MSPM0G3518

Mixed-Signal Microcontroller

The MSPM0G3518 is a mixed-signal microcontroller from Texas Instruments. View the full MSPM0G3518 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

MSPM0G3518 shares its datasheet with MSPM0G1519, whose page lists every part number it covers.

Official MSPM0G3518 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Texas Instruments

MSPM0G3518 Key Specifications

Parameter	Value
Connectivity	DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
Core Processor	ARM® Cortex®-M0+
Core Size	32-Bit
Data Converters	A/D 27x12b SAR; D/A 1x12b
Mounting Type	Surface Mount
Number of I/O	60
Operating Temperature	-40°C ~ 125°C (TA)
Oscillator Type	External, Internal
Package / Case	64-LQFP
Packaging	MouseReel
Peripherals	AES, Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT
Flash Memory Size	512KB (512K x 8)
Program Memory Type	FLASH
RAM Size	128K x 8 B
Clock Speed	80MHz
Standard Pack Qty	1000
Supplier Device Package	64-LQFP (10x10)
Supply Voltage	1.62V ~ 3.6V

MSPM0G3518 Overview

Part: MSPM0G1519SPMR — Texas Instruments

Type: ARM Cortex-M0+ Mixed-Signal Microcontroller

Description: 32-bit Arm Cortex-M0+ MCU at up to 80 MHz with 512 KB dual-bank flash and 128 KB SRAM, 1.62–3.6 V supply, dual 12-bit 4 Msps ADCs, in a 64-pin LQFP package.

Operating Conditions:

Supply voltage: 1.62–3.6 V
Operating temperature: -40 to 125 °C (ambient)
Max CPU clock: 80 MHz with 2 flash wait states (48 MHz with 1 wait state, 24 MHz with 0 wait states)
Max ULPCLK frequency: 40 MHz

Absolute Maximum Ratings:

Max supply voltage (VDD): 4.1 V
Input voltage: -0.3 to 5.5 V on 5-V tolerant open-drain pins; -0.3 to VDD + 0.3 V (4.1 V max) on common-tolerance pins
Current into VDD pin: 80 mA (-40 °C ≤ Tj ≤ 130 °C); 100 mA (-40 °C ≤ Tj ≤ 90 °C)
Max junction temperature: 130 °C
Storage temperature: -40 to 150 °C

Key Specs:

CPU: Arm Cortex-M0+ with MPU, up to 80 MHz
Memory: 512 KB flash with ECC (dual-bank, address swap), 16 KB data flash, 128 KB SRAM
ADC: two simultaneously sampling 12-bit 4 Msps ADCs, up to 27 external channels
DAC: one 12-bit 1 Msps; three comparators with 8-bit reference DACs
RUN: 123 μA/MHz (CoreMark); SLEEP: 38 μA/MHz; STOP: 223 μA at 4 MHz
STANDBY: 1.7 μA at 32 kHz with RTC and SRAM Bank 0 retention
SHUTDOWN: 92 nA with IO wake-up
Up to 94 GPIOs (device-dependent by package); three high-drive IOs with 20 mA drive

Features:

Seven UARTs, three I2C (up to 1 Mbit/s FM+), three SPI (one up to 32 Mbit/s)
12-channel DMA controller and math accelerator (DIV, SQRT, MAC, TRIG)
Nine timers supporting up to 28 PWM channels; two advanced timers with deadband
AES-128/256 accelerator, secure key storage, firewalls, TRNG, CRC-16/CRC-32
Internal 4–32 MHz oscillator, PLL up to 80 MHz, 32 kHz LFOSC, external HFXT and LFXT crystal support
Configurable 1.4 V or 2.5 V internal voltage reference and integrated temperature sensor
2-pin serial wire debug (SWD)
The G15xx variants have no CAN interface; the G35xx variants have two CAN-FD interfaces

Applications:

Motor control
Home appliances
Uninterruptible power supplies and inverters
Electronic point of sale systems
Medical and healthcare
Test and measurement
Factory automation and control
Smart metering
Lighting

Package:

PM: 64-pin LQFP, 12 mm x 12 mm, 0.5 mm pitch

MSPM0G3518 Features

BUFFER TYPE	INVERSION CONTROL	DRIVE STRENGTH CONTROL	HYSTERESIS CONTROL	PULLUP RESISTOR	PULLDOWN RESISTOR	WAKEUP LOGIC
ODIO (5V-tolerant open drain)	Y		Y		Y	Y

Standard with Wake allows the I/O to wake up the device from the lowest low-power mode of SHUTDOWN. All I/O can be configured to wakeup the MCU from higher low-power modes. See section GPIO FastWake in the MSPM0 G-Series 80MHz Microcontrollers Technical Reference Manual . for details.

