MSPM0G1519SPMR
Mixed-Signal MicrocontrollerThe MSPM0G1519SPMR is a mixed-signal microcontroller from Texas Instruments. View the full MSPM0G1519SPMR datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
MSPM0G1519SPMR shares its datasheet with MSPM0G1519, whose page lists every part number it covers.
Official MSPM0G1519SPMR datasheet (PDF) — the source this page was extracted from.
MSPM0G1519SPMR Key Specifications
| Parameter | Value |
|---|---|
| Connectivity | DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART |
| Core Processor | ARM® Cortex®-M0+ |
| Core Size | 32-Bit |
| Data Converters | A/D 27x12b SAR; D/A 1x12b |
| Mounting Type | Surface Mount |
| Number of I/O | 60 |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Oscillator Type | External, Internal |
| Package / Case | 64-LQFP |
| Packaging | MouseReel |
| Peripherals | AES, Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT |
| Flash Memory Size | 512KB (512K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 128K x 8 B |
| Clock Speed | 80MHz |
| Standard Pack Qty | 1000 |
| Supplier Device Package | 64-LQFP (10x10) |
| Supply Voltage | 1.62V ~ 3.6V |
MSPM0G1519SPMR Overview
Part: MSPM0G1519SPMR — Texas Instruments
Type: ARM Cortex-M0+ Mixed-Signal Microcontroller
Description: 32-bit Arm Cortex-M0+ MCU at up to 80 MHz with 512 KB dual-bank flash and 128 KB SRAM, 1.62–3.6 V supply, dual 12-bit 4 Msps ADCs, in a 64-pin LQFP package.
Operating Conditions:
- Supply voltage: 1.62–3.6 V
- Operating temperature: -40 to 125 °C (ambient)
- Max CPU clock: 80 MHz with 2 flash wait states (48 MHz with 1 wait state, 24 MHz with 0 wait states)
- Max ULPCLK frequency: 40 MHz
Absolute Maximum Ratings:
- Max supply voltage (VDD): 4.1 V
- Input voltage: -0.3 to 5.5 V on 5-V tolerant open-drain pins; -0.3 to VDD + 0.3 V (4.1 V max) on common-tolerance pins
- Current into VDD pin: 80 mA (-40 °C ≤ Tj ≤ 130 °C); 100 mA (-40 °C ≤ Tj ≤ 90 °C)
- Max junction temperature: 130 °C
- Storage temperature: -40 to 150 °C
Key Specs:
- CPU: Arm Cortex-M0+ with MPU, up to 80 MHz
- Memory: 512 KB flash with ECC (dual-bank, address swap), 16 KB data flash, 128 KB SRAM
- ADC: two simultaneously sampling 12-bit 4 Msps ADCs, up to 27 external channels
- DAC: one 12-bit 1 Msps; three comparators with 8-bit reference DACs
- RUN: 123 μA/MHz (CoreMark); SLEEP: 38 μA/MHz; STOP: 223 μA at 4 MHz
- STANDBY: 1.7 μA at 32 kHz with RTC and SRAM Bank 0 retention
- SHUTDOWN: 92 nA with IO wake-up
- Up to 94 GPIOs (device-dependent by package); three high-drive IOs with 20 mA drive
Features:
- Seven UARTs, three I2C (up to 1 Mbit/s FM+), three SPI (one up to 32 Mbit/s)
- 12-channel DMA controller and math accelerator (DIV, SQRT, MAC, TRIG)
- Nine timers supporting up to 28 PWM channels; two advanced timers with deadband
- AES-128/256 accelerator, secure key storage, firewalls, TRNG, CRC-16/CRC-32
- Internal 4–32 MHz oscillator, PLL up to 80 MHz, 32 kHz LFOSC, external HFXT and LFXT crystal support
- Configurable 1.4 V or 2.5 V internal voltage reference and integrated temperature sensor
- 2-pin serial wire debug (SWD)
- The G15xx variants have no CAN interface; the G35xx variants have two CAN-FD interfaces
Applications:
- Motor control
- Home appliances
- Uninterruptible power supplies and inverters
- Electronic point of sale systems
- Medical and healthcare
- Test and measurement
- Factory automation and control
- Smart metering
- Lighting
Package:
- PM: 64-pin LQFP, 12 mm x 12 mm, 0.5 mm pitch
MSPM0G1519SPMR Features
| BUFFER TYPE | INVERSION CONTROL | DRIVE STRENGTH CONTROL | HYSTERESIS CONTROL | PULLUP RESISTOR | PULLDOWN RESISTOR | WAKEUP LOGIC |
|---|---|---|---|---|---|---|
| ODIO (5V-tolerant open drain) | Y | Y | Y | Y |
- Standard with Wake allows the I/O to wake up the device from the lowest low-power mode of SHUTDOWN. All I/O can be configured to wakeup the MCU from higher low-power modes. See section GPIO FastWake in the MSPM0 G-Series 80MHz Microcontrollers Technical Reference Manual . for details.
