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ESP32-WROVER-IE

Wi-Fi + Bluetooth + Bluetooth LE MCU Module

The ESP32-WROVER-IE is a wi-fi + bluetooth + bluetooth le mcu module from Espressif Systems. View the full ESP32-WROVER-IE datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.

Manufacturer

Espressif Systems

Category

Wi-Fi + Bluetooth + Bluetooth LE MCU Module

Package

Module (18.0 x 31.4 x 3.3 mm) with external antenna connector

Key Specifications

ParameterValue
Wi-Fi Protocols802.11 b/g/n
Cpu Clock Frequency80 MHz to 240 MHz
Supply Voltage Range3.0 V to 3.6 V
Wi-Fi Frequency Range2412 MHz to 2484 MHz
Operating Temperature Range-40 °C to 85 °C

Overview

Part: ESP32-WROVER-E & ESP32-WROVER-IE — Espressif Type: Wi-Fi + Bluetooth + Bluetooth LE MCU Module

Description: Powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU modules based on the ESP32-D0WD-V3 or ESP32-D0WDR2-V3 chip, featuring two Xtensa 32-bit LX6 microprocessors, adjustable CPU clock from 80 MHz to 240 MHz, integrated 4 MB to 16 MB Quad SPI Flash, and 2 MB or 8 MB Quad SPI PSRAM.

Operating Conditions:

  • Supply voltage: 3.0–3.6 V
  • Operating temperature: -40 to 85 °C
  • Minimum current delivered by power supply: 0.5 A

Absolute Maximum Ratings:

  • Max supply voltage: 3.6 V
  • Max continuous current: 1100 mA (Cumulative IO output current)
  • Max junction/storage temperature: 105 °C

Key Specs:

  • CPU: Two Xtensa 32-bit LX6 microprocessors
  • CPU clock frequency: 80 MHz to 240 MHz
  • Internal ROM: 448 KB
  • On-chip SRAM: 520 KB
  • Wi-Fi Protocols: 802.11 b/g/n (up to 150 Mbps)
  • Bluetooth Protocols: Bluetooth v4.2 BR/EDR and Bluetooth LE
  • Bluetooth LE Receiver Sensitivity: -97 dBm (NZIF receiver)
  • Integrated crystal: 40 MHz

Features:

  • Wi-Fi (802.11 b/g/n)
  • Bluetooth v4.2 BR/EDR and Bluetooth LE
  • Integrated 4 MB, 8 MB, or 16 MB Quad SPI Flash
  • Integrated 2 MB or 8 MB Quad SPI PSRAM
  • Rich set of peripherals: SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI (CAN Specification 2.0)
  • Low-power coprocessor
  • Sleep current less than 5 μA
  • Secure (encrypted) over the air (OTA) upgrade support
  • FreeRTOS with LwIP operating system
  • TLS 1.2 with hardware acceleration

Applications:

  • Low-power sensor networks
  • Voice encoding
  • Music streaming
  • MP3 decoding
  • Battery powered and wearable electronics

Package:

  • ESP32-WROVER-E: 18.0 x 31.4 x 3.3 mm (with PCB antenna)
  • ESP32-WROVER-IE: 18.0 x 31.4 x 3.3 mm (with external antenna connector)

Pin Configuration

ESP32-WROVER-IE Pinout

Package: 18.00 mm × 31.40 mm × 3.30 mm (38-pin module)

Pin NumberPin NameTypeFunction
1GNDPGround
23V3PPower supply
3ENIModule-enable signal. Active high.
4SENSOR_VPIGPIO36, ADC1_CH0, RTC_GPIO0
5SENSOR_VNIGPIO39, ADC1_CH3, RTC_GPIO3
6IO34IGPIO34, ADC1_CH6, RTC_GPIO4
7IO35IGPIO35, ADC1_CH7, RTC_GPIO5
8IO32I/OGPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9
9IO33I/OGPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8
10IO25I/OGPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
11IO26I/OGPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
12IO27I/OGPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
13IO14I/OGPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2
14IO12I/OGPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3
15GNDPGround
16IO13I/OGPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER
17NCNo Connect
18NCNo Connect
19NCNo Connect
20NCNo Connect
21NCNo Connect
22NCNo Connect
23IO15I/OGPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3
24IO2I/OGPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0
25IO0I/OGPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
26IO4I/OGPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER
27NCNo Connect
28NCNo Connect
29IO5I/OGPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
30IO18I/OGPIO18, VSPICLK, HS1_DATA7
31IO19I/OGPIO19, VSPIQ, U0CTS, EMAC_TXD0
32NCNo Connect
33IO21I/OGPIO21, VSPIHD, EMAC_TX_EN
34RXD0I/OGPIO3, U0RXD, CLK_OUT2
35TXD0I/OGPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
36IO22I/OGPIO22, VSPIWP, U0RTS, EMAC_TXD1
37IO23I/OGPIO23, VSPID, HS1_STROBE
38GNDPGround

Notes

  • Pin numbers extracted directly from Table 4 in the datasheet.
  • The module contains 38 pins total: 3 power/ground pins, 28 GPIO pins with multiple alternate functions, 2 analog input-only pins (SENSOR_VP, SENSOR_VN), 1 enable pin, and 4 no-connect pins.
  • GPIO pins support multiple peripheral functions including ADC, DAC, SPI, UART, touch sensing, and Ethernet MAC functions.
  • Pins 17–22 and 27–28, 32 are marked as NC (No Connect) and should not be used.