MSPM0G3518 Applications

www.ti.com

MSPM0G3518 Pin Configuration

The System Configuration tool provides a graphical interface to enable, configurable, and generate initialization code for pin multiplexing and simplifying pin settings. The pin diagrams shown in the data sheet show the primary peripheral functions, some of the integrated device features, and available clock signals to simplify the device pinout.

For full descriptions of the pin functions, see the Pin Attributes and Signal Descriptions sections.

MSPM0G3518 Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER	PARAMETER	TEST CONDITIONS	TEST CONDITIONS	MIN	TYP	MAX	UNIT
		ODIO (1)	VDD≥1.62V	0.7*VDD		5.5	V
V IH	High level input voltage		VDD≥2.7V	2		5.5	V
V IH	High level input voltage	All I/O except ODIO & Reset	VDD≥1.62V	0.7*VDD		VDD+0.3	V
			VDD≥1.62V	-0.3		0.3*VDD	V
V IL	Low level input voltage	ODIO	VDD≥2.7V	-0.3		0.8	V
V IL	Low level input voltage	All I/O except ODIO & Reset	VDD≥1.62V	-0.3		0.3*VDD	V
V		ODIO		0.05*VDD			V
HYS	Hysteresis	All I/O except ODIO		0.1*VDD			V
I lkg	High-Z leakage current (All packages except PZ, PN, PM)	SDIO (2) (3)	1.62V ≤ VDD ≤ 3.6V, -40 °C ≤ T a ≤ 125 °C			50 (4)	nA
	High-Z leakage current (PZ, PN, PM package)	SDIO (2) (3)	1.62V ≤ VDD ≤ 3.6V, -40 °C ≤ T a ≤ 25 °C			70 (4)	nA
	High-Z leakage current (PZ, PN, PM package)	SDIO (2) (3)	1.62V ≤ VDD ≤ 3.6V, -40 °C ≤ T a ≤ 125 °C			400 (4)	nA
R PU	Pull up resistance	All I/O except ODIO	VIN = VSS		40		kΩ
R PD	Pull down resistance		VIN = VDD		40		kΩ
C I	Input capacitance		VDD = 3.3V		5		pF
V OH	High level output voltage	SDIO	VDD≥2.7V, \|I IO \| ,max =6mA VDD≥1.71V, \|I IO \| ,max =2mA VDD≥1.62V, \|I IO \| ,max =1.5mA -40 °C ≤ T a ≤ 25 °C	VDD-0.4			V
V OH	High level output voltage	SDIO	VDD≥2.7V, \|I IO \| ,max =6mA VDD≥1.71V, \|I IO \| ,max =2mA VDD≥1.62V, \|I IO \| ,max =1.5mA -40 °C ≤ T a ≤ 125 °C	VDD-0.45			V
V OH	High level output voltage	HSIO	VDD≥2.7V, DRV=1, \|I IO \| ,max =6mA VDD≥1.71V, DRV=1, \|I IO \| ,max =3mA VDD≥1.62V, DRV=1, \|I IO \| ,max =2mA -40 °C ≤ T a ≤ 25 °C	VDD-0.4			V
V OH	High level output voltage	HSIO	VDD≥2.7V, DRV=1, \|I IO \| ,max =6mA VDD≥1.71V, DRV=1, \|I IO \| ,max =3mA VDD≥1.62V, DRV=1, \|I IO \| ,max =2mA -40 °C ≤ T a ≤ 125 °C VDD≥2.7V, DRV=0, \|I \| =4mA	VDD-0.45			V
V OH	High level output voltage	HSIO	IO ,max VDD≥1.62V, DRV=0, \|I IO \| ,max =1.5mA -40 °C ≤ T a ≤ 25 °C VDD≥2.7V, DRV=0, \|I IO \| ,max =4mA VDD≥1.71V, DRV=0, \|I IO \| ,max =2mA	VDD-0.4			V
V OH	High level output voltage	HSIO	VDD≥1.62V, DRV=0, \|I IO \| ,max =1.5mA -40 °C ≤ T a ≤ 125 °C	VDD-0.45			V
V OH	High level output voltage	HDIO	VDD≥2.7V, DRV=1 (5) , \|I IO \| ,max =20mA VDD≥1.71V, DRV=1 (5) , \| I IO \| ,max =10mA	VDD-0.4			V
V OH	High level output voltage	HDIO	VDD≥2.7V, DRV=0, \|I IO \| ,max =6mA VDD≥1.71V, DRV=0, \|I IO \| ,max =2mA	VDD-0.4			V