MSPM0G1519SPMR Applications
MSPM0G1519SPMR Pin Configuration
The System Configuration tool provides a graphical interface to enable, configurable, and generate initialization code for pin multiplexing and simplifying pin settings. The pin diagrams shown in the data sheet show the primary peripheral functions, some of the integrated device features, and available clock signals to simplify the device pinout.
For full descriptions of the pin functions, see the Pin Attributes and Signal Descriptions sections.
MSPM0G1519SPMR Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
| PARAMETER | PARAMETER | TEST CONDITIONS | TEST CONDITIONS | MIN | TYP | MAX | UNIT |
|---|---|---|---|---|---|---|---|
| ODIO (1) | VDD≥1.62V | 0.7*VDD | 5.5 | V | |||
| V IH | High level input voltage | VDD≥2.7V | 2 | 5.5 | V | ||
| V IH | High level input voltage | All I/O except ODIO & Reset | VDD≥1.62V | 0.7*VDD | VDD+0.3 | V | |
| VDD≥1.62V | -0.3 | 0.3*VDD | V | ||||
| V IL | Low level input voltage | ODIO | VDD≥2.7V | -0.3 | 0.8 | V | |
| V IL | Low level input voltage | All I/O except ODIO & Reset | VDD≥1.62V | -0.3 | 0.3*VDD | V | |
| V | ODIO | 0.05*VDD | V | ||||
| HYS | Hysteresis | All I/O except ODIO | 0.1*VDD | V | |||
| I lkg | High-Z leakage current (All packages except PZ, PN, PM) | SDIO (2) (3) | 1.62V ≤ VDD ≤ 3.6V, -40 °C ≤ T a ≤ 125 °C | 50 (4) | nA | ||
| High-Z leakage current (PZ, PN, PM package) | SDIO (2) (3) | 1.62V ≤ VDD ≤ 3.6V, -40 °C ≤ T a ≤ 25 °C | 70 (4) | nA | |||
| High-Z leakage current (PZ, PN, PM package) | SDIO (2) (3) | 1.62V ≤ VDD ≤ 3.6V, -40 °C ≤ T a ≤ 125 °C | 400 (4) | nA | |||
| R PU | Pull up resistance | All I/O except ODIO | VIN = VSS | 40 | kΩ | ||
| R PD | Pull down resistance | VIN = VDD | 40 | kΩ | |||
| C I | Input capacitance | VDD = 3.3V | 5 | pF | |||
| V OH | High level output voltage | SDIO | VDD≥2.7V, |I IO | ,max =6mA VDD≥1.71V, |I IO | ,max =2mA VDD≥1.62V, |I IO | ,max =1.5mA -40 °C ≤ T a ≤ 25 °C | VDD-0.4 | V | ||
| V OH | High level output voltage | SDIO | VDD≥2.7V, |I IO | ,max =6mA VDD≥1.71V, |I IO | ,max =2mA VDD≥1.62V, |I IO | ,max =1.5mA -40 °C ≤ T a ≤ 125 °C | VDD-0.45 | V | ||
| V OH | High level output voltage | HSIO | VDD≥2.7V, DRV=1, |I IO | ,max =6mA VDD≥1.71V, DRV=1, |I IO | ,max =3mA VDD≥1.62V, DRV=1, |I IO | ,max =2mA -40 °C ≤ T a ≤ 25 °C | VDD-0.4 | V | ||
| V OH | High level output voltage | HSIO | VDD≥2.7V, DRV=1, |I IO | ,max =6mA VDD≥1.71V, DRV=1, |I IO | ,max =3mA VDD≥1.62V, DRV=1, |I IO | ,max =2mA -40 °C ≤ T a ≤ 125 °C VDD≥2.7V, DRV=0, |I | =4mA | VDD-0.45 | V | ||
| V OH | High level output voltage | HSIO | IO ,max VDD≥1.62V, DRV=0, |I IO | ,max =1.5mA -40 °C ≤ T a ≤ 25 °C VDD≥2.7V, DRV=0, |I IO | ,max =4mA VDD≥1.71V, DRV=0, |I IO | ,max =2mA | VDD-0.4 | V | ||
| V OH | High level output voltage | HSIO | VDD≥1.62V, DRV=0, |I IO | ,max =1.5mA -40 °C ≤ T a ≤ 125 °C | VDD-0.45 | V | ||
| V OH | High level output voltage | HDIO | VDD≥2.7V, DRV=1 (5) , |I IO | ,max =20mA VDD≥1.71V, DRV=1 (5) , | I IO | ,max =10mA | VDD-0.4 | V | ||
