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STM32H563ZIT6

The STM32H563ZIT6 is an electronic component from STMicroelectronics. View the full STM32H563ZIT6 datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.

Manufacturer

STMicroelectronics

Category

Microcontrollers

Package

144-LQFP

Lifecycle

Production (Last Updated: 1 week ago)

Key Specifications

ParameterValue
Case/PackageLQFP
ConnectivityCANbus, FIFO, I2C, IrDA, LINbus, SCI, SDIO, SMBus, SPI, UART/USART, USB
Core ArchitectureARM Cortex-M33
Core ProcessorARM® Cortex®-M33
Core Size32-Bit
Data ConvertersA/D 18x12b SAR; D/A 2x12b
Lifecycle StatusProduction (Last Updated: 1 week ago)
Memory Size2 MB
Memory TypeFLASH
Mounting TypeSurface Mount
Number of I/O110
Number of Pins144
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeExternal, Internal
Oscillator TypeExternal, Internal
Oscillator TypeExternal, Internal
Package / Case144-LQFP
PackagingTray
PeripheralsBrown-out Detect/Reset, DMA, I2S, PDR, POR, PWM, SHA, TRNG, Voltage Detect, WDT
Flash Memory Size2MB (2M x 8)
Program Memory TypeFLASH
RAM Size640K x 8 B
REACH SVHCYes
RoHSCompliant
Clock Speed250MHz
Standard Pack Qty360
Supplier Device Package144-LQFP (20x20)
Supplier Device Package144-LQFP (20x20)
Supplier Device Package144-LQFP (20x20)
Supply Voltage1.71V ~ 3.6V

Overview

The STM32H562xx and STM32H563xx devices are a high-performance microcontrollers family (STM32H5 Series) based on the high-performance Arm ® Cortex ® -M33 32-bit RISC core. They operate at a frequency of up to 250 MHz.

The Cortex ® -M33 core features a single-precision floating-point unit (FPU), that supports all the Arm ® single-precision data-processing instructions and all the data types.

The Cortex ® -M33 core also implements a full set of DSP (digital signal processing) instructions and a memory protection unit (MPU) that enhances the application security.

The devices embed high-speed memories (2 Mbytes of dual bank flash memory and 640 Kbytes of SRAM), a flexible external memory controller (FMC) (for devices with packages of 100 pins and more), one Octo-SPI memory interface (at least one Quad-SPI available on all packages) and an extensive range of enhanced I/Os and peripherals connected to three APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.

The devices offer security foundation compliant with the trusted-based security architecture (TBSA) requirements from Arm ® . It embeds features to implement a secure firmware update. Besides these capabilities, the devices incorporate a secure firmware installation feature, that allows the customer to secure the provisioning of the code during its production. A flexible life cycle is managed thanks to multiple levels of protection and secure debug authentication. Firmware hardware isolation is supported thanks to securable peripherals, memories and I/Os, and privilege configuration of peripherals and memories.

The devices feature several protection mechanisms for embedded flash memory and SRAM: readout protection, write protection, secure and hide protection areas.

The devices embed several peripherals reinforcing security: a HASH hardware accelerator, and a true random number generator

The devices offer active tamper detection and protection against transient and environmental perturbation attacks, thanks to several internal monitoring generating secret data erase in case of attack. This helps to fit the PCI requirements for point of sales applications.

The devices offer two fast 12-bit ADC, two DAC channels, an internal voltage reference buffer, a low-power RTC, two 32-bit general-purpose timers, two 16-bit PWM timers dedicated to motor control, eight 16-bit general-purpose timers, two 16-bit basic timers and six 16-bit low-power timers.

The devices also feature standard and advanced communication interfaces such as: four I 2 Cs, one I3C, six SPIs, three I2Ss, six USARTs, six UARTs and one low-power UART, two SAIs, one digital camera interface (DCMI), up to two SDMMC, up to two FDCAN, one USB full-speed, one USB Type-C™ /USB Power Delivery controller, an Ethernet interface (available only on STM32H563xx device).

The devices operate in the - 40 to + 85 °C (+ 130 °C junction) and - 40 to + 125 °C (+ 130 °C junction) temperature ranges from a 1.71 to 3.6 V power supply.

A comprehensive set of power-saving modes allow the design of low-power applications.

Some independent power supplies are supported like an analog independent supply input for ADC, DACs, a 3.3 V dedicated supply input for USB and a dedicated supply input for some GPIOs and SDMMC. A VBAT input is available for connecting a backup battery in

order to preserve the RTC functionality and to backup 32x 32-bit registers and 4-Kbyte SRAM.

The devices offer eight packages from 64-pin to 176-pin.

All packages are available with two options LDO or SMPS supply for the V CORE (except for LQFP64 and VFQFPN68 packages which are not available in SMPS and WLCSP80 which is not available in LDO).

Table 2. STM32H56xxx features and peripheral counts

PeripheralsPeripheralsSTM32H563RI/GSTM32H562RI/GSTM32H563MISTM32H563VI/GSTM32H562VI/GSTM32H563ZI/GSTM32H562ZI/GSTM32H563AI/GSTM32H562AI/GSTM32H563II/GSTM32H562II/G
Flash memory (Mbytes)Flash memory (Mbytes)Up to 2 MbytesUp to 2 MbytesUp to 2 MbytesUp to 2 MbytesUp to 2 MbytesUp to 2 MbytesUp to 2 MbytesUp to 2 MbytesUp to 2 MbytesUp to 2 MbytesUp to 2 Mbytes
SRAMSystem (Kbytes)640 (256+64+320)640 (256+64+320)640 (256+64+320)640 (256+64+320)640 (256+64+320)640 (256+64+320)640 (256+64+320)640 (256+64+320)640 (256+64+320)640 (256+64+320)640 (256+64+320)
SRAMBackup (bytes)4 Kbytes4 Kbytes4 Kbytes4 Kbytes4 Kbytes4 Kbytes4 Kbytes4 Kbytes4 Kbytes4 Kbytes4 Kbytes
Flexible memory controller for external memories (FMC)Flexible memory controller for external memories (FMC)Noyes (1)yes (2)yesyesyesyesyesyesyes
OCTOSPIOCTOSPI11111111111
TimersAdvanced control2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)
TimersGeneral purpose(32 bits) and 8 (16 bits)(32 bits) and 8 (16 bits)(32 bits) and 8 (16 bits)(32 bits) and 8 (16 bits)(32 bits) and 8 (16 bits)(32 bits) and 8 (16 bits)(32 bits) and 8 (16 bits)(32 bits) and 8 (16 bits)(32 bits) and 8 (16 bits)(32 bits) and 8 (16 bits)(32 bits) and 8 (16 bits)
TimersBasic2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)2 (16 bits)
TimersLow power6 (16 bits)6 (16 bits)6 (16 bits)6 (16 bits)6 (16 bits)6 (16 bits)6 (16 bits)6 (16 bits)6 (16 bits)6 (16 bits)6 (16 bits)
TimersSysTick timer22222222222
TimersWatchdog timers (independent, window)22222222222

Table 2. STM32H56xxx features and peripheral counts

18

Table 2. STM32H56xxx features and peripheral counts (continued)