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

	PARAMETER	TEST	CONDITIONS	MAX	UNIT
V OL	Low level output voltage	SDIO	VDD≥2.7V, \|I IO \| ,max =6mA VDD≥1.71V, \|I IO \| ,max =2mA VDD≥1.62V, \|I IO \| ,max =1.5mA -40 °C ≤ T a ≤ 25 °C	0.4
V OL	Low level output voltage	SDIO	VDD≥2.7V, \|I IO \| ,max =6mA VDD≥1.71V, \|I IO \| ,max =2mA VDD≥1.62V, \|I IO \| ,max =1.5mA -40 °C ≤ T a ≤ 125 °C	0.45
V OL	Low level output voltage	HSIO	VDD≥2.7V, DRV=1, \|I IO \| ,max =6mA VDD≥1.71V, DRV=1, \|I IO \| ,max =3mA VDD≥1.62V, DRV=1, \|I IO \| ,max =2mA -40 °C ≤ T a ≤ 25 °C	0.4
V OL	Low level output voltage	HSIO	VDD≥2.7V, DRV=1, \|I IO \| ,max =6mA VDD≥1.71V, DRV=1, \|I IO \| ,max =3mA VDD≥1.62V, DRV=1, \|I IO \| ,max =2mA -40 °C ≤ T a ≤ 125 °C	0.45
V OL	Low level output voltage	HSIO	VDD≥2.7V, DRV=0, \|I IO \| ,max =4mA VDD≥1.71V, DRV=0, \|I IO \| ,max =2mA VDD≥1.62V, DRV=0, \|I IO \| ,max =1.5mA -40 °C ≤ T a ≤ 25 °C	0.4	V
V OL	Low level output voltage	HSIO	VDD≥2.7V, DRV=0, \|I IO \| ,max =4mA VDD≥1.71V, DRV=0, \|I IO \| ,max =2mA VDD≥1.62V, DRV=0, \|I IO \| ,max =1.5mA -40 °C ≤ T a ≤ 125 °C	0.45
V OL	Low level output voltage	HDIO	VDD≥2.7V, DRV=1 (5) , \|I IO \| ,max =20mA VDD≥1.71V, DRV=1 (5) , \| I IO \| ,max =10mA	0.4
V OL	Low level output voltage	HDIO	VDD≥2.7V, DRV=0, \|I IO \| ,max =6mA VDD≥1.71V, DRV=0, \|I IO \| ,max =2mA	0.4
V OL	Low level output voltage	ODIO	VDD≥2.7V, I OL,max =8mA VDD≥1.71V, I OL,max =4mA -40 °C ≤ T a ≤ 25 °C	0.4
V OL	Low level output voltage	ODIO	VDD≥2.7V, I OL,max =8mA VDD≥1.71V, I OL,max =4mA -40 °C ≤ T a ≤ 125 °C	0.45

