STM32G070RBT6

Part: STM32G070CB/KB/RB — STMicroelectronics

Type: ARM Cortex-M0+ 32-bit MCU

Description: 32-bit ARM Cortex-M0+ MCU operating at up to 64 MHz with 128 KB Flash, 36 KB SRAM, multiple communication interfaces, and a 12-bit ADC, designed for a 2.0-3.6 V supply.

Operating Conditions:

• Supply voltage: 2.0 V to 3.6 V
• Operating temperature: -40°C to 85°C
• CPU frequency: up to 64 MHz

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V (VDD, VDDA, VDDIO2)
• Max junction/storage temperature: 150 °C (Storage temperature)

Key Specs:

• Flash memory: 128 Kbytes
• SRAM: 36 Kbytes (32 Kbytes with HW parity check)
• ADC resolution: 12-bit
• ADC conversion time: 0.4 μs
• I2C Fast-mode Plus speed: 1 Mbit/s
• SPI speed: 32 Mbit/s
• Internal 16 MHz RC oscillator accuracy: ±1% (at 25°C, 3.3V)
• Internal 32 kHz RC oscillator accuracy: ±5%

Features:

• Arm 32-bit Cortex-M0+ CPU
• CRC calculation unit
• Power-on/Power-down reset (POR/PDR)
• Low-power modes: Sleep, Stop, Standby
• VBAT supply for RTC and backup registers
• Multiple 5 V-tolerant I/Os
• 7-channel DMA controller
• 11 timers: advanced motor control, general-purpose, basic, watchdogs, SysTick
• Calendar RTC with alarm and periodic wakeup

Applications:

Package:

• LQFP64 (10 × 10 mm)
• LQFP48 (7 × 7 mm)
• LQFP32 (7 × 7 mm)

• Includes ST state-of-the-art patented technology
• Core: Arm ® 32-bit Cortex ® -M0+ CPU, frequency up to 64 MHz
• -40°C to 85°C operating temperature
• Memories
• -128 Kbytes of flash memory with protection -36 Kbytes of SRAM (32 Kbytes with HW parity check)
• CRC calculation unit
• Reset and power management
• -Power-on/Power-down reset (POR/PDR)
• -Voltage range: 2.0 V to 3.6 V
• -Low-power modes: Sleep, Stop, Standby
• -VBAT supply for RTC and backup registers
• Clock management
• -32 kHz crystal oscillator with calibration
• -4 to 48 MHz crystal oscillator
• -Internal 16 MHz RC with PLL option
• -Internal 32 kHz RC oscillator (±5 %)
• Up to 59 fast I/Os
• -Multiple 5 V-tolerant I/Os
• -All mappable on external interrupt vectors
• 7-channel DMA controller with flexible mapping
• 12-bit, 0.4 μs ADC (up to 16 ext. channels)
• -Conversion range: 0 to 3.6V
• -Up to 16-bit with hardware oversampling
• 11 timers: 16-bit for advanced motor control, five 16-bit general-purpose, two basic 16-bit, two watchdogs, SysTick timer
• Calendar RTC with alarm and periodic wakeup from Stop/Standby

Figure 3. STM32G070KxT LQFP32 pinout

Figure 4. STM32G070CxT LQFP48 pinout

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Figure 5. STM32G070RxT LQFP64 pinout

Table 10. Terms and symbols used in Pin assignment and description table

Table 11. Pin assignment and description

Table 11. Pin assignment and description

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Table 11. Pin assignment and description (continued)

Table 11. Pin assignment and description (continued)

Table 11. Pin assignment and description (continued)

Table 11. Pin assignment and description (continued)

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Table 11. Pin assignment and description (continued)

Table 11. Pin assignment and description (continued)

Table 11. Pin assignment and description (continued)

1. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current (3 mA), the use of GPIOs PC13 to PC15 in output mode is limited:

• These GPIOs must not be used as current sources (for example to drive a LED).

• The speed should not exceed 2 MHz with a maximum load of 30 pF

1. After an RTC domain power-up, PC13, PC14 and PC15 operate as GPIOs. Their function then depends on the content of the RTC registers as they are not reset by the system reset. For details on how to manage these GPIOs, refer to the RTC domain and RTC register descriptions in the RM0444 reference manual.
2. Upon reset, a pull-down resistor might be present on PA8, PB15, PD0, or PD2, depending on the voltage level on PA9/PC6, PA10/PB0, PD1, and PD3, respectively. In order to disable this resistor, strobe the UCPDx_STROBE bit of the SYSCFG_CFGR1 register during start-up sequence.
3. Pins PA9/PA10 can be remapped in place of pins PA11/PA12 (default mapping), using SYSCFG_CFGR1 register.
4. Upon reset, these pins are configured as SW debug alternate functions, and the internal pull-up on PA13 pin and the internal pull-down on PA14 pin are activated.

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Table 12. Port A alternate function mapping

Table 12. Port A alternate function mapping

Table 12. Port A alternate function mapping

Table 13. Port B alternate function mapping

Table 13. Port B alternate function mapping

Table 14. Port C alternate function mapping

Table 14. Port C alternate function mapping

Table 15. Port D alternate function mapping

Stresses above the absolute maximum ratings listed in Table 17 , Table 18 and Table 19 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. The device mission profile (application conditions) is compliant with the JEDEC JESD47 qualification standard.

All voltages are defined with respect to V SS .

Table 17. Voltage characteristics

1. Refer to Table 18 for the maximum allowed injected current values.
2. To sustain a voltage higher than 4 V the internal pull-up/pull-down resistors must be disabled.
3. When an FT_a pin is used by an analog peripheral such as ADC, the maximum V IN is 4 V.

Table 18. Current characteristics

Table 18. Current characteristics

Table 18. Current characteristics (continued)

1. A positive injection is induced by V IN > V DDIO1 while a negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer also to Table 17: Voltage characteristics for the maximum allowed input voltage values.
2. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
3. On these I/Os, any current injection disturbs the analog performances of the device.
4. When several inputs are submitted to a current injection, the maximum ∑ |I INJ(PIN) | is the absolute sum of the negative injected currents (instantaneous values).

Table 19. Thermal characteristics

The operating junction temperature T J must never exceed the maximum given in Table 20: General operating conditions .

The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is:

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com . ECOPACK is an ST trademark.