PeripheralsPeripheralsSTM32H563RI/GSTM32H562RI/GSTM32H563MISTM32H563VI/GSTM32H562VI/GSTM32H563ZI/GSTM32H562ZI/GSTM32H563AI/GSTM32H562AI/GSTM32H563II/GSTM32H562II/G
SPI / I2S4/34/34/35/35/35/36/36/36/36/36/3
I2C44444444
I3C1 (3)1 (3)1 (3)1 (3)1 (3)1 (3)1 (3)1 (3)
USART55566666666
UART55566666666
LPUART11111111111
SAI22222222222
FDCAN21221212121
USByesyesyesyesyesyesyesyesyesyesyes
UCPDyesyesyesyesyesyesyesyesyesyesyes
SDMMC11121212121
Digital camera interface (DCMI) / PSSI (4)yesyesyesyesyesyesyesyesyesyesyes
Ethernet (Legacy / SMPS)Yes/ NANoNA/ YesYes / NoNoYes/ NoNoYes/ YesNoYes /YesNo
HDMI-CECYesYesYesYesYesYesYesYesYesYesYes
CORDIC co-processorCORDIC co-processorYesYesYesYesYesYesYesYesYesYesYes
Filter mathematical accelerator (FMAC)Filter mathematical accelerator (FMAC)YesYesYesYesYesYesYesYesYesYesYes
Real time clock (RTC)Real time clock (RTC)YesYesYesYesYesYesYesYesYesYesYes
Tamper pins (legacy/SMPS)Tamper pins (legacy/SMPS)5 / NA5 / NANA/ 58/88/88/88/88/88/88/88/8
Active tampers (legacy/SMPS) (5)Active tampers (legacy/SMPS) (5)4 / NA4 / NANA/ 47/77/77/77/77/77/77/77/7
True random number generatorTrue random number generatorYesYesYesYesYesYesYesYesYesYesYes
HASH (SHA-512)HASH (SHA-512)YesYesYesYesYesYesYesYesYesYesYes
GPIOs (legacy/SMPS)GPIOs (legacy/SMPS)53 / NA (6)53 / NA (6)NA/ 5780/ 7880/ NA112/ 110112/ NA136/ 134136/ NA140 (7) /139140 (7)
Wakeup pins (legacy/SMPS)Wakeup pins (legacy/SMPS)6 / NA (8)6 / NA (8)NA/ 67/77/ NA7/77/ NA8/88/ NA8/88/ NA
Number of I/Os down to 1.08 V (legacy/SMPS)Number of I/Os down to 1.08 V (legacy/SMPS)0 / NA0 / NANA/ 00/00/ NA10/ 1010/ NA10/710/ NA10/710/ NA

Table 2. STM32H56xxx features and peripheral counts (continued)

Table 2. STM32H56xxx features and peripheral counts (continued)

PeripheralsPeripheralsSTM32H563RI/GSTM32H562RI/GSTM32H563MISTM32H563VI/GSTM32H562VI/GSTM32H563ZI/GSTM32H562ZI/GSTM32H563AI/GSTM32H562AI/GSTM32H563II/GSTM32H562II/G
12-bitADC22222222222
Number of channels (legacy/SMP S)16/NA16/NANA/ 1616/ 1416/ NA20/ 1820/ NA20/ 2020/ NA20/ 2020/ NA
12-bit DAC controller11111111111
Number of 12-bit Dto-A converters22222222222
Internal voltage reference bufferInternal voltage reference bufferNoNoNoNoYESYESYESYESYESYESYES
Maximum CPU frequencyMaximum CPU frequency250 MHz250 MHz250 MHz250 MHz250 MHz250 MHz250 MHz250 MHz250 MHz250 MHz250 MHz
Operating voltageOperating voltage1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V
Operating temperatureOperating temperatureAmbient operating temperature: - 40 to 85 °C / - 40 to 125 °C Junction temperature: - 40 to 130 °CAmbient operating temperature: - 40 to 85 °C / - 40 to 125 °C Junction temperature: - 40 to 130 °CAmbient operating temperature: - 40 to 85 °C / - 40 to 125 °C Junction temperature: - 40 to 130 °CAmbient operating temperature: - 40 to 85 °C / - 40 to 125 °C Junction temperature: - 40 to 130 °CAmbient operating temperature: - 40 to 85 °C / - 40 to 125 °C Junction temperature: - 40 to 130 °CAmbient operating temperature: - 40 to 85 °C / - 40 to 125 °C Junction temperature: - 40 to 130 °CAmbient operating temperature: - 40 to 85 °C / - 40 to 125 °C Junction temperature: - 40 to 130 °CAmbient operating temperature: - 40 to 85 °C / - 40 to 125 °C Junction temperature: - 40 to 130 °CAmbient operating temperature: - 40 to 85 °C / - 40 to 125 °C Junction temperature: - 40 to 130 °CAmbient operating temperature: - 40 to 85 °C / - 40 to 125 °C Junction temperature: - 40 to 130 °CAmbient operating temperature: - 40 to 85 °C / - 40 to 125 °C Junction temperature: - 40 to 130 °C
PackagePackageLQFP64 VFQFPN68WLCSP80WLCSP80LQFP100LQFP100LQFP144LQFP144UFBGA169UFBGA169LQFP176 UFBGA176LQFP176 UFBGA176
  1. Shares the same IOs than I2C4.
  2. DCMI and PSSI cannot be used at the same time as they share the same circuitry.
  3. Active tampers in output sharing mode (one output shared by all inputs).
  4. 49 for LQFP64.
  5. 136 for LQFP176.
  6. 5 for VFQFPN68.

18

Figure 1. STM32H562xx and STM32H563xx block diagram

Note:

PC[15:13] are in the VBAT domain.

Features

  • A tamper detection can erase the backup registers, backup SRAM, SRAM2, caches and cryptographic peripherals.
  • 32 32-bit backup registers:
  • -The backup registers (TAMP_BKPxR) are implemented in the Backup domain that remains powered-on by V BAT when the V DD power is switched off.
  • Up to 8 tamper pins for 8 external tamper detection events:
  • -Active tamper mode: continuous comparison between tamper output and input to protect from physical open-short attacks
  • -Flexible active tamper I/O management: from 4 meshes (each input associated to its own exclusive output) to 7 meshes (single output shared for up to 7 tamper inputs)
  • -Passive tampers: ultra-low power edge or level detection with internal pull-up hardware management
  • -Configurable digital filter

Note: As a tamper input, only PC13, PI8, PA0, PA1, and PA2 are functional in Standby and VBAT modes. As a tamper output, only PC13, PA1, and PI8 are functional in Standby and VBAT modes.

