Part: STM32F446xC/E

Type: ARM Cortex-M4 32-bit MCU

Description: Arm® Cortex®-M4 32-bit MCU+FPU with 225 DMIPS, up to 512 KB Flash, 128+4 KB RAM, and a maximum frequency of 180 MHz.

Operating Conditions:

• Supply voltage: 1.7 V to 3.6 V
• Operating temperature: -40 to +125 °C
• Max CPU frequency: 180 MHz

Absolute Maximum Ratings:

• Max supply voltage (VDD): 4.0 V
• Max total current into VDD: 150 mA
• Max storage temperature: -65 to +150 °C

Key Specs:

• Core: Arm® 32-bit Cortex®-M4 CPU with FPU
• Max CPU frequency: 180 MHz
• Flash memory: Up to 512 Kbytes
• SRAM: 128 Kbytes + 4 KB backup SRAM
• ADC: 3x 12-bit, 2.4 MSPS (up to 7.2 MSPS in triple interleaved mode)
• DAC: 2x 12-bit converters
• Communication interfaces: Up to 4x I2C, 4x SPI (45 Mbits/s), 4x USART, 2x UART (11.25 Mbit/s), 2x CAN
• USB: USB 2.0 full-speed/high-speed device/host/OTG controller
• Run mode current (typ): 30.5 mA (VDD=3.3V, fHCLK=180MHz, ART accelerator enabled)
• Standby mode current (typ): 1.5 μA (VDD=3.3V)

Features:

• Adaptive real-time accelerator (ART Accelerator)
• Flexible external memory controller (SRAM,

• Core: Arm ® 32-bit Cortex ® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 180 MHz, MPU, 225 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• Memories
• -512 Kbytes of Flash memory
• -128 Kbytes of SRAM
• -Flexible external memory controller with up to 16-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND Flash memories
• -Dual mode QuadSPI interface
• LCD parallel interface, 8080/6800 modes
• Clock, reset and supply management
• -1.7 V to 3.6 V application supply and I/Os
• -POR, PDR, PVD and BOR
• -4 to 26 MHz crystal oscillator
• -Internal 16 MHz factory-trimmed RC (1% accuracy)
• -32 kHz oscillator for RTC with calibration
• -Internal 32 kHz RC with calibration
• Low power
• -Sleep, Stop and Standby modes
• -VBAT supply for RTC, 20×32 bit backup registers plus optional 4 KB backup SRAM
• 3× 12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode
• 2× 12-bit D/A converters
• General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
• Up to 17 timers: 2x watchdog, 1x SysTick timer and up to twelve 16-bit and two 32-bit timers up to 180 MHz, each with up to four IC/OC/PWM or pulse counter
• Debug mode
• -SWD and JTAG interfaces
• -Cortex ® -M4 Trace Macrocell™

DS10693 Rev 10

STM32F446RCT6 – 64-LQFP Pinout

Notes

• PC13–PC15: Limited output capability (2 MHz max frequency); typically used for RTC and oscillator pins.
• PA13, PA14, PA15, PB3, PB4: JTAG/SWD debug pins; can be repurposed as GPIO after debug interface is disabled.
• VBAT (Pin 1): Dedicated battery supply for RTC and backup registers; must be decoupled with a capacitor.
• VCAP_1 (Pin 31): Internal voltage regulator decoupling capacitor pin; requires a 100 nF capacitor to ground.
• PH0, PH1: Oscillator pins; PH0 is input-only during oscillator operation.
• All I/O pins are 5V-tolerant (FT) except where noted in the alternate function table.
• Refer to Table 11 (Alternate Functions) in the datasheet for complete peripheral mapping (SPI, UART, I2C, CAN, SAI, FMC, SDIO, etc.).

The definition and values of input/output AC characteristics are given in Figure 32 and Table 58 , respectively.

Unless otherwise specified, the parameters given in Table 58 are derived from tests performed under the ambient temperature and V DD supply voltage conditions summarized in Table 16 .

Table 58. I/O AC characteristics (1)(2)

Table 58. I/O AC characteristics (1)(2)

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Table 58. I/O AC characteristics (1)(2) (continued)

Table 58. I/O AC characteristics (1)(2) (continued)

1. Guaranteed by design.
2. The I/O speed is configured using the OSPEEDRy[1:0] bits. Refer to the STM32F4xx reference manual for a description of the GPIOx_SPEEDR GPIO port output speed register.
3. The maximum frequency is defined in Figure 32 .
4. For maximum frequencies above 50 MHz and V DD > 2.4 V, the compensation cell should be used.

Figure 32. I/O AC characteristics definition

Stresses above the absolute maximum ratings listed in Table 13 , Table 14 , and Table 15 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Device mission profile (application conditions) is compliant with JEDEC JESD47 Qualification Standard, extended mission profiles are available on demand.

Table 13. Voltage characteristics

1. VIN maximum value must always be respected. Refer to Table 14 for the values of the maximum allowed injected current.

Table 14. Current characteristics

Table 14. Current characteristics

1. A positive injection is induced by V IN >V DDA while a negative injection is induced by V IN <V SS . IINJ(PIN) must never be exceeded. Refer to Table 13 for the maximum allowed input voltage value.

2. When several inputs are submitted to a current injection, the maximum Σ I INJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values).

Table 15. Thermal characteristics

171

The maximum chip-junction temperature, T J max, in degrees Celsius, can be calculated using the following equation:

T J max = T A max + (P D max x JA )

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com .