| V OH | High level output voltage | HDIO | VDD≥2.7V, DRV=0, |I IO | ,max =6mA VDD≥1.71V, DRV=0, |I IO | ,max =2mA | VDD-0.4 | V |
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
| PARAMETER | TEST | CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|---|
| V OL | Low level output voltage | SDIO | VDD≥2.7V, |I IO | ,max =6mA VDD≥1.71V, |I IO | ,max =2mA VDD≥1.62V, |I IO | ,max =1.5mA -40 °C ≤ T a ≤ 25 °C | 0.4 | |||
| V OL | Low level output voltage | SDIO | VDD≥2.7V, |I IO | ,max =6mA VDD≥1.71V, |I IO | ,max =2mA VDD≥1.62V, |I IO | ,max =1.5mA -40 °C ≤ T a ≤ 125 °C | 0.45 | |||
| V OL | Low level output voltage | HSIO | VDD≥2.7V, DRV=1, |I IO | ,max =6mA VDD≥1.71V, DRV=1, |I IO | ,max =3mA VDD≥1.62V, DRV=1, |I IO | ,max =2mA -40 °C ≤ T a ≤ 25 °C | 0.4 | |||
| V OL | Low level output voltage | HSIO | VDD≥2.7V, DRV=1, |I IO | ,max =6mA VDD≥1.71V, DRV=1, |I IO | ,max =3mA VDD≥1.62V, DRV=1, |I IO | ,max =2mA -40 °C ≤ T a ≤ 125 °C | 0.45 | |||
| V OL | Low level output voltage | HSIO | VDD≥2.7V, DRV=0, |I IO | ,max =4mA VDD≥1.71V, DRV=0, |I IO | ,max =2mA VDD≥1.62V, DRV=0, |I IO | ,max =1.5mA -40 °C ≤ T a ≤ 25 °C | 0.4 | V | ||
| V OL | Low level output voltage | HSIO | VDD≥2.7V, DRV=0, |I IO | ,max =4mA VDD≥1.71V, DRV=0, |I IO | ,max =2mA VDD≥1.62V, DRV=0, |I IO | ,max =1.5mA -40 °C ≤ T a ≤ 125 °C | 0.45 | |||
| V OL | Low level output voltage | HDIO | VDD≥2.7V, DRV=1 (5) , |I IO | ,max =20mA VDD≥1.71V, DRV=1 (5) , | I IO | ,max =10mA | 0.4 | |||
| V OL | Low level output voltage | HDIO | VDD≥2.7V, DRV=0, |I IO | ,max =6mA VDD≥1.71V, DRV=0, |I IO | ,max =2mA | 0.4 | |||
| V OL | Low level output voltage | ODIO | VDD≥2.7V, I OL,max =8mA VDD≥1.71V, I OL,max =4mA -40 °C ≤ T a ≤ 25 °C | 0.4 | |||
| V OL | Low level output voltage | ODIO | VDD≥2.7V, I OL,max =8mA VDD≥1.71V, I OL,max =4mA -40 °C ≤ T a ≤ 125 °C | 0.45 |
MSPM0G1519SPMR Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| VDD | Supply voltage | At VDD pin | -0.3 | 4.1 | V |
| V I | Input voltage | Applied to any 5-V tolerant open-drain pins | -0.3 | 5.5 | V |
| V I | Input voltage | Applied to any common tolerance pins | -0.3 | V DD + 0.3 (4.1 MAX) | V |
| I VDD (3) | Current into VDD pin (source) | -40 °C ≤ T j ≤ 130 °C | 80 | mA | |
| I VDD (3) | Current into VDD pin (source) | -40 °C ≤ Tj ≤ 90 °C | 100 | mA | |
| I VSS (3) | Current out of VSS pin (sink) | -40 °C ≤ T j ≤ 130 °C | 80 | mA | |
| I VSS (3) | Current out of VSS pin (sink) | -40 °C ≤ Tj ≤ 90 °C | 100 | mA | |
| I IO | Current of SDIO pin | Current sunk or sourced by SDIO pin, VDD>=2.7V | 6 | mA | |
| I IO | Current of HSIO pin | Current sunk or sourced by HSIO pin, VDD>=2.7V | 6 | mA | |
| I IO | Current of HDIO pin | Current sunk or sourced by HDIO pin | 20 | mA | |
| I IO | Current of ODIO pin | Current sunk by ODIO pin | 20 | mA | |
| I D | Supported diode current | Diode current at any device pin (excluding Open Drain IO) | -2 | 2 | mA |