  • Internal tamper events to protect against transient or environmental perturbation attacks
  • Each tamper can be configured in two modes:
  • -Hardware mode: immediate erase of secrets on tamper detection, including backup registers erase
  • -Software mode: erase of secrets following a tamper detection launched by software
  • Any tamper detection can generate an RTC time stamp event.
  • TrustZone support:
  • -Tamper secure or non-secure configuration.
  • -Backup registers configuration in 3 configurable-size areas:
  • 1 read/write secure area
  • 1 write secure/read non-secure area
  • 1 read/write non-secure area
  • -Secret key, stored in backup registers, protected against read and write access
  • Tamper configuration and backup registers privilege protection

64

  • Monotonic counter

Pin Configuration

PinNameTypeDescription
1PE2I/Oalt: DCMI_D3, DEBUG_TRACECLK, ETH_MII_TXD3, FMC_A23, LPTIM1_IN2, OCTOSPI1_IO2, PSSI_D3, SAI1_CK1, SAI1_MCLK_A, SPI4_SCK, UART8_TX, USART10_RX
2PE3I/Oalt: DEBUG_TRACED0, FMC_A19, SAI1_SD_B, TAMP_IN6, TAMP_OUT3, TIM15_BKIN, USART10_TX
3PE4I/Oalt: DCMI_D4, DEBUG_TRACED1, FMC_A20, PSSI_D4, SAI1_D2, SAI1_FS_A, SPI4_NSS, TAMP_IN7, TAMP_OUT8, TIM15_CH1N
4PE5I/Oalt: DCMI_D6, DEBUG_TRACED2, FMC_A21, PSSI_D6, SAI1_CK2, SAI1_SCK_A, SPI4_MISO, TAMP_IN8, TAMP_OUT7, TIM15_CH1
5PE6I/Oalt: DCMI_D7, DEBUG_TRACED3, FMC_A22, PSSI_D7, SAI1_D1, SAI1_SD_A, SAI2_MCLK_B, SPI4_MOSI, TAMP_IN3, TAMP_OUT6, TIM15_CH2, TIM1_BKIN2
6VBATP
7PC13I/Oalt: PWR_WKUP4, RTC_OUT1, RTC_TS, TAMP_IN1, TAMP_OUT2, TAMP_OUT3
8PC14-OSC32_IN(OSC32_IN)I/Oalt: RCC_OSC32_IN
9PC15-OSC32_OUT(OSC32_OUT)I/Oalt: ADC1_EXTI15, ADC2_EXTI15, RCC_OSC32_OUT
10PF0I/Oalt: FMC_A0, I2C2_SDA, LPTIM5_CH1
11PF1I/Oalt: FMC_A1, I2C2_SCL, LPTIM5_CH2
12PF2I/Oalt: FMC_A2, I2C2_SMBA, LPTIM3_CH2, LPTIM3_IN2, LPTIM5_IN1, UART12_TX, USART11_CK
13PF3I/Oalt: FMC_A3, LPTIM3_IN1, LPTIM5_IN2, USART11_TX
14PF4I/Oalt: FMC_A4, LPTIM3_ETR, USART11_RX
15PF5I/Oalt: FMC_A5, I2C4_SCL, I3C1_SCL, LPTIM3_CH1, LPTIM3_IN1, UART12_RX, USART11_CTS, USART11_NSS
16VSSP
17VDDP
18PF6I/Oalt: LPTIM5_CH1, OCTOSPI1_IO3, SAI1_SD_B, SPI5_NSS, TIM16_CH1, UART7_RX
19PF7I/Oalt: LPTIM5_CH2, OCTOSPI1_IO2, SAI1_MCLK_B, SPI5_SCK, TIM17_CH1, UART7_TX
20PF8I/Oalt: LPTIM5_IN1, OCTOSPI1_IO0, SAI1_SCK_B, SPI5_MISO, TIM13_CH1, TIM16_CH1N, UART7_DE, UART7_RTS
21PF9I/Oalt: DAC1_EXTI9, LPTIM5_IN2, OCTOSPI1_IO1, SAI1_FS_B, SPI5_MOSI, TIM14_CH1, TIM17_CH1N, UART7_CTS
22PF10I/Oalt: DCMI_D11, OCTOSPI1_CLK, PSSI_D11, PSSI_D15, SAI1_D3, TIM16_BKIN
23PH0-OSC_IN(PH0)I/Oalt: RCC_OSC_IN
24PH1-OSC_OUT(PH1)I/Oalt: RCC_OSC_OUT
25NRSTRST
26PC0I/Oalt: ADC1_INP10, ADC2_INP10, FMC_A25, FMC_SDNWE, OCTOSPI1_IO7, SAI1_MCLK_A, SAI2_FS_B, SPI2_RDY, TIM16_BKIN
27PC1I/Oalt: ADC1_INN10, ADC1_INP11, ADC2_INN10, ADC2_INP11, DEBUG_TRACED0, ETH_MDC, I2S2_SDO, OCTOSPI1_IO4, PWR_WKUP6, SAI1_D1, SAI1_SD_A, SAI2_SD_A, SDMMC2_CK, SPI2_MOSI, TAMP_IN3, TAMP_OUT5, USART11_DE, USART11_RTS
28PC2I/Oalt: ADC1_INN11, ADC1_INP12, ADC2_INN11, ADC2_INP12, ETH_MII_TXD2, FMC_SDNE0, I2S2_SDI, OCTOSPI1_IO2, OCTOSPI1_IO5, PWR_CSLEEP, SPI2_MISO, TIM17_CH1, TIM4_CH4
29PC3I/Oalt: ADC1_INN12, ADC1_INP13, ADC2_INN12, ADC2_INP13, ETH_MII_TX_CLK, FMC_SDCKE0, I2S2_SDO, LPTIM3_CH1, OCTOSPI1_IO0, OCTOSPI1_IO6, PWR_CSTOP, SAI1_D3, SPI2_MOSI
30VDDP
31VSSAP
32VREF+P
33VDDAP
34PA0I/Oalt: ADC1_INN1, ADC1_INP0, ADC2_INN1, ADC2_INP0, ETH_MII_CRS, PWR_WKUP1, SAI2_SD_B, SDMMC2_CMD, SPI3_RDY, SPI6_NSS, TAMP_IN2, TAMP_OUT1, TIM15_BKIN, TIM2_CH1, TIM2_ETR, TIM5_CH1, TIM8_ETR, UART4_TX, USART2_CTS, USART2_NSS