Electrical Characteristics

Table 9: DC Characteristics (3.3 V, 25 °C)

SymbolParameterMinTypMaxUnit
C INPin capacitance-2-pF
V IHHigh-level input voltage0.75×VDD 1-VDD 1 +0.3V
V ILLow-level input voltage-0.3-0.25×VDD 1V
I IHHigh-level input current--50nA
I ILLow-level input current--50nA
V OHHigh-level output voltage0.8×VDD 1--V
V OLLow-level output voltage--0.1×VDD 1V
SymbolParameterParameterMinTypMaxUnit
I OHHigh-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)VDD3P3_CPU power domain 1 , 2-40-mA
I OHHigh-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)VDD3P3_RTC power domain 1 , 2-40-mA
I OHHigh-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)VDD_SDIO power domain 1 , 3-20-mA
I OLLow-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum)Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum)-28-mA
R PUResistance of internal pull-up resistorResistance of internal pull-up resistor-45-k Ω
R PDResistance of internal pull-down resistorResistance of internal pull-down resistor-45-k Ω
V IL _ nRSTLow-level input voltage of CHIP_PU to shut down the chipLow-level input voltage of CHIP_PU to shut down the chip--0.6V

Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions.

Table 7: Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDD33Power supply voltage-0.33.6V
I output 1Cumulative IO output current-1100mA
T storeStorage temperature-40105°C
  1. Please see Appendix IO_MUX in ESP32 Datasheet for IO's power domain.

Recommended Operating Conditions

Table 8: Recommended Operating Conditions

SymbolParameterMinTypicalMaxUnit
VDD33Power supply voltage33.33.6V
I VDDCurrent delivered by external power supply0.5--A
TOperating temperature-40-85°C

Package Information

This section provides the following resources for your reference:

  • Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 12 Recommended PCB Land Pattern .
  • Source files of recommended PCB land patterns to measure dimensions not covered in Figure 12. You can view the source files for ESP32-WROVER-E and ESP32-WROVER-IE with Autodesk Viewer.
  • 3D models of ESP32-WROVER-E and ESP32-WROVER-IE. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt).

Figure 12: Recommended PCB Land Pattern

Ordering Information

Ordering CodePackageTemperature RangePacking
ESP32-WROVER-IE-N4R8Module (18.0 x 31.4 x 3.3 mm) with external antenna connector-40 ~ 85 °Cnull
ESP32-WROVER-IE-N8R8Module (18.0 x 31.4 x 3.3 mm) with external antenna connector-40 ~ 85 °Cnull
ESP32-WROVER-IE-N16R8Module (18.0 x 31.4 x 3.3 mm) with external antenna connector-40 ~ 85 °Cnull
ESP32-WROVER-IE-N4R2Module (18.0 x 31.4 x 3.3 mm) with external antenna connector-40 ~ 85 °Cnull
ESP32-WROVER-IE-N8R2Module (18.0 x 31.4 x 3.3 mm) with external antenna connector-40 ~ 85 °Cnull
ESP32-WROVER-IE-N16R2Module (18.0 x 31.4 x 3.3 mm) with external antenna connector-40 ~ 85 °Cnull

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
ESP32Espressif SystemsESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm)
ESP32-D0WD-V3Espressif Systems48-VFQFN Exposed Pad
ESP32-D0WD-V3/ESP32Espressif Systems
ESP32-WROVEREspressif Systems
ESP32-WROVER-E-N16R2Espressif Systems
ESP32-WROVER-E-N16R8Espressif Systems
ESP32-WROVER-E-N4R2Espressif Systems
ESP32-WROVER-E-N4R8Espressif Systems38-SMD Module
ESP32-WROVER-E-N8R2Espressif Systems
ESP32-WROVER-E-N8R8Espressif Systems
ESP32-WROVER-IE-N16R2Espressif SystemsModule (18.0 x 31.4 x 3.3 mm) with external antenna connector
ESP32-WROVER-IE-N16R8Espressif SystemsModule (18.0 x 31.4 x 3.3 mm) with external antenna connector
ESP32-WROVER-IE-N4R2Espressif SystemsModule (18.0 x 31.4 x 3.3 mm) with external antenna connector
ESP32-WROVER-IE-N4R8Espressif SystemsModule (18.0 x 31.4 x 3.3 mm) with external antenna connector
ESP32-WROVER-IE-N8R2Espressif SystemsModule (18.0 x 31.4 x 3.3 mm) with external antenna connector
ESP32-WROVER-IE-N8R8Espressif SystemsModule (18.0 x 31.4 x 3.3 mm) with external antenna connector
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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