ESP32-WROVER-IE

Part: ESP32-WROVER-E & ESP32-WROVER-IE — Espressif Type: Wi-Fi + Bluetooth + Bluetooth LE MCU Module

Description: Powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU modules based on the ESP32-D0WD-V3 or ESP32-D0WDR2-V3 chip, featuring two Xtensa 32-bit LX6 microprocessors, adjustable CPU clock from 80 MHz to 240 MHz, integrated 4 MB to 16 MB Quad SPI Flash, and 2 MB or 8 MB Quad SPI PSRAM.

Operating Conditions:

• Supply voltage: 3.0–3.6 V
• Operating temperature: -40 to 85 °C
• Minimum current delivered by power supply: 0.5 A

Absolute Maximum Ratings:

• Max supply voltage: 3.6 V
• Max continuous current: 1100 mA (Cumulative IO output current)
• Max junction/storage temperature: 105 °C

Key Specs:

• CPU: Two Xtensa 32-bit LX6 microprocessors
• CPU clock frequency: 80 MHz to 240 MHz
• Internal ROM: 448 KB
• On-chip SRAM: 520 KB
• Wi-Fi Protocols: 802.11 b/g/n (up to 150 Mbps)
• Bluetooth Protocols: Bluetooth v4.2 BR/EDR and Bluetooth LE
• Bluetooth LE Receiver Sensitivity: -97 dBm (NZIF receiver)
• Integrated crystal: 40 MHz

Features:

• Wi-Fi (802.11 b/g/n)
• Bluetooth v4.2 BR/EDR and Bluetooth LE
• Integrated 4 MB, 8 MB, or 16 MB Quad SPI Flash
• Integrated 2 MB or 8 MB Quad SPI PSRAM
• Rich set of peripherals: SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI (CAN Specification 2.0)
• Low-power coprocessor
• Sleep current less than 5 μA
• Secure (encrypted) over the air (OTA) upgrade support
• FreeRTOS with LwIP operating system
• TLS 1.2 with hardware acceleration

Applications:

• Low-power sensor networks
• Voice encoding
• Music streaming
• MP3 decoding
• Battery powered and wearable electronics

Package:

• ESP32-WROVER-E: 18.0 x 31.4 x 3.3 mm (with PCB antenna)
• ESP32-WROVER-IE: 18.0 x 31.4 x 3.3 mm (with external antenna connector)

ESP32-WROVER-IE Pinout

Package: 18.00 mm × 31.40 mm × 3.30 mm (38-pin module)

Notes

• Pin numbers extracted directly from Table 4 of the datasheet.
• NC (No Connect) pins at positions 17–22 and 27–28, 32 are not connected internally and should be left unconnected.
• Power pins (GND, 3V3) are at pins 1, 2, 15, and 38.
• Most GPIO pins support multiple alternate functions (ADC, DAC, SPI, UART, Ethernet MAC, touch sensing, RTC, etc.); refer to the GPIO function column for specific capabilities.
• SENSOR_VP (pin 4) and SENSOR_VN (pin 5) are input-only pins for the ADC.
• IO32 and IO33 support 32.768 kHz crystal oscillator connections.

Table 9: DC Characteristics (3.3 V, 25 °C)

Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions.

Table 7: Absolute Maximum Ratings

1. Please see Appendix IO_MUX in ESP32 Datasheet for IO's power domain.

Table 8: Recommended Operating Conditions

This section provides the following resources for your reference:

• Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 12 Recommended PCB Land Pattern .
• Source files of recommended PCB land patterns to measure dimensions not covered in Figure 12. You can view the source files for ESP32-WROVER-E and ESP32-WROVER-IE with Autodesk Viewer.
• 3D models of ESP32-WROVER-E and ESP32-WROVER-IE. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt).

Figure 12: Recommended PCB Land Pattern