TPD4EUSB30DQAR-ES

The TPD4EUSB30DQAR-ES is an electronic component from Texas Instruments. View the full TPD4EUSB30DQAR-ES datasheet below including absolute maximum ratings.

Manufacturer

Texas Instruments

Overview

Part: TPD4EUSB30DQAR-ES — ElecSuper

Type: ESD Protection Diode Array

Description: Designed to protect voltage sensitive components from ESD and transient voltage events, offering IEC 61000-4-2 Level 4 ESD protection, 0.6 pF typical capacitance, and protecting four I/O lines.

Operating Conditions:

Operating temperature: -40 to 125 °C
Reverse stand-off voltage: Up to 5 V

Absolute Maximum Ratings:

Max peak pulse power (tp=8/20us): 70 W
Max peak pulse current (tp=8/20us): 4.5 A
Max ESD (IEC61000-4-2 air/contact discharge): ±20 kV
Max junction temperature: 150 °C
Max storage temperature: 150 °C

Key Specs:

Reverse stand-off voltage (V RWM): Max 5 V
Reverse Breakdown Voltage (V BR): Min 6 V (at I T = 1mA)
Reverse Leakage Current (I R): Max 1 μA (at V RWM =5V)
Peak Pulse Current (I PP): Max 4.5 A (tp=8/20us@25 °C)
Clamping Voltage (V CL): Typ 9 V, Max 11 V (at I PP =1A; TP=8/20us)
Clamping Voltage (V CL): Typ 12 V, Max 15 V (at I PP =4.5A; TP=8/20us)
Junction capacitance (C J): Typ 0.6 pF (I/O pins to ground; V R =0V; f = 1MHz)
Junction capacitance (C J): Typ 0.3 pF (Between I/O pins; V R =0V; f = 1MHz)

Features:

IEC 61000-4-2 Level 4 ESD Protection (±20kV Contact Discharge, ±20kV Air Discharge)
IEC 61000-4-4 EFT Protection (40A (5/50ns))
IEC 61000-4-5 Surge (4.5A (8/20us))
Protecting four I/O lines
Ultra-low Capacitance: 0.6pF (Typical)
Low clamping voltage
Low leakage current
Solid-state silicon technology
RoHS compliance

Applications:

HDMI/USB2.0
Monitors and flat panel displays
10/100/1000 ethernet
Notebook computers
SIM ports
ATM interface

Package:

DFN2510-10L (2.5mm x 1.0mm)

Features

⚫ IEC 61000-4-2 Level 4 ESD Protection
-±20kV Contact Discharge
-±20kV Air Discharge
⚫ IEC 61000-4-4 EFT Protection
-40A (5/50ns)
⚫ IEC 61000-4-5 Surge
-4.5A (8/20us)

Applications

⚫ HDMI/USB2.0
⚫ Monitors and flat panel displays
⚫ 10/100/1000 ethernet

Pin Configuration

Table-2 Pin configuration

Pin	Name	Description	Outline	Circuit Diagram
1	IO	Connect to IO	Note 1 0524P 1 2 3 4 5 10 9 8 7 6	1 2 4 5 3, 8
2	IO	Connect to IO	Note 1 0524P 1 2 3 4 5 10 9 8 7 6	1 2 4 5 3, 8
3	GND	Connect to GND	Note 1 0524P 1 2 3 4 5 10 9 8 7 6	1 2 4 5 3, 8
4	IO	Connect to IO	Note 1 0524P 1 2 3 4 5 10 9 8 7 6	1 2 4 5 3, 8
5	IO	Connect to IO	Note 1 0524P 1 2 3 4 5 10 9 8 7 6	1 2 4 5 3, 8
6	NC	NO Connection	Note 1 0524P 1 2 3 4 5 10 9 8 7 6	1 2 4 5 3, 8
7	NC	NO Connection	Note 1 0524P 1 2 3 4 5 10 9 8 7 6	1 2 4 5 3, 8
8	GND	Connect to GND	Note 1 0524P 1 2 3 4 5 10 9 8 7 6	1 2 4 5 3, 8
9	NC	NO Connection	Note 1 0524P 1 2 3 4 5 10 9 8 7 6	1 2 4 5 3, 8
10	NC	NO Connection	Note 1 0524P 1 2 3 4 5 10 9 8 7 6	1 2 4 5 3, 8

Note1:

This diagram is only an electrical schematic, and the actual pin size is based on POD.

Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

Parameters	Symbol	Min.	Max.	Unit
Peak pulse power (tp=8/20us)@25 °C	P pk	-	70	W
Peak pulse current (tp=8/20us)@25 °C	I PP		4.5	A
ESD (IEC61000-4-2 air discharge) @25 °C	V ESD	-	±20	kV
ESD (IEC61000-4-2 contact discharge) @25 °C	V ESD	-	±20	kV
Junction temperature	T J	-	150	°C
Operating temperature	T OP	-40	125	°C
Storage temperature	T STG	-55	150	°C
Lead temperature	T L	-	260	°C

Typical Application

Typical HDMI Interface Application

Typical HDMI Interface Application

Related Variants

The following components are covered by the same datasheet.

Part Number	Manufacturer	Package
TPD4EUSB30DQAR	Texas Instruments	10-UFDFN

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