35PA1I/Oalt: ADC1_INP1, ADC2_INP1, ETH_MII_RX_CLK, ETH_RMII_REF_CLK, LPTIM1_IN1, OCTOSPI1_DQS, OCTOSPI1_IO3, SAI2_MCLK_B, TAMP_IN5, TAMP_OUT4, TIM15_CH1N, TIM2_CH2, TIM5_CH2, UART4_RX, USART2_DE, USART2_RTS
36PA2I/Oalt: ADC1_INP14, ADC2_INP14, ETH_MDIO, LPTIM1_IN2, PWR_WKUP2, SAI2_SCK_B, TAMP_IN4, TAMP_OUT3, TIM15_CH1, TIM2_CH3, TIM5_CH3, USART2_TX
37PA3I/Oalt: ADC1_INP15, ADC2_INP15, ETH_MII_COL, I2S2_WS, OCTOSPI1_CLK, SAI1_SD_B, SPI2_NSS, TIM15_CH2, TIM2_CH4, TIM5_CH4, USART2_RX
38VSSP
39VDDP
40PA4I/Oalt: ADC1_INP18, ADC2_INP18, DAC1_OUT1, DCMI_HSYNC, I2S1_WS, I2S3_WS, LPTIM2_CH1, PSSI_DE, SPI1_NSS, SPI3_NSS, SPI6_NSS, TIM5_ETR, USART2_CK
41PA5I/Oalt: ADC1_INN18, ADC1_INP19, ADC2_INN18, ADC2_INP19, DAC1_OUT2, ETH_MII_TX_EN, ETH_RMII_TX_EN, I2S1_CK, PSSI_D14, SPI1_SCK, SPI6_SCK, TIM2_CH1, TIM2_ETR, TIM8_CH1N
42PA6I/Oalt: ADC1_INP3, ADC2_INP3, DCMI_PIXCLK, I2S1_SDI, OCTOSPI1_IO3, PSSI_PDCK, SPI1_MISO, SPI6_MISO, TIM13_CH1, TIM1_BKIN, TIM3_CH1, TIM8_BKIN, USART11_TX
43PA7I/Oalt: ADC1_INN3, ADC1_INP7, ADC2_INN3, ADC2_INP7, ETH_MII_RX_DV, ETH_RMII_CRS_DV, FMC_NWE, FMC_SDNWE, I2S1_SDO, OCTOSPI1_IO2, SPI1_MOSI, SPI6_MOSI, TIM14_CH1, TIM1_CH1N, TIM3_CH2, TIM8_CH1N, USART11_RX
44PC4I/Oalt: ADC1_INP4, ADC2_INP4, ETH_MII_RXD0, ETH_RMII_RXD0, FMC_SDNE0, I2S1_MCK, LPTIM2_ETR, SAI1_CK1, TIM2_CH4, USART3_RX
45PC5I/Oalt: ADC1_INN4, ADC1_INP8, ADC2_INN4, ADC2_INP8, ETH_MII_RXD1, ETH_RMII_RXD1, FMC_SDCKE0, OCTOSPI1_DQS, PSSI_D15, SAI1_D3, SAI1_FS_A, TIM1_CH4N, UART12_DE, UART12_RTS
46PB0I/Oalt: ADC1_INN5, ADC1_INP9, ADC2_INN5, ADC2_INP9, ETH_MII_RXD2, LPTIM3_CH1, OCTOSPI1_IO1, TIM1_CH2N, TIM3_CH3, TIM8_CH2N, UART4_CTS, USART11_CK
47PB1I/Oalt: ADC1_INP5, ADC2_INP5, ETH_MII_RXD3, LPTIM3_CH2, OCTOSPI1_IO0, TIM1_CH3N, TIM3_CH4, TIM8_CH3N
48PB2I/Oalt: I2S3_SDO, LPTIM1_CH1, LPTIM5_ETR, OCTOSPI1_CLK, OCTOSPI1_DQS, RCC_LSCO, RTC_OUT2, SAI1_D1, SAI1_SD_A, SDMMC1_CMD, SPI1_RDY, SPI3_MOSI, TIM8_CH4N
49PF11I/Oalt: ADC1_EXTI11, ADC1_INP2, ADC2_EXTI11, DCMI_D12, FMC_SDNRAS, LPTIM6_CH1, OCTOSPI1_NCLK, PSSI_D12, SAI2_SD_B, SPI5_MOSI
50PF12I/Oalt: ADC1_INN2, ADC1_INP6, FMC_A6, LPTIM6_CH2
51VSSP
52VDDP
53PF13I/Oalt: ADC2_INP2, FMC_A7, I2C4_SMBA, LPTIM6_IN1
54PF14I/Oalt: ADC2_INN2, ADC2_INP6, FMC_A8, LPTIM6_IN2
55PF15I/Oalt: ADC1_EXTI15, ADC2_EXTI15, FMC_A9, I2C4_SDA, I3C1_SDA
56PG0I/Oalt: FMC_A10, LPTIM4_IN1, UART9_RX
57PG1I/Oalt: FMC_A11, I2S2_SDO, SPI2_MOSI, UART9_TX
58PE7I/Oalt: FMC_D4, FMC_DA4, OCTOSPI1_IO4, TIM1_ETR, UART12_DE, UART12_RTS, UART7_RX
59PE8I/Oalt: FMC_D5, FMC_DA5, OCTOSPI1_IO5, TIM1_CH1N, UART12_CTS, UART7_TX
60PE9I/Oalt: DAC1_EXTI9, FMC_D6, FMC_DA6, OCTOSPI1_IO6, TIM1_CH1, UART12_RX, UART7_DE, UART7_RTS
61VSSP
62VDDP
63PE10I/Oalt: FMC_D7, FMC_DA7, OCTOSPI1_IO7, TIM1_CH2N, UART12_TX, UART7_CTS
64PE11I/Oalt: ADC1_EXTI11, ADC2_EXTI11, FMC_D8, FMC_DA8, OCTOSPI1_NCS, SAI2_SD_B, SPI1_RDY, SPI4_NSS, TIM1_CH2
65PE12I/Oalt: FMC_D9, FMC_DA9, SAI2_SCK_B, SPI4_SCK, TIM1_CH3N
66PE13I/Oalt: FMC_D10, FMC_DA10, SAI2_FS_B, SPI4_MISO, TIM1_CH3
67PE14I/Oalt: FMC_D11, FMC_DA11, SAI2_MCLK_B, SPI4_MOSI, TIM1_CH4
68PE15I/Oalt: ADC1_EXTI15, ADC2_EXTI15, FMC_D12, FMC_DA12, TIM1_BKIN, TIM1_CH4N, USART10_CK
69PB10I/Oalt: ETH_MII_RX_ER, I2C2_SCL, I2S2_CK, LPTIM2_IN1, LPTIM3_CH1, OCTOSPI1_NCS, SPI2_SCK, TIM2_CH3, USART3_TX
70VCAPP
71VSSP
72VDDP
73PB12I/Oalt: ETH_MII_TXD0, ETH_RMII_TXD0, FDCAN2_RX, I2C2_SDA, I2S2_WS, OCTOSPI1_NCLK, SPI2_NSS, TIM1_BKIN, UART5_RX, UCPD1_FRSTX, USART3_CK
