USBLC6-2SC6

Part: USBLC6-2

Type: ESD Protection Device

Key Specs:

• Capacitance (I/O to GND): 3.5pF max
• Leakage Current (VRM = 5V): 1μA max
• ESD Protection (IEC61000-4-2 air discharge): 15kV
• ESD Protection (IEC61000-4-2 contact discharge): 8kV
• Breakdown Voltage (VBUS to GND, IF = 1mA): 6V
• Storage Temperature Range: -55 to +150 °C
• Maximum Junction Temperature: 125 °C
• Lead Solder Temperature (10s duration): 260 °C

Features:

• 2 data lines protection
• Protects VBUS
• Very low capacitance
• Very low leakage current
• SOT-666 and SOT23-6L packages
• RoHS compliant
• Optimized data integrity and speed
• Ultra low PCB space consuming
• Enhanced ESD protection: IEC61000-4-2 level 4 compliance
• High reliability offered by monolithic integration
• Fast response time
• Consistent D+/D- signal balance
• Best capacitance matching tolerance I/O to GND of 0.04pF
• Compliance with USB2.0 requirement (<1pF)

Applications:

• USB2.0 ports at 480Mbps (high speed) and USB OTG ports
• Backwards Compatible with USB1.1 Low and full speed
• Ethernet port: 10/100Mb/s
• SIM card protection
• Video line protection
• Portable and mobile electronics

Package:

• SOT-666: 2.9mm² max (area)
• SOT23-6L: 9mm² max (area)

• 2 data lines protection
• Protects VBUS
• Very low capacitance: 3.5pF max
• Very low leakage current: 1μA max
• SOT-666 and SOT23-6L packages
• RoHS compliant

• USB2.0 ports at 480Mbps (high speed) and USB OTG ports
• Backwards Compatible with USB1.1 Low and full speed
• Ethernet port: 10/100Mb/s
• SIM card protection
• Video line protection
• Portable and mobile electronics