MSPM0G3518 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

			MIN	MAX	UNIT
VDD	Supply voltage	At VDD pin	-0.3	4.1	V
V I	Input voltage	Applied to any 5-V tolerant open-drain pins	-0.3	5.5	V
V I	Input voltage	Applied to any common tolerance pins	-0.3	V DD + 0.3 (4.1 MAX)	V
I VDD (3)	Current into VDD pin (source)	-40 °C ≤ T j ≤ 130 °C		80	mA
I VDD (3)	Current into VDD pin (source)	-40 °C ≤ Tj ≤ 90 °C		100	mA
I VSS (3)	Current out of VSS pin (sink)	-40 °C ≤ T j ≤ 130 °C		80	mA
I VSS (3)	Current out of VSS pin (sink)	-40 °C ≤ Tj ≤ 90 °C		100	mA
I IO	Current of SDIO pin	Current sunk or sourced by SDIO pin, VDD>=2.7V		6	mA
I IO	Current of HSIO pin	Current sunk or sourced by HSIO pin, VDD>=2.7V		6	mA
I IO	Current of HDIO pin	Current sunk or sourced by HDIO pin		20	mA
I IO	Current of ODIO pin	Current sunk by ODIO pin		20	mA
I D	Supported diode current	Diode current at any device pin (excluding Open Drain IO)	-2	2	mA
T A	Ambient temperature	Ambient temperature	-40	125	°C
T J	Junction temperature	Junction temperature	-40	130	°C
T stg	Storage temperature (2)	Storage temperature (2)	-40	150	°C

(3) For applications running at VDD=1.62V, I_VDD/I_VSS<=20mA is required to ensure device functionality

MSPM0G3518 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

		MIN	NOM	MAX	UNIT
VDD	Supply voltage	1.62		3.6	V
VCORE	Voltage on VCORE pin (2)		1.35		V
C VDD	Capacitor connected between VDD and VSS (1)		10		μF
C VCORE	Capacitor connected between VCORE and VSS (1) (2)	470			nF
T A	Ambient temperature	-40		125	°C

over operating free-air temperature range (unless otherwise noted)

		MAX	UNIT
T J	Max junction temperature	130	°C
f MCLK (PD1 bus clock)	MCLK, CPUCLK frequency with 2 flash wait states (3)	80	MHz
f MCLK (PD1 bus clock)	MCLK, CPUCLK frequency with 1 flash wait state (3)	48	MHz
f MCLK (PD1 bus clock)	MCLK, CPUCLK frequency with 0 flash wait states (3)	24	MHz
f ULPCLK (PD0 bus clock)	ULPCLK frequency	40	MHz