74PB13I/Oalt: FDCAN2_TX, I2C2_SMBA, I2S2_CK, LPTIM2_CH1, LPTIM3_IN1, SDMMC1_D0, SPI2_SCK, TIM1_CH1N, UART5_TX, UCPD1_CC1, USART3_CTS, USART3_NSS
75PB14I/Oalt: I2S2_SDI, LPTIM3_ETR, SDMMC2_D0, SPI2_MISO, TIM12_CH1, TIM1_CH2N, TIM8_CH2N, UART4_DE, UART4_RTS, UCPD1_CC2, USART1_TX, USART3_DE, USART3_RTS
76PB15I/Oalt: ADC1_EXTI15, ADC2_EXTI15, DCMI_D2, ETH_MII_TXD1, ETH_RMII_TXD1, I2S2_SDO, OCTOSPI1_CLK, PSSI_D2, PWR_PVD_IN, RTC_REFIN, SDMMC2_D1, SPI2_MOSI, TIM12_CH2, TIM1_CH3N, TIM8_CH3N, UART4_CTS, UART5_RX, USART11_CTS, USART11_NSS, USART1_RX
77PD8I/Oalt: FMC_D13, FMC_DA13, USART3_TX
78PD9I/Oalt: DAC1_EXTI9, FDCAN2_RX, FMC_D14, FMC_DA14, USART3_RX
79PD10I/Oalt: FMC_D15, FMC_DA15, LPTIM2_CH2, USART3_CK
80PD11I/Oalt: ADC1_EXTI11, ADC2_EXTI11, FMC_A16, FMC_CLE, I2C4_SMBA, LPTIM2_IN2, OCTOSPI1_IO0, SAI1_CK1, SAI2_SD_A, UART4_RX, USART3_CTS, USART3_NSS
81PD12I/Oalt: DCMI_D12, FMC_A17, FMC_ALE, I2C4_SCL, I3C1_SCL, LPTIM1_IN1, LPTIM2_IN1, OCTOSPI1_IO1, PSSI_D12, SAI1_D1, SAI2_FS_A, TIM4_CH1, UART4_TX, USART3_DE, USART3_RTS
82PD13I/Oalt: DCMI_D13, FMC_A18, I2C4_SDA, I3C1_SDA, LPTIM1_CH1, LPTIM2_CH1, LPTIM4_IN1, OCTOSPI1_IO3, PSSI_D13, SAI2_SCK_A, TIM4_CH2, UART9_DE, UART9_RTS
83VSSP
84VDDP
85PD14I/Oalt: FMC_D0, FMC_DA0, TIM4_CH3, UART8_CTS, UART9_RX
86PD15I/Oalt: ADC1_EXTI15, ADC2_EXTI15, FMC_D1, FMC_DA1, TIM4_CH4, UART8_DE, UART8_RTS, UART9_TX
87PG2I/Oalt: FMC_A12, LPTIM6_ETR, TIM8_BKIN, UART12_RX
88PG3I/Oalt: FMC_A13, LPTIM5_ETR, TIM8_BKIN2, UART12_TX
89PG4I/Oalt: FMC_A14, FMC_BA0, LPTIM4_ETR, TIM1_BKIN2
90PG5I/Oalt: FMC_A15, FMC_BA1, TIM1_ETR
91PG6I/Oalt: DCMI_D12, FMC_NE3, I2C4_SDA, I3C1_SDA, OCTOSPI1_NCS, PSSI_D12, SPI1_RDY, TIM17_BKIN, UCPD1_FRSTX
92PG7I/Oalt: DCMI_D13, FMC_INT, I2C4_SCL, I3C1_SCL, PSSI_D13, SAI1_CK2, SAI1_MCLK_A, UCPD1_FRSTX, USART6_CK
93PG8I/Oalt: ETH_PPS_OUT, FMC_SDCLK, SPI6_NSS, TIM8_ETR, USART6_DE, USART6_RTS
94VSSP
95VDDP
96PC6I/Oalt: DCMI_D0, FMC_NWAIT, I2S2_MCK, OCTOSPI1_IO5, PSSI_D0, SAI1_SCK_A, SDMMC1_D0DIR, SDMMC1_D6, SDMMC2_D6, TIM3_CH1, TIM8_CH1, USART6_TX
97PC7I/Oalt: DCMI_D1, DEBUG_TRGIO, FMC_NE1, I2S3_MCK, OCTOSPI1_IO6, PSSI_D1, SDMMC1_D123DIR, SDMMC1_D7, SDMMC2_D7, TIM3_CH2, TIM8_CH2, USART6_RX
98PC8I/Oalt: DCMI_D2, DEBUG_TRACED1, FMC_ALE, FMC_INT, FMC_NCE, FMC_NE2, PSSI_D2, SDMMC1_D0, TIM3_CH3, TIM8_CH3, UART5_DE, UART5_RTS, USART6_CK
99PC9I/Oalt: AUDIOCLK, DAC1_EXTI9, DCMI_D3, FMC_CLE, I2C3_SDA, OCTOSPI1_IO0, PSSI_D3, RCC_MCO_2, SDMMC1_D1, TIM3_CH4, TIM8_CH4, UART5_CTS, UCPD1_DB2
100PA8I/Oalt: DCMI_D3, FMC_NOE, I2C3_SCL, PSSI_D3, RCC_MCO_1, SPI1_RDY, TIM1_CH1, TIM8_BKIN2, UART7_RX, USART1_CK, USB_SOF
101PA9I/Oalt: DAC1_EXTI9, DCMI_D0, ETH_MII_TX_ER, FMC_NWE, I2C3_SMBA, I2S2_CK, LPUART1_TX, PSSI_D0, SPI2_SCK, TIM1_CH2, UCPD1_DB1, USART1_TX
102PA10I/Oalt: DCMI_D1, FDCAN2_TX, LPTIM2_IN2, LPUART1_RX, PSSI_D1, SDMMC1_D0, TIM1_CH3, UCPD1_FRSTX, USART1_RX
103PA11I/Oalt: ADC1_EXTI11, ADC2_EXTI11, FDCAN1_RX, I2S2_WS, LPUART1_CTS, SPI2_NSS, TIM1_CH4, UART4_RX, USART1_CTS, USART1_NSS, USB_DM
104PA12I/Oalt: FDCAN1_TX, I2S2_CK, LPUART1_DE, LPUART1_RTS, SAI2_FS_B, SPI2_SCK, TIM1_ETR, UART4_TX, USART1_DE, USART1_RTS, USB_DP
105PA13(JTMS/SWDIO)I/Oalt: DEBUG_JTMS-SWDIO
106VDDUSBP
107VSSP
108VDDP
109PA14(JTCK/SWCLK)I/Oalt: DEBUG_JTCK-SWCLK
110PA15(JTDI)I/Oalt: ADC1_EXTI15, ADC2_EXTI15, CEC, DCMI_D11, DEBUG_JTDI, FMC_NBL1, I2S1_WS, I2S3_WS, LPTIM3_IN2, PSSI_D11, SPI1_NSS, SPI3_NSS, SPI6_NSS, TIM2_CH1, TIM2_ETR, UART4_DE, UART4_RTS, UART7_TX
