BC68PAS
NPN Medium Power TransistorThe BC68PAS is a npn medium power transistor from Nexperia. View the full BC68PAS datasheet below including key specifications, absolute maximum ratings.
Official BC68PAS datasheet (PDF) — the source this page was extracted from.
BC68PAS Key Specifications
| Parameter | Value |
|---|---|
| Qualification | AEC-Q101 |
| Base Current (IB) | 0.4 A max |
| Package Dimensions | 2 x 2 x 0.65 mm |
| Storage Temperature | -65 °C to 150 °C |
| DC Current Gain (HFE) | 85 to 375 at VCE = 1 V, IC = 500 mA |
| Collector Current (IC) | 2 A max |
| Junction Temperature (Tj) | 150 °C max |
| Transition Frequency (FT) | 170 MHz typ (40 MHz min) |
| Collector Capacitance (Cc) | 22 pF typ |
| Emitter-Base Voltage (VEBO) | 5 V max |
| Peak Collector Current (ICM) | 3 A max (single pulse, tp ≤ 1 ms) |
| Collector-Base Voltage (VCBO) | 32 V max |
| Operating Ambient Temperature | -55 °C to 150 °C |
| Total Power Dissipation (Ptot) | 420 mW to 1.65 W depending on PCB mounting |
| Collector-Emitter Voltage (VCEO) | 20 V max |
| Collector-Emitter Saturation Voltage (VCEsat) | 0.5 V max at IC = 1 A, IB = 100 mA; 0.6 V max at IC = 2 A, IB = 200 mA |
| Thermal Resistance Junction-Ambient (Rth(J-A)) | 76 to 298 K/W depending on PCB mounting |
BC68PAS Overview
Part: BC68PAS series — Nexperia
Type: NPN medium power transistor
Description: 20 V, 2 A NPN medium power transistor in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.
Operating Conditions:
- Operating temperature: -55 to 150 °C
- Collector current: Up to 2 A
Absolute Maximum Ratings:
- Max collector-base voltage: 32 V
- Max continuous collector current: 2 A
- Max junction temperature: 150 °C
- Max storage temperature: 150 °C
Key Specs:
- Collector-emitter voltage (V CEO): 20 V (open base)
- DC current gain (h FE): 85 to 375 (V CE = 1 V; I C = 500 mA)
- Collector-emitter saturation voltage (V CEsat): Max 0.5 V (I C = 1 A; I B = 100 mA)
- Base-emitter voltage (V BE): Max 0.7 V (I C = 5 mA; V CE = 10 V)
- Transition frequency (f T): Min 40 MHz (V CE = 5 V; I C = 50 mA; f = 100 MHz)
- Collector capacitance (C c): Typ 22 pF (V CB = 10 V; I E = i e = 0 A; f = 1 MHz)
- Total power dissipation (P tot): Max 1.65 W (Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm²)
Features:
- High collector current capability IC and ICM
- Reduced Printed-Circuit Board (PCB) area requirements
- Exposed heat sink for excellent thermal and electrical conductivity
- AEC-Q101 qualified
- Two current gain selections
- Leadless very small SMD plastic package with medium power capability
- Suitable for Automatic Optical Inspection (AOI) of solder joint
Applications:
- Linear voltage regulators
- Battery driven devices
- MOSFET drivers
- Low-side switches
- Power management
- Amplifiers
Package:
- DFN2020D-3 (SOT1061D) - 3 terminals, body 2 x 2 x 0.65 mm
BC68PAS Features
- High collector current capability IC and ICM
- Reduced Printed-Circuit Board (PCB) area requirements
- Exposed heat sink for excellent thermal and electrical conductivity
- AEC-Q101 qualified
BC68PAS Applications
- Linear voltage regulators
- Battery driven devices
- MOSFET drivers
BC68PAS Absolute Maximum Ratings
| Symbol | Parameter | Conditions | Min | Max | Unit |
|---|---|---|---|---|---|
| P tot | total power dissipation | T amb 25 C | - | 420 | mW |
| - | 830 | mW | |||
| - | 1.1 | W | |||
| - | 810 | mW | |||
| - | 1.65 | W | |||
| T j | junction temperature | - | 150 | C | |
| T amb | ambient temperature | 55 | 150 | C | |
| T stg | storage temperature | 65 | 150 | C |
- [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
- [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm 2 .
- [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm 2 .
- [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
- [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm 2 .
BC68PAS Thermal Information
| Symbol | Parameter | Conditions | Max | Unit | |
|---|---|---|---|---|---|
| R th(j-a) | thermal resistance from junction to ambient | in free air | [1] | 298 | K/W |
| [2] | 151 | K/W | |||
| [3] | 114 | K/W | |||
| [4] | 154 | K/W | |||
| [5] | 76 | K/W | |||
| R th(j-sp) | thermal resistance from junction to solder point | in free air | 20 | K/W |
- [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
- [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm 2 .
- [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm 2 .
- [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
- [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm 2
FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm 2
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for; typical values
FR4 PCB, 4-layer copper, tin-plated and standard footprint
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for; typical values
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for; typical values
BC68PAS Package Information
Variants on the same datasheet
These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.
| Part Number | Manufacturer | Package |
|---|---|---|
| BC68-25PAS | Nexperia | DFN2020D-3 |
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