STM32G030C8

Part: STM32G030F6P6 (STM32G030x6/x8 family) — STMicroelectronics

Type: Arm Cortex-M0+ 32-bit MCU

Description: 32-bit Arm Cortex-M0+ MCU at up to 64 MHz with up to 64 KB Flash and 8 KB SRAM, 2.0–3.6 V supply, 12-bit ADC, 2x USART, 2x I2C, 2x SPI, in packages from 8 to 48 pins.

Operating Conditions:

• Supply voltage (VDD/VDDA): 2.0–3.6 V
• Operating temperature: -40 to 85 °C ambient (junction -40 to 105 °C)
• Max HCLK/PCLK frequency: 64 MHz
• VBAT backup operating voltage: 1.55–3.6 V

Absolute Maximum Ratings:

• Max supply voltage (VDD): 4.0 V
• Max current into VDD/VDDA pins: 100 mA
• Max output current sunk/sourced by any I/O pin: 15 mA (20 mA sunk for FT_f pins)
• Total output current sunk or sourced by all I/Os: 80 mA
• Max junction temperature: 150 °C
• Storage temperature: -65 to +150 °C

Key Specs:

• CPU: Arm Cortex-M0+ up to 64 MHz
• Memory: 8 KB SRAM with HW parity; up to 64 KB Flash (32 KB on the x6 variants)
• ADC: 12-bit, 0.4 μs, up to 16 external channels, conversion range 0–3.6 V, up to 16-bit with hardware oversampling
• I/O input voltage: -0.3 V to Min(VDD + 3.6, 5.5) V
• I/O: up to 44 fast I/Os, multiple 5 V-tolerant
• Communication: 2x I2C (Fast-mode Plus, 1 Mbit/s), 2x USART, 2x SPI (32 Mbit/s)
• Timers: 8 (one 16-bit advanced motor control, four 16-bit general-purpose, two watchdogs, SysTick)
• DMA: 5-channel controller

Features:

• Arm 32-bit Cortex-M0+ CPU with MPU
• POR/PDR, low-power modes (Sleep, Stop, Standby), VBAT supply for RTC and backup registers
• 32 kHz crystal oscillator, 4–48 MHz crystal oscillator, internal 16 MHz RC with PLL, internal 32 kHz RC (±5%)
• CRC calculation unit
• Calendar RTC with alarm and periodic wakeup from Stop/Standby
• Serial wire debug (SWD)
• ECOPACK 2 compliant

Applications:

• Consumer, industrial and appliance domains
• IoT solutions

Package:

• TSSOP20 (STM32G030Fx)
• SO8N (STM32G030Jx)
• LQFP32 (STM32G030Kx)
• LQFP48 (STM32G030Cx)

• Includes ST state-of-the-art patented technology
• Core: Arm ® 32-bit Cortex ® -M0+ CPU, frequency up to 64 MHz
• -40°C to 85°C operating temperature
• Memories
• -8 Kbytes of SRAM with HW parity check
• -Up to 64 Kbytes of flash memory with protection
• CRC calculation unit
• Reset and power management
• -Power-on/Power-down reset (POR/PDR)
• -Voltage range: 2.0 V to 3.6 V
• -Low-power modes: Sleep, Stop, Standby
• -VBAT supply for RTC and backup registers
• Clock management
• -32 kHz crystal oscillator with calibration
• -4 to 48 MHz crystal oscillator
• -Internal 16 MHz RC with PLL option
• -Internal 32 kHz RC oscillator (±5 %)
• Up to 44 fast I/Os
• -Multiple 5 V-tolerant I/Os
• -All mappable on external interrupt vectors
• 5-channel DMA controller with flexible mapping
• 12-bit, 0.4 μs ADC (up to 16 ext. channels)
• -Conversion range: 0 to 3.6V
• -Up to 16-bit with hardware oversampling
• 8 timers: 16-bit for advanced motor control, four 16-bit general-purpose, two watchdogs, SysTick timer
• Calendar RTC with alarm and periodic wakeup from Stop/Standby

Figure 3. STM32G030Jx SO8N pinout

Figure 4. STM32G030Fx TSSOP20 pinout

Figure 5. STM32G030KxT LQFP32 pinout

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Figure 6. STM32G030CxT LQFP48 pinout

Table 11. Terms and symbols used in Pin assignment and description table

Table 11. Terms and symbols used in Pin assignment and description table

Table 12. Pin assignment and description

Table 12. Pin assignment and description

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Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

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Table 12. Pin assignment and description (continued)

1. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current (3 mA), the use of GPIOs PC13 to PC15 in output mode is limited:

• These GPIOs must not be used as current sources (for example to drive a LED).
• The speed should not exceed 2 MHz with a maximum load of 30 pF

1. After an RTC domain power-up, PC13, PC14 and PC15 operate as GPIOs. Their function then depends on the content of the RTC registers. The RTC registers are not reset upon system reset. For details on how to manage these GPIOs, refer to the RTC domain and RTC register descriptions in the RM0444 reference manual.
2. As in SO8N device, the PA0, PA1, and PA2 GPIOs are bonded with NRST on the pin 4, low level applied to any of these GPIOs provokes the device reset. To prevent the risk of spurious resets, keep these GPIOs configured at all times as analog or digital inputs (as opposed to output or alternate function).
3. Pins PA9 and PA10 can be remapped in place of pins PA11 and PA12 (default mapping), using SYSCFG_CFGR1 register.
4. Upon reset, these pins are configured as SW debug alternate functions, and the internal pull-up on PA13 pin and the internal pull-down on PA14 pin are activated.

Table 13. Port A alternate function mapping

Table 13. Port A alternate function mapping

Table 14. Port B alternate function mapping

Table 14. Port B alternate function mapping

Stresses above the absolute maximum ratings listed in Table 18 , Table 19 and Table 20 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. The device mission profile (application conditions) is compliant with the JEDEC JESD47 qualification standard.

All voltages are defined with respect to V SS .

Table 18. Voltage characteristics

1. To sustain a voltage higher than 4 V the internal pull-up/pull-down resistors must be disabled.
2. When an FT_a pin is used by an analog peripheral such as ADC, the maximum V IN is 4 V.

Table 19. Current characteristics

Table 19. Current characteristics

Table 19. Current characteristics (continued)

1. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
2. When several inputs are submitted to a current injection, the maximum ∑ |I INJ(PIN) | is the absolute sum of the negative injected currents (instantaneous values).

Table 20. Thermal characteristics

The operating junction temperature T J must never exceed the maximum given in Table 21: General operating conditions

The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is:

$$T_J(max) = T_A(max) + P_D(max) \times \Theta_{JA}$$

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com . ECOPACK is an ST trademark.