SMF250A

Part: SMF20A Type: TVS Diode

Description: The SMF series is designed to protect sensitive electronic equipment from voltage transients, offering 200W peak pulse power capability at 10/1000μs waveform in a low-profile SOD-123FL package.

Operating Conditions:

• Operating temperature: -65 to 150 °C

Absolute Maximum Ratings:

• Peak Pulse Power Dissipation (8/20μs): 1000 W
• Peak Pulse Power Dissipation (10/1000μs): 200 W
• Power Dissipation On Infinite Heat Sink: 1 W
• Max storage temperature: -65 to 175 °C

Key Specs:

• Breakdown Voltage VBR (min): 22.20 V (at IT=1 mA)
• Breakdown Voltage VBR (max): 24.50 V (at IT=1 mA)
• Reverse Standoff Voltage VR: 20 V
• Reverse Leakage Current IR: 1.0 μA (at VR=20V)
• Peak Pulse Current Ipp: 6.2 A (10/1000μs)
• Clamping Voltage VC: 32.4 V (at Ipp=6.2A, 10/1000μs)
• Fast response time: typically less than 1.0ns from 0 Volts to VBR min

Features:

• 200W peak pulse power capability at 10/1000μs waveform
• Compatible with industrial standard package SOD-123FL
• Low profile: maximum height of 1.1mm
• Low inductance, excellent clamping capability
• For surface mounted applications to optimize board space
• High temperature to reflow soldering guaranteed: 260°C/430sec
• IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
• ESD protection of data lines in accordance with IEC 61000-4-2
• EFT protection of data lines in accordance with IEC 61000-4-4
• Glass passivated junction
• Built-in strain relief
• Plastic package is flammability rated V-0 per UL 94
• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
• Matte tin lead-free plated
• Halogen-free and RoHS compliant
• UL Recognized to UL 497B as an Isolated Loop Circuit Protector

Applications:

• I/O interfaces
• VCC bus
• Cellular phones
• Portable devices
• Business machines
• Power supplies
• Other consumer applications

Package:

• SOD-123FL (2.90-3.10 mm length, 3.40-3.90 mm width, 0.90-1.08 mm height for SMF110ASMF250A / SMF5.0CASMF85CA)

• 200W peak pulsepower capability at 10/1000μs waveform, repetition rate (duty cycle): 0.01%
• ·Compatible with industrial standard package SOD-123FL
• Low profile: maximum height of 1.1mm.
• Low inductance, excellent clamping capability
• For surface mounted applications to optimize board space
• High temperature to reflow soldering guaranteed: 260°C/430sec
• T ypical failure mode is short from over-specified voltage or current
• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
• IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
• ESD protection of data lines in accordance with IEC 61000-4-2

SMF devices are ideal for the protection of I/O interfaces, V CC bus and other vulnerable circuit used in cellular phones, portable devices, business machines, power supplies and other consumer applications.

• EFT protection of data lines in accordance with IEC 61000-4-4
• Fast response time: typically less than 1 .0ns from 0 Volts to V BR min
• Glass passivated junction
• Built-in strain relief
• Plastic package is flammability rated V-0 per UL 94
• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
• Matte tin lead-free plated
• Halogen-free and RoHS compliant
• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD609A.01)
• UL Recognized to UL 497B as an Isolated Loop Circuit Protector.