STM32L051T6

Part: STM32L051K8T6 — STMicroelectronics (STM32L051x6/x8 family)

Type: Ultra-low-power 32-bit Arm Cortex-M0+ MCU

Description: Ultra-low-power Arm Cortex-M0+ MCU running at up to 32 MHz from a 1.65–3.6 V supply, with up to 64 KB Flash, 8 KB SRAM, 2 KB data EEPROM and a 12-bit 1.14 Msps ADC.

Operating Conditions:

• Supply voltage (VDD): 1.65–3.6 V with BOR disabled; 1.8–3.6 V at power-on with BOR enabled
• Operating temperature: -40 to 85 °C (range 6; range 7 is -40 to 105 °C and range 3 is -40 to 125 °C, depending on ordering suffix)
• Max AHB/APB clock: 32 MHz
• FT/FTf/RST pin input voltage: up to 5.5 V (VDD ≥ 2.0 V)

Absolute Maximum Ratings:

• Max supply voltage (VDD-VSS): 4.0 V (min -0.3 V)
• Input voltage on FT/FTf pins: VDD + 4.0 V max
• Total current into all VDD lines: 105 mA
• Current per I/O pin: 16 mA sunk / -16 mA sourced (22 mA sunk on FTf pins)
• Max junction temperature: 150 °C
• Storage temperature: -65 to +150 °C

Key Specs:

• VDD range: 1.65–3.6 V (BOR disabled)
• Max core/bus frequency: 32 MHz
• Power dissipation at TA = 85 °C: 363 mW for LQFP48, 351 mW for LQFP32, 526 mW for UFQFPN32
• Junction temperature range: -40 to 105 °C (range 6, TA ≤ 85 °C)
• Standby current: 0.27 μA typical (2 wakeup pins)
• Stop mode current: 0.4 μA typical
• Run mode current: 88 μA/MHz
• Wakeup time: 3.5 μs from RAM, 5 μs from Flash

Features:

• Arm Cortex-M0+ core with MPU, 0.95 DMIPS/MHz
• Up to 64 KB Flash with ECC, 8 KB RAM, 2 KB data EEPROM with ECC, 20-byte backup registers
• 12-bit ADC, 1.14 Msps, up to 16 channels, operating down to 1.65 V
• 2x ultra-low-power comparators with window mode and wakeup
• 7-channel DMA controller
• 2x USART, 1x low-power UART, up to 4x SPI at 16 Mbit/s, 2x I2C (SMBus/PMBus)
• 9 timers, including a 16-bit ultra-low-power timer and 2 watchdogs
• CRC unit and 96-bit unique ID
• Up to 51 fast I/Os, 45 of them 5 V tolerant
• BOR with 5 selectable thresholds, POR/PDR, PVD
• Clock sources: 1–25 MHz crystal, 32 kHz RTC oscillator, 16 MHz HSI (±1%), 37 kHz LSI, multispeed RC from 65 kHz to 4.2 MHz, PLL
• Bootloader (USART, SPI) and serial wire debug
• ECOPACK2 packages

Applications:

• Ultra-low-power battery-powered embedded systems

Package:

• LQFP32 (7x7 mm), LQFP48 (7x7 mm), LQFP64 (10x10 mm)
• UFQFPN32 (5x5 mm), UFQFPN48 (7x7 mm)
• WLCSP36 standard and thin (2.61x2.88 mm)
• TFBGA64 (5x5 mm)

• Ultra-low-power platform
• -1.65 V to 3.6 V power supply
• --40 to 125 °C temperature range
• -0.27 μA Standby mode (2 wakeup pins)
• -0.4 μA Stop mode (16 wakeup lines)
• -0.8 μA Stop mode + RTC + 8-Kbyte RAM retention
• -88 μA/MHz in Run mode
• -3.5 μs wakeup time (from RAM)
• -5 μs wakeup time (from Flash memory)
• Core: Arm ® 32-bit Cortex ® -M0+ with MPU
• -From 32 kHz up to 32 MHz max.
• -0.95 DMIPS/MHz
• Memories
• -Up to 64-Kbyte Flash memory with ECC
• -8-Kbyte RAM
• -2 Kbytes of data EEPROM with ECC
• -20-byte backup register
• -Sector protection against R/W operation
• Up to 51 fast I/Os (45 I/Os 5V tolerant)
• Reset and supply management
• -Ultra-safe, low-power BOR (brownout reset) with 5 selectable thresholds
• -Ultra-low-power POR/PDR
• -Programmable voltage detector (PVD)
• Clock sources
• -1 to 25 MHz crystal oscillator
• -32 kHz oscillator for RTC with calibration
• -High speed internal 16 MHz factory-trimmed RC (+/- 1%)
• -Internal low-power 37 kHz RC
• -Internal multispeed low-power 65 kHz to 4.2 MHz RC
• -PLL for CPU clock
• Pre-programmed bootloader
• -USART, SPI supported
• Development support
• -Serial wire debug supported