111PC10I/Oalt: DCMI_D8, ETH_MII_TXD0, ETH_RMII_TXD0, I2S3_CK, LPTIM3_ETR, OCTOSPI1_IO1, PSSI_D8, SDMMC1_D2, SPI3_SCK, UART4_TX, USART3_TX
112PC11I/Oalt: ADC1_EXTI11, ADC2_EXTI11, DCMI_D4, I2S3_SDI, LPTIM3_IN1, OCTOSPI1_NCS, PSSI_D4, SDMMC1_D3, SPI3_MISO, UART4_RX, USART3_RX
113PC12I/Oalt: DCMI_D9, DEBUG_TRACED3, I2S3_SDO, PSSI_D9, SDMMC1_CK, SPI3_MOSI, SPI6_SCK, TIM15_CH1, UART5_TX, USART3_CK
114PD0I/Oalt: FDCAN1_RX, FMC_D2, FMC_DA2, TIM8_CH4N, UART4_RX, UART9_CTS
115PD1I/Oalt: FDCAN1_TX, FMC_D3, FMC_DA3, UART4_TX
116PD2I/Oalt: DCMI_D11, DEBUG_TRACED2, LPTIM4_ETR, PSSI_D11, PWR_WKUP7, SDMMC1_CMD, TIM15_BKIN, TIM3_ETR, UART5_RX
117PD3I/Oalt: DCMI_D5, FMC_CLK, I2S2_CK, PSSI_D5, PWR_WKUP8, SPI2_SCK, USART2_CTS, USART2_NSS
118PD4I/Oalt: FMC_NOE, OCTOSPI1_IO4, USART2_DE, USART2_RTS
119PD5I/Oalt: FDCAN1_TX, FMC_NWE, OCTOSPI1_IO5, SPI2_RDY, TIM1_CH4N, USART2_TX
120VSSP
121VDDIO2P
122PD6I/Oalt: DCMI_D10, FMC_NWAIT, I2S3_SDO, OCTOSPI1_IO6, PSSI_D10, SAI1_D1, SAI1_SD_A, SDMMC2_CK, SPI3_MOSI, USART2_RX
123PD7I/Oalt: FMC_NCE, FMC_NE1, I2S1_SDO, LPTIM4_OUT, OCTOSPI1_IO7, SDMMC2_CMD, SPI1_MOSI, USART2_CK
124PG9I/Oalt: DAC1_EXTI9, DCMI_VSYNC, FMC_NCE, FMC_NE2, I2S1_SDI, OCTOSPI1_IO6, PSSI_RDY, SAI2_FS_B, SDMMC2_D0, SPI1_MISO, USART6_RX
125PG10I/Oalt: DCMI_D2, FMC_NE3, I2S1_WS, PSSI_D2, SAI2_SD_B, SDMMC2_D1, SPI1_NSS
126PG11I/Oalt: ADC1_EXTI11, ADC2_EXTI11, DCMI_D3, ETH_MII_TX_EN, ETH_RMII_TX_EN, I2S1_CK, LPTIM1_IN2, PSSI_D3, SDMMC2_D2, SPI1_SCK, USART10_RX, USART11_DE, USART11_RTS
127PG12I/Oalt: DCMI_D11, ETH_MII_TXD1, ETH_RMII_TXD1, FMC_NE4, LPTIM1_IN1, LPTIM5_CH1, PSSI_D11, PSSI_D15, SDMMC2_D3, SPI6_MISO, USART10_TX, USART6_DE, USART6_RTS
128PG13I/Oalt: DEBUG_TRACED0, ETH_MII_TXD0, ETH_RMII_TXD0, FMC_A24, LPTIM1_CH1, LPTIM5_CH2, SDMMC2_D6, SPI6_SCK, USART10_CTS, USART10_NSS, USART6_CTS, USART6_NSS
129PG14I/Oalt: DEBUG_TRACED1, ETH_MII_TXD1, ETH_RMII_TXD1, FMC_A25, LPTIM1_CH2, LPTIM1_ETR, LPTIM5_IN1, OCTOSPI1_IO7, SDMMC2_D7, SPI6_MOSI, USART10_DE, USART10_RTS, USART6_TX
130VSSP
131VDDP
132PG15I/Oalt: ADC1_EXTI15, ADC2_EXTI15, DCMI_D13, FMC_SDNCAS, PSSI_D13, SPI4_RDY, USART10_CK, USART6_CTS, USART6_NSS
133PB3(JTDO/TRACESWO)I/Oalt: CRS_SYNC, DEBUG_JTDO-SWO, I2C2_SDA, I2S1_CK, I2S3_CK, LPTIM6_ETR, SDMMC2_D2, SPI1_SCK, SPI3_SCK, SPI6_SCK, TIM2_CH2, UART12_CTS, UART7_RX
134PB4(NJTRST)I/Oalt: DCMI_D7, DEBUG_NJTRST, I2S1_SDI, I2S2_WS, I2S3_SDI, LPTIM1_CH2, OCTOSPI1_CLK, PSSI_D7, SDMMC2_D3, SPI1_MISO, SPI2_NSS, SPI3_MISO, SPI6_MISO, TIM16_BKIN, TIM3_CH1, UART7_TX
135PB5I/Oalt: DCMI_D10, ETH_PPS_OUT, FDCAN2_RX, FMC_SDCKE1, I2C1_SMBA, I2C4_SMBA, I2S1_SDO, I2S3_SDO, OCTOSPI1_NCLK, PSSI_D10, SPI1_MOSI, SPI3_MOSI, SPI6_MOSI, TIM17_BKIN, TIM3_CH2, UART5_RX
136PB6I/Oalt: CEC, DCMI_D5, FDCAN2_TX, FMC_SDNE1, I2C1_SCL, I2C4_SCL, I3C1_SCL, LPUART1_TX, OCTOSPI1_NCS, PSSI_D5, TIM16_CH1N, TIM4_CH1, UART5_TX, USART1_TX
137PB7I/Oalt: DCMI_VSYNC, FDCAN1_TX, FMC_NL, I2C1_SDA, I2C4_SDA, I3C1_SDA, LPUART1_RX, PSSI_RDY, PWR_WKUP5, SDMMC2_CKIN, SDMMC2_D5, TIM17_CH1N, TIM4_CH2, USART1_RX
138BOOT0I
139PB8I/Oalt: DCMI_D6, ETH_MII_TXD3, FDCAN1_RX, I2C1_SCL, I2C4_SCL, I3C1_SCL, PSSI_D6, SDMMC1_CKIN, SDMMC1_D4, SDMMC2_D4, SPI4_RDY, TIM16_CH1, TIM4_CH3, UART4_RX
140PB9I/Oalt: DAC1_EXTI9, DCMI_D7, FDCAN1_TX, I2C1_SDA, I2C4_SDA, I2S2_WS, I3C1_SDA, PSSI_D7, SDMMC1_CDIR, SDMMC1_D5, SDMMC2_CKIN, SDMMC2_D5, SPI2_NSS, TIM17_CH1, TIM4_CH4, UART4_TX
141PE0I/Oalt: DCMI_D2, FDCAN1_RX, FMC_NBL0, LPTIM1_ETR, LPTIM2_CH2, LPTIM2_ETR, PSSI_D2, SAI2_MCLK_A, SPI3_RDY, TIM4_ETR, UART8_RX
142VCAPP
143VSSP
144VDDP