MSPM0G3518 Thermal Information

THERMAL METRIC (1)	THERMAL METRIC (1)	PACKAGE	VALUE	UNIT
R θJA	Junction-to-ambient thermal resistance	nFBGA-100 (ZAW)	53.4	°C/W
R θJC(top)	Junction-to-case (top) thermal resistance	nFBGA-100 (ZAW)	21	°C/W
R θJB	Junction-to-board thermal resistance	nFBGA-100 (ZAW)	32.2	°C/W
Ψ JT	Junction-to-top characterization parameter	nFBGA-100 (ZAW)	0.7	°C/W
Ψ JB	Junction-to-board characterization parameter	nFBGA-100 (ZAW)	32	°C/W
R θJC(bot)	Junction-to-case (bottom) thermal resistance	nFBGA-100 (ZAW)	N/A	°C/W
R θJA	Junction-to-ambient thermal resistance	LQFP-100 (PZ)	72.1	°C/W
R θJC(top)	Junction-to-case (top) thermal resistance	LQFP-100 (PZ)	21.4	°C/W
R θJB	Junction-to-board thermal resistance	LQFP-100 (PZ)	54.8	°C/W
Ψ JT	Junction-to-top characterization parameter	LQFP-100 (PZ)	1	°C/W
Ψ JB	Junction-to-board characterization parameter	LQFP-100 (PZ)	53.7	°C/W
R θJC(bot)	Junction-to-case (bottom) thermal resistance	LQFP-100 (PZ)	N/A	°C/W
R θJA	Junction-to-ambient thermal resistance	LQFP-80 (PN)	58.9	°C/W
R θJC(top)	Junction-to-case (top) thermal resistance	LQFP-80 (PN)	18.9	°C/W
R θJB	Junction-to-board thermal resistance	LQFP-80 (PN)	38.7	°C/W
Ψ JT	Junction-to-top characterization parameter	LQFP-80 (PN)	0.9	°C/W
Ψ JB	Junction-to-board characterization parameter	LQFP-80 (PN)	38.2	°C/W
R θJC(bot)	Junction-to-case (bottom) thermal resistance	LQFP-80 (PN)	N/A	°C/W
R θJA	Junction-to-ambient thermal resistance	LQFP-64 (PM)	62	°C/W
R θJC(top)	Junction-to-case (top) thermal resistance	LQFP-64 (PM)	21.6	°C/W
R θJB	Junction-to-board thermal resistance	LQFP-64 (PM)	39.1	°C/W
Ψ JT	Junction-to-top characterization parameter	LQFP-64 (PM)	1	°C/W
Ψ JB	Junction-to-board characterization parameter	LQFP-64 (PM)	38.7	°C/W
R θJC(bot)	Junction-to-case (bottom) thermal resistance	LQFP-64 (PM)	N/A	°C/W
R θJA	Junction-to-ambient thermal resistance	LQFP-48 (PT)	70.6	°C/W
R θJC(top)	Junction-to-case (top) thermal resistance	LQFP-48 (PT)	27	°C/W
R θJB	Junction-to-board thermal resistance	LQFP-48 (PT)	42.5	°C/W
Ψ JT	Junction-to-top characterization parameter	LQFP-48 (PT)	1.5	°C/W
Ψ JB	Junction-to-board characterization parameter	LQFP-48 (PT)	42.1	°C/W
R θJC(bot)	Junction-to-case (bottom) thermal resistance	LQFP-48 (PT)	N/A	°C/W
THERMAL METRIC (1)	THERMAL METRIC (1)	PACKAGE	VALUE	UNIT
R θJA	Junction-to-ambient thermal resistance	VQFN-48 (RGZ)	28.3	°C/W
R θJC(top)	Junction-to-case (top) thermal resistance	VQFN-48 (RGZ)	18.5	°C/W
R θJB	Junction-to-board thermal resistance	VQFN-48 (RGZ)	10.7	°C/W
Ψ JT	Junction-to-top characterization parameter	VQFN-48 (RGZ)	0.2	°C/W
Ψ JB	Junction-to-board characterization parameter	VQFN-48 (RGZ)	10.6	°C/W
R θJC(bot)	Junction-to-case (bottom) thermal resistance	VQFN-48 (RGZ)	2.8	°C/W
R θJA	Junction-to-ambient thermal resistance	DSBGA-42 (YCJ)	57	°C/W
R θJC(top)	Junction-to-case (top) thermal resistance	DSBGA-42 (YCJ)	0.2	°C/W
R θJB	Junction-to-board thermal resistance	DSBGA-42 (YCJ)	12.9	°C/W
Ψ JT	Junction-to-top characterization parameter	DSBGA-42 (YCJ)	0.1	°C/W
Ψ JB	Junction-to-board characterization parameter	DSBGA-42 (YCJ)	12.9	°C/W
R θJC(bot)	Junction-to-case (bottom) thermal resistance	DSBGA-42 (YCJ)	N/A	°C/W
R θJA	Junction-to-ambient thermal resistance	VQFN-32 (RHB)	31.3	°C/W
R θJC(top)	Junction-to-case (top) thermal resistance		22.6	°C/W
R θJB	Junction-to-board thermal resistance		12.2	°C/W
Ψ JT	Junction-to-top characterization parameter		0.3	°C/W
Ψ JB	Junction-to-board characterization parameter		12.1	°C/W
R θJC(bot)	Junction-to-case (bottom) thermal resistance		2.8	°C/W

MSPM0G3518 Typical Application

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part Number	Manufacturer	Package
MSPM0G1518	Texas Instruments	—
MSPM0G1519	Texas Instruments	—
MSPM0G1519SPMR	Texas Instruments	64-LQFP
MSPM0G1519SPNR	Texas Instruments	LQFP-80
MSPM0G1519SPTR	Texas Instruments	LQFP-48
MSPM0G1519SPZR	Texas Instruments	LQFP-100
MSPM0G1519SRGZR	Texas Instruments	VQFN-48 7x7mm
MSPM0G1519SRHBR	Texas Instruments	VQFN-32
MSPM0G1519SZAWR	Texas Instruments	nFBGA-100 9x9mm
MSPM0G3519	Texas Instruments	—

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