| I OH | High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum) | VDD3P3_CPU power domain 1 , 2 | - | 40 | - | mA |
| I OH | High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum) | VDD3P3_RTC power domain 1 , 2 | - | 40 | - | mA |
| I OH | High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum) | VDD_SDIO power domain 1 , 3 | - | 20 | - | mA |
| I OL | Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum) | Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum) | - | 28 | - | mA |
| R PU | Resistance of internal pull-up resistor | Resistance of internal pull-up resistor | - | 45 | - | k Ω |
| R PD | Resistance of internal pull-down resistor | Resistance of internal pull-down resistor | - | 45 | - | k Ω |
| V IL _ nRST | Low-level input voltage of CHIP_PU to shut down the chip | Low-level input voltage of CHIP_PU to shut down the chip | - | - | 0.6 | V |
Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions.
Table 7: Absolute Maximum Ratings
| Symbol | Parameter | Min | Max | Unit |
|---|---|---|---|---|
| VDD33 | Power supply voltage | -0.3 | 3.6 | V |
| I output 1 | Cumulative IO output current | - | 1100 | mA |
| T store | Storage temperature | -40 | 105 | °C |
- Please see Appendix IO_MUX in ESP32 Datasheet for IO's power domain.
Recommended Operating Conditions
Table 8: Recommended Operating Conditions
| Symbol | Parameter | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| VDD33 | Power supply voltage | 3 | 3.3 | 3.6 | V |
| I VDD | Current delivered by external power supply | 0.5 | - | - | A |
| T | Operating temperature | -40 | - | 85 | °C |
Package Information
This section provides the following resources for your reference:
- Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 12 Recommended PCB Land Pattern .
- Source files of recommended PCB land patterns to measure dimensions not covered in Figure 12. You can view the source files for ESP32-WROVER-E and ESP32-WROVER-IE with Autodesk Viewer.
- 3D models of ESP32-WROVER-E and ESP32-WROVER-IE. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt).
Figure 12: Recommended PCB Land Pattern
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| ESP32 | Espressif Systems | ESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm) |
| ESP32-D0WD-V3 | Espressif Systems | 48-VFQFN Exposed Pad |
| ESP32-D0WD-V3/ESP32 | Espressif Systems | — |
| ESP32-WROVER | Espressif Systems | — |
| ESP32-WROVER-E-N16R2 | Espressif Systems | |
| ESP32-WROVER-E-N4R2 | Espressif Systems | — |
| ESP32-WROVER-E-N4R8 | Espressif Systems | 38-SMD Module |
| ESP32-WROVER-E-N8R2 | Espressif Systems | — |
| ESP32-WROVER-E-N8R8 | Espressif Systems | |
| ESP32-WROVER-IE | Espressif Systems | 18.00 mm x 31.40 mm x 3.30 mm |
| ESP32-WROVER-IE-N16R2 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
| ESP32-WROVER-IE-N16R8 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
| ESP32-WROVER-IE-N4R2 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
| ESP32-WROVER-IE-N4R8 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
| ESP32-WROVER-IE-N8R2 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
| ESP32-WROVER-IE-N8R8 | Espressif Systems | Module (18.0 x 31.4 x 3.3 mm) with external antenna connector |
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.
Get structured datasheet data via API
Get started free