Electrical Characteristics

Unless otherwise specified, the parameters given in Table 92 are derived from tests performed under the ambient temperature, f PCLK2 frequency and V DDA supply voltage conditions summarized in Table 20: General operating conditions .

Table 92. 12-bit ADC characteristics (1)(2)

SymbolParameterConditionsConditionsConditionsConditionsConditionsConditionsMinTypMaxUnit
V DDAAnalog supply voltage for ADC ON------1.62-3.6V
V REF+Positive reference voltage------1.62-V DDAV
V REF-Negative reference voltage------V SSAV SSAV SSAV
f ADCADC clock frequency1.62V ≤ V DDA ≤ 3.6 V1.62V ≤ V DDA ≤ 3.6 V1.62V ≤ V DDA ≤ 3.6 V1.62V ≤ V DDA ≤ 3.6 V1.62V ≤ V DDA ≤ 3.6 V1.62V ≤ V DDA ≤ 3.6 V1.5-75MHz
f S (3) with RAIN=47 Ω and C PCB =22pFResolution = 12 bitsContinuous Mode1.8V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 75MHzSMP =2.5-5.00-MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFResolution = 12 bitsContinuous Mode1.6V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 70 MH zSMP =2.54.66MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFResolution = 12 bitsSingle or Discontinuous Mode2.4V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 60MHzSMP =2.54.00-MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFResolution = 12 bitsSingle or Discontinuous Mode1.6V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 50MHzSMP =2.53.33-MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFSampling rate for fast channels (VIN[0:5])Resolution = 10 bitsContinuous Mode1.6V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 75MHzSMP =2.5-5.77-MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFResolution = 10 bitsSingle or Discontinuous Mode2.4V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 75MHzSMP =2.55.77-MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFResolution = 10 bitsSingle or Discontinuous Mode1.6V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 65MHzSMP =2.55.00-MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFResolution = 8 bitsAll Modes1.6V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 75MHzSMP =2.5-6.82-MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFResolution = 6 bitsAll Modes1.6V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 75MHzSMP =2.5-8.33-MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFSampling rate for slow channelsResolution = 12 bitsAll modes (4)1.6V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 35MHzSMP =2.5-2.30-MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFSampling rate for slow channelsResolution = 10 bitsAll modes (4)1.6V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 35MHzSMP =2.5-2.70-MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFSampling rate for slow channelsResolution = 8 bitsAll modes (4)1.6V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 50MHzSMP =2.5-4.50-MSPS
f S (3) with RAIN=47 Ω and C PCB =22pFSampling rate for slow channelsResolution = 6 bitsAll modes (4)1.6V ≤ V DDA ≤ 3.6V-40°C ≤ T J ≤ 130°Cf ADC = 50MHzSMP =2.5-5.50-MSPS
t TRIGExternal trigger periodResolution = 12 bitsResolution = 12 bitsResolution = 12 bitsResolution = 12 bitsResolution = 12 bitsResolution = 12 bits--151/f ADC

Table 92. 12-bit ADC characteristics (1)(2)

Table 92. 12-bit ADC characteristics (1)(2) (continued)

SymbolParameterConditionsMinTypMaxUnit
V AIN (2)Conversion voltage range-0-V REF+V
V CMIVCommon mode input voltage-V REF /2 - 10%V REF /2V REF /2+ 10%V
R AIN (5)External input impedanceResolution = 12 bits, T J = 130°C (Tolerance 4 LSBs)--321Ω
R AIN (5)External input impedanceResolution = 12 bits, T J = 125°C--220Ω
R AIN (5)External input impedanceResolution = 10 bits, T J = 130°C--1039Ω
R AIN (5)External input impedanceResolution = 10 bits, T J = 125°C--2100Ω
R AIN (5)External input impedanceResolution = 8 bits, T J = 130°C--6327Ω
R AIN (5)External input impedanceResolution = 8 bits, T J = 125°C--12000Ω
R AIN (5)External input impedanceResolution = 6 bits, T J = 130°C--47620Ω
R AIN (5)External input impedanceResolution = 6 bits, T J = 125°C--80000Ω
C ADCInternal sample and hold capacitor--3-pF
t ADCVREG_ STUPADC LDO startup time--510μs
t STABADC power-up timeLDO already started1--conversion cycle
t OFF_CALOffset calibration time-1335
t LATRTrigger conversionCKMODE = 001.522.5
t LATRlatency forCKMODE = 01--2.5
t LATRregular and injected channelsCKMODE = 102.5
t LATRwithout aborting the conversionCKMODE = 112.25
t LATRINJTriggerCKMODE = 002.533.51/f ADC
t LATRINJconversion latency for regular andCKMODE = 01--3.51/f ADC
t LATRINJinjected channelsCKMODE = 10--3.51/f ADC
t LATRINJwhen a regular conversion is abortedCKMODE = 11--3.251/f ADC
t SSampling time-2.5-640.51/f ADC
t CONVTotal conversion time (includingN-bits resolutiont S + 0.5 + N

244

Table 92. 12-bit ADC characteristics (1)(2) (continued)

SymbolParameterConditionsMinTypMaxUnit
I DDA_D(ADC)ADC consumption on V DDA and V REF , Differential modefs= 5MSPS-600-μA
I DDA_D(ADC)ADC consumption on V DDA and V REF , Differential modefs= 1MSPS-190-μA
I DDA_D(ADC)fs= 0.1MSPS-50-μA
I DDA_SE(ADC)ADC consumption on V DDA and V REF Single- ended modefs= 5MSPS-500-μA
I DDA_SE(ADC)ADC consumption on V DDA and V REF Single- ended modefs= 1MSPS-150-μA
I DDA_SE(ADC)ADC consumption on V DDA and V REF Single- ended modefs= 0.1MSPS-50-μA
I DD(ADC)ADC consumption on V DDf ADC =75MHz-265-μA
I DD(ADC)ADC consumption on V DDf ADC =50MHz175-μA
I DD(ADC)ADC consumption on V DDf ADC =25MHz-90-μA
I DD(ADC)ADC consumption on V DDf ADC =12.5MHz-45-μA
I DD(ADC)ADC consumption on V DDf ADC =6.25MHz-22-μA
I DD(ADC)ADC consumption on V DDf ADC =3.125MHz-11-μA
  1. The voltage booster on ADC switches must be used for V DDA < 2.7 V (embedded I/O switches).
  2. These values are valid on BGA packages.
  3. Depending on the package, V REF+ can be internally connected to V DDA and V REF- to V SSA .
  4. The tolerance is 2 LSBs for 12-bit, 10-bit and 8-bit resolutions, otherwise specified.

Table 93. Minimum sampling time versus R AIN (1)(2)

ResolutionR ( Ω )Minimum sampling time (s)Minimum sampling time (s)
ResolutionAINFast channelSlow channel (3)
12 bits473.75E-086.12E-08
12 bits683.94E-086.25E-08
12 bits1004.36E-086.51E-08
12 bits1505.11E-087.00E-08
12 bits2206.54E-087.86E-08
12 bits3308.80E-089.57E-08
12 bits4701.17E-071.23E-07
12 bits6801.60E-071.65E-07

Table 93. Minimum sampling time versus R AIN (1)(2)

Table 93. Minimum sampling time versus R AIN (1)(2) (continued)

  • Resolution R AIN ( Ω ) Minimum sampling time (s)
  • Resolution R AIN ( Ω ) Fast channel Slow channel (3)
  • 47 3.19E-08 5.17E-08
  • 68 3.35E-08 5.28E-08
  • 100 3.66E-08 5.45E-08
  • 150 4.35E-08 5.83E-08
  • 220 5.43E-08 6.50E-08
  • 330 7.18E-08 7.89E-08
  • 470 9.46E-08 1.00E-07
  • 680 1.28E-07 1.33E-07
  • 1000 1.81E-07 1.83E-07
  • 1500 2.63E-07 2.63E-07
  • 2200 3.79E-07 3.76E-07
  • 3300 5.57E-07 5.52E-07
  • 47 2.64E-08 4.17E-08
  • 68 2.76E-08 4.24E-08
  • 100 3.02E-08 4.39E-08
  • 150 3.51E-08 4.66E-08
  • 220 4.27E-08 5.13E-08
  • 330 5.52E-08 6.19E-08
  • 470 7.17E-08 7.72E-08
  • 680 9.68E-08 1.00E-07
  • 1000 1.34E-07 1.37E-07
  • 1500 1.93E-07 1.94E-07
  • 2200 2.76E-07 2.74E-07
  • 3300 4.06E-07 4.01E-07
  • 4700 5.73E-07 5.62E-07
  • 6800 8.21E-07 7.99E-07
  • 10000 1.20E-06 1.17E-06
  • 15000 1.79E-06 1.74E-06