| T A | Ambient temperature | Ambient temperature | -40 | 125 | °C |
| T J | Junction temperature | Junction temperature | -40 | 130 | °C |
| T stg | Storage temperature (2) | Storage temperature (2) | -40 | 150 | °C |
- (3) For applications running at VDD=1.62V, I_VDD/I_VSS<=20mA is required to ensure device functionality
MSPM0G1519SPMR Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VDD | Supply voltage | 1.62 | 3.6 | V | |
| VCORE | Voltage on VCORE pin (2) | 1.35 | V | ||
| C VDD | Capacitor connected between VDD and VSS (1) | 10 | μF | ||
| C VCORE | Capacitor connected between VCORE and VSS (1) (2) | 470 | nF | ||
| T A | Ambient temperature | -40 | 125 | °C |
over operating free-air temperature range (unless otherwise noted)
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| T J | Max junction temperature | 130 | °C | ||
| f MCLK (PD1 bus clock) | MCLK, CPUCLK frequency with 2 flash wait states (3) | 80 | MHz | ||
| f MCLK (PD1 bus clock) | MCLK, CPUCLK frequency with 1 flash wait state (3) | 48 | MHz | ||
| f MCLK (PD1 bus clock) | MCLK, CPUCLK frequency with 0 flash wait states (3) | 24 | MHz | ||
| f ULPCLK (PD0 bus clock) | ULPCLK frequency | 40 | MHz |
MSPM0G1519SPMR Thermal Information
| THERMAL METRIC (1) | THERMAL METRIC (1) | PACKAGE | VALUE | UNIT |
|---|---|---|---|---|
| R θJA | Junction-to-ambient thermal resistance | nFBGA-100 (ZAW) | 53.4 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | nFBGA-100 (ZAW) | 21 | °C/W |
| R θJB | Junction-to-board thermal resistance | nFBGA-100 (ZAW) | 32.2 | °C/W |
| Ψ JT | Junction-to-top characterization parameter | nFBGA-100 (ZAW) | 0.7 | °C/W |
| Ψ JB | Junction-to-board characterization parameter | nFBGA-100 (ZAW) | 32 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | nFBGA-100 (ZAW) | N/A | °C/W |
| R θJA | Junction-to-ambient thermal resistance | LQFP-100 (PZ) | 72.1 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | LQFP-100 (PZ) | 21.4 | °C/W |
| R θJB | Junction-to-board thermal resistance | LQFP-100 (PZ) | 54.8 | °C/W |
| Ψ JT | Junction-to-top characterization parameter | LQFP-100 (PZ) | 1 | °C/W |
| Ψ JB | Junction-to-board characterization parameter | LQFP-100 (PZ) | 53.7 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | LQFP-100 (PZ) | N/A | °C/W |
| R θJA | Junction-to-ambient thermal resistance | LQFP-80 (PN) | 58.9 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | LQFP-80 (PN) | 18.9 | °C/W |
| R θJB | Junction-to-board thermal resistance | LQFP-80 (PN) | 38.7 | °C/W |
| Ψ JT | Junction-to-top characterization parameter | LQFP-80 (PN) | 0.9 | °C/W |
| Ψ JB | Junction-to-board characterization parameter | LQFP-80 (PN) | 38.2 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | LQFP-80 (PN) | N/A | °C/W |
| R θJA | Junction-to-ambient thermal resistance | LQFP-64 (PM) | 62 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | LQFP-64 (PM) | 21.6 | °C/W |
