STM32G030K8T6

Part: STM32G030K8T6 — STMicroelectronics

Type: Arm Cortex-M0+ 32-bit MCU

Description: 32-bit Arm Cortex-M0+ MCU at up to 64 MHz with 64 KB Flash and 8 KB SRAM (with parity), 2.0–3.6 V supply, in an LQFP32 package.

Operating Conditions:

• Supply voltage: 2.0–3.6 V (VDD/VDDA); VBAT 1.55–3.6 V
• Operating temperature: -40 to 85 °C ambient (suffix 6); junction -40 to 105 °C
• Max CPU/AHB/APB clock: 64 MHz

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V (VDD - VSS, external supply)
• Max current into VDD/VDDA pin: 100 mA
• Max junction temperature: 150 °C
• Storage temperature: -65 to +150 °C

Key Specs:

• Core/frequency: Arm Cortex-M0+ up to 64 MHz
• Memory: 64 KB Flash, 8 KB SRAM with hardware parity check
• ADC: 12-bit, 0.4 μs conversion (2.5 MSps), up to 16 external channels (13 external + 3 internal on K-package variants), up to 16-bit with hardware oversampling
• I/O: up to 44 fast I/Os on the family (30 GPIOs on the K package); multiple 5 V-tolerant I/Os
• Max I/O pin current: 15 mA sink/source per pin (20 mA sink on FT_f pins); 80 mA total sink/source
• Input voltage on FT_xx pins: up to VDD + 4.0 V (abs max)
• Communication: 2× I2C (Fast-mode Plus, 1 Mbit/s), 2× USART, 2× SPI (32 Mbit/s, one multiplexed with I2S)
• Timers: 1 advanced-control 16-bit, four 16-bit general-purpose, two watchdogs, SysTick

Features:

• Low-power modes: Sleep, Stop, Standby; VBAT supply for RTC and backup registers
• POR/PDR reset supervision
• Clocks: 4–48 MHz crystal oscillator, 32 kHz crystal oscillator with calibration, internal 16 MHz RC with PLL, internal 32 kHz RC (±5%)
• 5-channel DMA controller with flexible mapping
• Calendar RTC with alarm and periodic wakeup from Stop/Standby
• CRC calculation unit
• Memory protection unit
• Serial wire debug (SWD)
• ECOPACK 2 compliant

Applications:

• Consumer, industrial and appliance domains
• Internet of Things (IoT) solutions

Package:

• LQFP32 (STM32G030KxT)

• Core: Arm ® 32-bit Cortex ® -M0+ CPU, frequency up to 64 MHz
• -40°C to 85°C operating temperature
• Memories
• -Up to 64 Kbytes of Flash memory
• -8 Kbytes of SRAM with HW parity check
• CRC calculation unit
• Reset and power management
• -Voltage range: 2.0 V to 3.6 V
• -Power-on/Power-down reset (POR/PDR)
• -Low-power modes: Sleep, Stop, Standby
• -VBAT supply for RTC and backup registers
• Clock management
• -4 to 48 MHz crystal oscillator
• -32 kHz crystal oscillator with calibration
• -Internal 16 MHz RC with PLL option
• -Internal 32 kHz RC oscillator (±5 %)
• Up to 44 fast I/Os
• -All mappable on external interrupt vectors
• -Multiple 5 V-tolerant I/Os
• 5-channel DMA controller with flexible mapping
• 12-bit, 0.4 μs ADC (up to 16 ext. channels)
• -Up to 16-bit with hardware oversampling
• -Conversion range: 0 to 3.6V
• 8 timers: 16-bit for advanced motor control, four 16-bit general-purpose, two watchdogs, SysTick timer
• Calendar RTC with alarm and periodic wakeup from Stop/Standby

Figure 3. STM32G030CxT LQFP48 pinout

Figure 4. STM32G030KxT LQFP32 pinout

34

Figure 5. STM32G030Fx TSSOP20 pinout

MSv47963V1

20

19

18

17

16

15

14

13

1

2

3

4

5

6

7

8

PB7/PB8

VDD/VDDA

PA1

NRST

PB3/PB4/PB5/PB6

PA13

PA5

PA6

PA7

PB0/PB1/PB2/PA8

12

11

9

10

PA3

PA15/PA14-BOOT0

VSS/VSSA

PA4

PB9/PC14-OSC32_IN

PC15-OSC32_OUT

PA11[PA9]

PA12[PA10]

PA0

PA2

Top view

Figure 6. STM32G030Jx SO8N pinout

MSv47964V1

1

2

3

4

8

• 7 PA13

• 6 PA12[PA10]

• 5 PA8/PA11[PA9]/PB0/PB1

PB7/PB8/PB9/PC14-OSC32_IN

PA0/PA1/PA2/NRST

PB5/PB6/PA14-BOOT0/PA15

• VDD/VDDA

• VSS/VSSA

Top view

Table 11. Terms and symbols used in Table 12

Table 11. Terms and symbols used in Table 12

Table 11. Terms and symbols used in Table 12 (continued)

Table 12. Pin assignment and description

Table 12. Pin assignment and description

34

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

34

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

Table 13. Port A alternate function mapping

Table 13. Port A alternate function mapping

Table 14. Port B alternate function mapping

Table 14. Port B alternate function mapping

The definition and values of input/output AC characteristics are given in Figure 18 and Table 51 , respectively.

Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 21: General operating conditions .

Table 51. I/O AC characteristics (1)(2)

Table 51. I/O AC characteristics (1)(2)

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Table 51. I/O AC characteristics (1)(2) (continued)

1. Guaranteed by design.
2. This value represents the I/O capability but the maximum system frequency is limited to 64 MHz.
3. The fall time is defined between 70% and 30% of the output waveform, according to I 2 C specification.

Figure 18. I/O AC characteristics definition (1)

1. Refer to Table 51: I/O AC characteristics .

Stresses above the absolute maximum ratings listed in Table 18 , Table 19 and Table 20 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 18. Voltage characteristics

Table 19. Current characteristics

1. A positive injection is induced by V IN > V DDIOx while a negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer also to Table 18: Voltage characteristics for the maximum allowed input voltage values.
2. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
3. When several inputs are submitted to a current injection, the maximum ∑ |I INJ(PIN) | is the absolute sum of the negative injected currents (instantaneous values).

Table 20. Thermal characteristics

Table 20. Thermal characteristics

The operating junction temperature T J must never exceed the maximum given in Table 21: General operating conditions

The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is:

$$T_J(max) = T_A(max) + P_D(max) \times \Theta_{JA}$$

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.