244

Table 93. Minimum sampling time versus R AIN (1)(2) (continued)

ResolutionR AIN ( Ω )Minimum sampling time (s)Minimum sampling time (s)
ResolutionR AIN ( Ω )Fast channelSlow channel (3)
6 bits472.14E-083.16E-08
6 bits682.23E-083.21E-08
6 bits1002.40E-083.31E-08
6 bits1502.68E-083.52E-08
6 bits2203.13E-083.87E-08
6 bits3303.89E-084.51E-08
6 bits4704.88E-085.39E-08
6 bits6806.38E-086.79E-08
6 bits10008.70E-088.97E-08
6 bits15001.23E-071.24E-07
6 bits22001.73E-071.73E-07
6 bits33002.53E-072.49E-07
6 bits47003.53E-073.45E-07
6 bits68005.04E-074.90E-07
6 bits100007.34E-077.11E-07
6 bits150001.09E-061.05E-06
  1. Specified by design - Not tested in production.
  2. Data valid up to 130 °C, with a 22 pF PCB capacitor, and V DDA = 1.6 V.
  3. Slow channels correspond to all ADC inputs except for the fast channels.

Figure 54. ADC conversion timing diagram

Table 94. ADC accuracy (1)(2)

SymbolParameterConditionsConditionsMinTypMaxUnit
ETTotal unadjusted errorFast and slow channelsSingle ended-±3.5±12LSB
ETTotal unadjusted errorFast and slow channelsDifferential-±2.5±7.5LSB
EOOffset error-Single ended-±3±5.5
EOOffset error-Differential-±2±3.5
EGGain error-Single ended-±3.5±11
EGGain error-Differential±2.5±7
EDDifferential linearity error-Single ended-±0.75+2/-1
EDDifferential linearity error-Differential-±0.75+2/-1
ELIntegral linearity errorFast andSingle ended-±2±6.5
ELIntegral linearity errorslow channelsDifferential-±1±4
ENOBEffective number of bitsSingle endedSingle ended-10.8-Bits
ENOBEffective number of bitsDifferentialDifferential-11.5-Bits
SINADSignal-to-noise and distortion ratioSingle endedSingle ended-68-dB
SINADSignal-to-noise and distortion ratioDifferentialDifferential-71-dB
SNRSignal-to-noise ratioSingle endedSingle ended-70-dB
SNRSignal-to-noise ratioDifferentialDifferential-72-dB
THDTotal harmonic distortionSingle endedSingle ended--70-dB
THDTotal harmonic distortionDifferentialDifferential--80-dB

Absolute Maximum Ratings

Stresses above the absolute maximum ratings listed in Table 17: Voltage characteristics , Table 18: Current characteristics and Table 19 . Thermal characteristics may cause permanent damage to the device. These are stress ratings only and the functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 Qualification Standard, extended mission profiles are available on demand.

Table 17. Voltage characteristics (1)

SymbolRatingsMinMaxUnit
V DDx - V SSExternal main supply voltage (including V DDSMPS (2) , V DDA , V DDUSB , V DDIO2 (2)(3)(4) , V BAT , and V REF+ )-0.34.0V
V DDIOx (4) - V SSI/O supply when HSLV (2) = 0-0.34.0V
V DDIOx (4) - V SSI/O supply when HSLV (2) = 1-0.32.75V
V IN (5)Input voltage on FT_xxx pins except FT_c pinsV SS -0.3min (min(V DD , V DDA , V DDUSB , V DDIO2 ) + 4.0, 6.0 V) (6)(7)V
V IN (5)Input voltage on FT_t in V BAT modeV SS -0.3min (min(V BAT ,V DDA ,V DDUSB , V DDIO2 ) + 4.0V, 6.0 V)V
V IN (5)Input voltage on TT_xx pinsV SS -0.34.0V
V IN (5)Input voltage on BOOT0 pinV SSmin (min(V DD , V DDA , V DDUSB , V DDIO2 ) + 4.0, 6.0 V) (6)V
V IN (5)Input voltage on FT_c pinsV SS -0.35.5V
V IN (5)Input voltage on any other pinsV SS -0.34.0V
V REF+ -V DDAAllowed voltage difference for V REF+ > V DDA-0.4V
\∆ V DDx \Variations between different V DDX power pins of the same domain-
\V SSx -V SS \Variations between all the different ground pins-
  1. HSLV = High-speed low-voltage mode. Refer to General-purpose I/Os (GPIO) section of RM0481.
  2. If HSLV = 0.
  3. VDDIO1 or V DDIO2 . V DDIO1 = V DD .
  4. VIN maximum must always be respected. Refer to the maximum allowed injected current values.
  5. To sustain a voltage higher than 4 V the internal pull-up/pull-down resistors must be disabled.
  6. This formula has to be applied on power supplies related to the I/O structure described by the pin definition table.

Table 18. Current characteristics

SymbolRatingsMaxUnit
∑ IV DDTotal current into sum of all V DD power lines (source) (1)350mA
∑ IV SSTotal current out of sum of all V SS ground lines (sink) (1)350mA
IV DDMaximum current into each V DD power pin (source) (1)100mA
IV SSMaximum current out of each V SS ground pin (sink) (1)100mA
I IO(PIN)Output current sourced by any I/O and control pin20mA
∑ I IO(PIN)Total output current sunk by sum of all I/Os and control pins (2)140mA
∑ I IO(PIN)Total output current sourced by sum of all I/Os and control pins (2)140mA
I INJ(PIN) (3)(4)Injected current on FT_xxx, TT_xx, NRST pins-5 / 0mA
∑ \I INJ(PIN) \Total injected current (sum of all I/Os and control pins) (5)
  1. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins referring to high pin count LQFP packages.
  2. Positive injection (when V IN > V DDIOx ) is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
  3. A negative injection is induced by VIN < VSS. IINJ(PIN) must never be exceeded. Refer also to Table 17: Voltage characteristics for the minimum allowed input voltage values.
  4. When several inputs are submitted to a current injection, the maximum ∑ |I INJ(PIN) | is the absolute sum of the negative injected currents (instantaneous values).

Table 19. Thermal characteristics

SymbolRatingsValueUnit
T STGStorage temperature range-65 to +150°C
T JMaximum junction temperature130 (1)°C

Thermal Information

The maximum chip-junction temperature, T Jmax , in degrees Celsius, may be calculated using the following equation:

T J max = T A max + (P D max × Θ JA )

Package Information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com . ECOPACK is an ST trademark.

270

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