| R θJB | Junction-to-board thermal resistance | LQFP-64 (PM) | 39.1 | °C/W |
| Ψ JT | Junction-to-top characterization parameter | LQFP-64 (PM) | 1 | °C/W |
| Ψ JB | Junction-to-board characterization parameter | LQFP-64 (PM) | 38.7 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | LQFP-64 (PM) | N/A | °C/W |
| R θJA | Junction-to-ambient thermal resistance | LQFP-48 (PT) | 70.6 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | LQFP-48 (PT) | 27 | °C/W |
| R θJB | Junction-to-board thermal resistance | LQFP-48 (PT) | 42.5 | °C/W |
| Ψ JT | Junction-to-top characterization parameter | LQFP-48 (PT) | 1.5 | °C/W |
| Ψ JB | Junction-to-board characterization parameter | LQFP-48 (PT) | 42.1 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | LQFP-48 (PT) | N/A | °C/W |
| THERMAL METRIC (1) | THERMAL METRIC (1) | PACKAGE | VALUE | UNIT |
| R θJA | Junction-to-ambient thermal resistance | VQFN-48 (RGZ) | 28.3 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | VQFN-48 (RGZ) | 18.5 | °C/W |
| R θJB | Junction-to-board thermal resistance | VQFN-48 (RGZ) | 10.7 | °C/W |
| Ψ JT | Junction-to-top characterization parameter | VQFN-48 (RGZ) | 0.2 | °C/W |
| Ψ JB | Junction-to-board characterization parameter | VQFN-48 (RGZ) | 10.6 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | VQFN-48 (RGZ) | 2.8 | °C/W |
| R θJA | Junction-to-ambient thermal resistance | DSBGA-42 (YCJ) | 57 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | DSBGA-42 (YCJ) | 0.2 | °C/W |
| R θJB | Junction-to-board thermal resistance | DSBGA-42 (YCJ) | 12.9 | °C/W |
| Ψ JT | Junction-to-top characterization parameter | DSBGA-42 (YCJ) | 0.1 | °C/W |
| Ψ JB | Junction-to-board characterization parameter | DSBGA-42 (YCJ) | 12.9 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | DSBGA-42 (YCJ) | N/A | °C/W |
| R θJA | Junction-to-ambient thermal resistance | VQFN-32 (RHB) | 31.3 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | 22.6 | °C/W | |
| R θJB | Junction-to-board thermal resistance | 12.2 | °C/W | |
| Ψ JT | Junction-to-top characterization parameter | 0.3 | °C/W | |
| Ψ JB | Junction-to-board characterization parameter | 12.1 | °C/W | |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | 2.8 | °C/W |
MSPM0G1519SPMR Typical Application
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.
Variants on the same datasheet
These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.
| Part Number | Manufacturer | Package |
|---|---|---|
| MSPM0G1518 | Texas Instruments | — |
| MSPM0G1519 | Texas Instruments | — |
| MSPM0G1519SPNR | Texas Instruments | LQFP-80 |
| MSPM0G1519SPTR | Texas Instruments | LQFP-48 |
| MSPM0G1519SPZR | Texas Instruments | LQFP-100 |
| MSPM0G1519SRGZR | Texas Instruments | VQFN-48 7x7mm |
| MSPM0G1519SRHBR | Texas Instruments | VQFN-32 |
| MSPM0G1519SZAWR | Texas Instruments | nFBGA-100 9x9mm |
| MSPM0G3518 | Texas Instruments | — |
| MSPM0G3519 | Texas Instruments | — |
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