STM32G030C8T6

Part: STM32G030x6/x8 — STMicroelectronics

Type: 32-bit ARM Cortex-M0+ Microcontroller

Description: Mainstream 32-bit ARM Cortex-M0+ MCU operating up to 64 MHz with up to 64 KB Flash, 8 KB SRAM, 12-bit ADC, and flexible communication interfaces on a 2.0 V to 3.6 V supply.

Operating Conditions:

• Supply voltage: 2.0 to 3.6 V
• Operating temperature: -40 to 85 °C (ambient), -40 to 105 °C (junction)
• Clock frequency: up to 64 MHz (fHCLK, fPCLK)
• Backup supply voltage (VBAT): 1.55 to 3.6 V

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V
• Max continuous current: 100 mA (current into VDD/VDDA power pin)
• Max junction/storage temperature: 150 °C (maximum junction temperature), -65 to +150 °C (storage temperature)

Key Specs:

• Maximum CPU frequency: 64 MHz
• Flash memory: up to 64 KB
• SRAM: 8 KB with hardware parity check
• ADC resolution and conversion time: 12-bit, 0.4 μs (up to 2.5 MSps)
• Total output current sunk/sourced by sum of all I/Os: 80 mA max
• Output current sunk/sourced by standard I/O pin: 15 mA max (20 mA for FT_f pin sink)
• DMA controller: 5 channels with DMAMUX
• Communication interfaces: 2x I2C (up to 1 Mbit/s Fast-mode Plus), 2x SPI (up to 32 Mbit/s), 2x USART

Features:

• High-performance Arm Cortex-M0+ 32-bit RISC core with MPU
• 16-bit advanced motor control timer with PWM generation
• Four 16-bit general-purpose timers, SysTick timer, and two watchdog timers
• Internal 16 MHz RC oscillator with PLL option and internal 32 kHz RC oscillator
• Low-power operating modes: Sleep, Stop, Standby, and VBAT mode for RTC and backup registers
• Up to 44 fast I/Os, all mappable on external interrupt vectors with 5 V tolerance
• Serial wire debug (SWD) support

Applications:

• Consumer electronics
• Industrial applications
• Appliance domains
• Internet of Things (IoT) solutions

Package:

• LQFP48 (7 x 7 mm)
• LQFP32 (7 x 7 mm)
• TSSOP20
• SO8N (8 pins)

• Core: Arm ® 32-bit Cortex ® -M0+ CPU, frequency up to 64 MHz
• -40°C to 85°C operating temperature
• Memories
• -Up to 64 Kbytes of Flash memory with protection
• -8 Kbytes of SRAM with HW parity check
• CRC calculation unit
• Reset and power management
• -Voltage range: 2.0 V to 3.6 V
• -Power-on/Power-down reset (POR/PDR)
• -Low-power modes: Sleep, Stop, Standby
• -VBAT supply for RTC and backup registers
• Clock management
• -4 to 48 MHz crystal oscillator
• -32 kHz crystal oscillator with calibration
• -Internal 16 MHz RC with PLL option
• -Internal 32 kHz RC oscillator (±5 %)
• Up to 44 fast I/Os
• -All mappable on external interrupt vectors
• -Multiple 5 V-tolerant I/Os
• 5-channel DMA controller with flexible mapping
• 12-bit, 0.4 μs ADC (up to 16 ext. channels)
• -Up to 16-bit with hardware oversampling
• -Conversion range: 0 to 3.6V
• 8 timers: 16-bit for advanced motor control, four 16-bit general-purpose, two watchdogs, SysTick timer
• Calendar RTC with alarm and periodic wakeup from Stop/Standby

Figure 3. STM32G030CxT LQFP48 pinout

Figure 4. STM32G030KxT LQFP32 pinout

34

Figure 5. STM32G030Fx TSSOP20 pinout

MSv47963V1

20

19

18

17

16

15

14

13

1

2

3

4

5

6

7

8

PB7/PB8

VDD/VDDA

PA1

NRST

PB3/PB4/PB5/PB6

PA13

PA5

PA6

PA7

PB0/PB1/PB2/PA8

12

11

9

10

PA3

PA15/PA14-BOOT0

VSS/VSSA

PA4

PB9/PC14-OSC32_IN

PC15-OSC32_OUT

PA11[PA9]

PA12[PA10]

PA0

PA2

Top view

Figure 6. STM32G030Jx SO8N pinout

MSv47964V1

1

2

3

4

• 8 PB5/PB6/PA14-BOOT0/PA15

• 7 PA13

• 6 PA12[PA10]

• 5 PA8/PA11[PA9]/PB0/PB1

PB7/PB8/PB9/PC14-OSC32_IN

PA0/PA1/PA2/NRST

• VDD/VDDA

• VSS/VSSA

Top view

Table 11. Terms and symbols used in Table 12

Table 11. Terms and symbols used in Table 12

Table 11. Terms and symbols used in Table 12 (continued)

Table 12. Pin assignment and description

Table 12. Pin assignment and description

34

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

34

Table 12. Pin assignment and description (continued)

1. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current (3 mA), the use of GPIOs PC13 to PC15 in output mode is limited:

• These GPIOs must not be used as current sources (for example to drive a LED).
• The speed should not exceed 2 MHz with a maximum load of 30 pF

1. After an RTC domain power-up, PC13, PC14 and PC15 operate as GPIOs. Their function then depends on the content of the RTC registers. The RTC registers are not reset upon system reset. For details on how to manage these GPIOs, refer to the RTC domain and RTC register descriptions in the RM0444 reference manual.
2. For the device in SO8N package, the PA0, PA1, and PA2 GPIOs are bonded with NRST on the pin 4. In order not to interfere with device functions, they must not be set in alternate function or in output but remain at all times in input configuration.
3. Pins PA9 and PA10 can be remapped in place of pins PA11 and PA12 (default mapping), using SYSCFG_CFGR1 register.
4. Upon reset, these pins are configured as SW debug alternate functions, and the internal pull-up on PA13 pin and the internal pull-down on PA14 pin are activated.

Table 13. Port A alternate function mapping

Table 13. Port A alternate function mapping

Table 14. Port B alternate function mapping

Table 14. Port B alternate function mapping

The definition and values of input/output AC characteristics are given in Figure 18 and Table 51 , respectively.

Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 21: General operating conditions .

Table 51. I/O AC characteristics (1)(2)

Table 51. I/O AC characteristics (1)(2)

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Table 51. I/O AC characteristics (1)(2) (continued)

1. Guaranteed by design.
2. This value represents the I/O capability but the maximum system frequency is limited to 64 MHz.
3. The fall time is defined between 70% and 30% of the output waveform, according to I 2 C specification.

Figure 18. I/O AC characteristics definition (1)

1. Refer to Table 51: I/O AC characteristics .

Stresses above the absolute maximum ratings listed in Table 18 , Table 19 and Table 20 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

All voltages are defined with respect to V SS .

Table 18. Voltage characteristics

Table 19. Current characteristics

Table 20. Thermal characteristics

The operating junction temperature T J must never exceed the maximum given in Table 21: General operating conditions

The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is:

$$T_J(\text{max}) = T_A(\text{max}) + P_D(\text{max}) \times \Theta_{JA}$$

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com . ECOPACK is an ST trademark.