TFBGA64 (5x5 mm)

Figure 3. STM32L051x6/8 LQFP64 pinout

1. The above figure shows the package top view.
2. PA11 and PA12 input/outputs (greyed out pins) are supplied by VDDIO2.

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Figure 4. STM32L051x6/8 TFBGA64 ballout

1. The above figure shows the package top view.
2. PA11 and PA12 input/outputs (greyed out pins) are supplied by VDDIO2.

Figure 5. STM32L051x6/8 LQFP48 pinout

1. The above figure shows the package top view.
2. PA11 and PA12 input/outputs (greyed out pins) are supplied by VDDIO2.
3. The above figure shows the package top view.
4. PA11 and PA12 input/outputs (greyed out pins) are supplied by VDDIO2.

Figure 6. STM32L051x6/8 UFQFPN48

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Figure 7. STM32L051x6/8 WLCSP36 ballout

1. The above figure shows the package top view.
2. The above figure shows the package top view.

Figure 8. STM32L051x6/8 LQFP32 pinout

Figure 9. STM32L051x6/8 UFQFPN32 pinout

1. The above figure shows the package top view.

Table 14. Legend/abbreviations used in the pinout table

Table 14. Legend/abbreviations used in the pinout table

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Table 15. STM32L051x6/8 pin definitions

Table 15. STM32L051x6/8 pin definitions

Table 15. STM32L051x6/8 pin definitions (continued)

Table 15. STM32L051x6/8 pin definitions (continued)

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Table 15. STM32L051x6/8 pin definitions (continued)

Table 15. STM32L051x6/8 pin definitions (continued)

Table 15. STM32L051x6/8 pin definitions (continued)

Table 15. STM32L051x6/8 pin definitions (continued)

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Table 15. STM32L051x6/8 pin definitions (continued)

Table 15. STM32L051x6/8 pin definitions (continued)

Table 16. Alternate function port A

Table 16. Alternate function port A

Table 17. Alternate function port B

The definition and values of input/output AC characteristics are given in Figure 26 and Table 56 , respectively.

Unless otherwise specified, the parameters given in Table 56 are derived from tests performed under ambient temperature and V DD supply voltage conditions summarized in Table 21 .

Table 56. I/O AC characteristics (1)

1. The maximum frequency is defined in Figure 26 .
2. When Fm+ configuration is set, the I/O speed control is bypassed. Refer to the line reference manual for a detailed description of Fm+ I/O configuration.

Figure 26. I/O AC characteristics definition

Stresses above the absolute maximum ratings listed in Table 18: Voltage characteristics , Table 19: Current characteristics , and Table 20: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 Qualification Standard. Extended mission profiles are available on demand.

Table 18. Voltage characteristics

Table 19. Current characteristics

1. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins referring to high pin count LQFP packages.
2. Positive current injection is not possible on these I/Os. A negative injection is induced by V IN <V SS . I INJ(PIN) must never be exceeded. Refer to Table 18 for maximum allowed input voltage values.
3. A positive injection is induced by V IN > V DD while a negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer to Table 18: Voltage characteristics for the maximum allowed input voltage values.
4. When several inputs are submitted to a current injection, the maximum Σ I INJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values).

Table 20. Thermal characteristics

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The maximum chip-junction temperature, T J max, in degrees Celsius, may be calculated using the following equation:

T J max = T A max + (P D max × Θ JA )

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at www.st.com. ECOPACK is an ST trademark.