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PIC32MX250F128

32-bit Microcontroller

The PIC32MX250F128 is a 32-bit microcontroller from Microchip Technology. View the full PIC32MX250F128 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Official PIC32MX250F128 datasheet (PDF) — the source this page was extracted from.

PIC32MX250F128 Key Specifications

ParameterValue
ADC10-bit, 1.1 Msps, up to 13 channels (9 on 28-pin)
I2C2 modules (up to 1 Mbaud, SMBus)
USBUSB 2.0 Full-speed OTG
CoreMIPS32 M4K, up to 50 MHz / 83 DMIPS
UART2 modules (12.5 Mbps)
SPI/I2S2 modules (25 Mbps)
I/O Pinsup to 34
Pin Count28, 36, or 44 (variant dependent)
DMA Channels4 programmable + 2 dedicated USB
Supply Voltage2.3V to 3.6V
Dynamic Current0.5 mA/MHz (typical)
Analog Comparators3
Data Memory (SRAM)32 KB
Program Flash Memory128 KB + 3 KB boot Flash
Operating Temperature-40°C to +85°C (DC to 50 MHz); -40°C to +105°C (DC to 40 MHz)
Timers/Capture/Compare5 / 5 / 5
Power-Down Current (IPD)20 µA (typical)
Internal Oscillator Accuracy0.9%

PIC32MX250F128 Overview

Part: PIC32MX250F128B-I/SP — Microchip Technology

Type: 32-bit MIPS32 M4K Microcontroller with USB OTG

Description: 32-bit MIPS32 M4K MCU at up to 50 MHz (83 DMIPS) with 128 KB (+3 KB boot) Flash, 32 KB SRAM, USB 2.0 Full-speed OTG, 10-bit 1.1 Msps ADC, in a 28-pin SPDIP.

Operating Conditions:

  • Supply voltage: 2.3–3.6 V
  • Operating temperature: -40 to +85 °C for DC to 50 MHz (-40 to +105 °C limited to DC to 40 MHz)
  • Max clock: 50 MHz at -40 to +85 °C; 40 MHz at -40 to +105 °C

Absolute Maximum Ratings:

  • Max supply voltage (VDD with respect to VSS): -0.3 to +4.0 V
  • Max current into VDD pins: 300 mA
  • Max current out of VSS pins: 300 mA
  • Max current per I/O pin: 15 mA sunk or sourced
  • Max current all ports: 200 mA sunk or sourced
  • Voltage on 5V-tolerant pins: -0.3 to +5.5 V (VDD ≥ 2.3 V)
  • Storage temperature: -65 to +150 °C
  • Ambient temperature under bias: -40 to +105 °C

Key Specs:

  • Core: MIPS32 M4K, 50 MHz / 83 DMIPS
  • Flash: 128 KB program + 3 KB boot; SRAM: 32 KB
  • Dynamic current: 0.5 mA/MHz (typical)
  • IPD current: 44 μA (typical)
  • ADC: 10-bit, 1.1 Msps, 9 channels on this device
  • I/O: 19 pins; 10 mA source/sink on all I/O pins
  • Comparators: 3; DMA: 4 programmable + 2 USB-dedicated channels
  • Communication: 2 UART (12.5 Mbps), 2 SPI (25 Mbps), 2 I2C (up to 1 Mbaud), PMP, USB OTG

Features:

  • MIPS16e mode for up to 40% smaller code size
  • 0.9% internal oscillator, programmable PLLs, Fail-Safe Clock Monitor, independent Watchdog Timer
  • Integrated Power-on Reset and Brown-out Reset
  • Sleep and Idle low-power modes
  • Audio interface (I2S, LJ, RJ, DSP modes)
  • Charge Time Measurement Unit (CTMU) with mTouch capacitive sensing support
  • Five 16-bit timers (up to two 32-bit), 5 Output Compare, 5 Input Capture
  • Peripheral Pin Select, RTCC
  • Programmable CRC
  • 5V-tolerant pins
  • 4-wire MIPS Enhanced JTAG, in-circuit programming, IEEE 1149.2 boundary scan
  • Class B Safety Library (IEC 60730)

Applications:

  • USB-connected embedded devices
  • Audio and graphics interface products
  • Capacitive touch sensing designs

Package:

  • SPDIP 28-pin (0.100" pitch, 1.365" x 0.285" x 0.135")
  • Family also offered in SOIC, SSOP, QFN, VTLA and TQFP

PIC32MX250F128 Features

  • Data communication: I 2 S, LJ, RJ, and DSP modes
  • Control interface: SPI and I 2 C
  • Master clock:
  • -Generation of fractional clock frequencies
  • -Can be synchronized with USB clock
  • -Can be tuned in run-time

PIC32MX250F128 Electrical Characteristics

This section provides an overview of the PIC32MX1XX/2XX 28/36/44-pin Family electrical characteristics for devices that operate at 40 MHz. Refer to Section 31.0 '50 MHz Electrical Characteristics' for additional specifications for operations at higher frequency. Additional information will be provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the PIC32MX1XX/2XX 28/36/44-pin Family devices are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied.

PIC32MX250F128 Absolute Maximum Ratings

(See Note 1)

Ambient temperature under bias.............................................................................................................-40°C to+105°C
Storage temperature ..............................................................................................................................-65°C to +150°C
Voltage on VDD with respect to VSS .........................................................................................................-0.3V to +4.0V
Voltage on any pin that is not 5V tolerant, with respect to VSS (Note 3) ......................................... -0.3Vto (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD 2.3V (Note 3) ........................................-0.3V to +5.5V
Voltage on any 5V tolerant pin with respect to VSS when VDD < 2.3V (Note 3) ........................................-0.3V to +3.6V
Voltage on D+ or D- pin with respect to VUSB3V3 .................................................................... -0.3V to (VUSB3V3 + 0.3V)
Voltage on VBUS with respect to VSS .......................................................................................................-0.3V to +5.5V
Maximum current out of VSS pin(s) .......................................................................................................................300mA
Maximum current into VDD pin(s) (Note 2) ............................................................................................................300mA
Maximum output current sunk by any I/O pin..........................................................................................................15mA
Maximum output current sourced by any I/O pin ....................................................................................................15mA
Maximum current sunk by all ports .......................................................................................................................200mA
Maximum current sourced by all ports (Note 2) ....................................................................................................200mA

Note 1: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

  • 2: Maximum allowable current is a function of device maximum power dissipation (see Table 30-2).
  • 3: See the 'Pin Diagrams' section for the 5V tolerant pins.

PIC32MX250F128 Thermal Information

RatingSymbolMin.TypicalMax.Unit
Industrial Temperature Devices
Operating Junction Temperature RangeTJ-40-+125°C
Operating Ambient Temperature RangeTA-40-+85°C
V-temp Temperature Devices
Operating Junction Temperature RangeTJ-40-+140°C
Operating Ambient Temperature RangeTA-40-+105°C
Power Dissipation:
Internal Chip Power Dissipation: PINT = VDD x (IDD - S I OH)PDPINT + PI /OPINT + PI /OPINT + PI /OW
I/O Pin Power Dissipation: I/O = S (({VDD - VOH} x I OH) + S (V OL x
Maximum Allowed Power DissipationPDMAX(T J - TA)/ JA(T J - TA)/ JA(T J - TA)/ JAW

PIC32MX250F128 Typical Application

Examples of typical application connections are shown

in Figure 2-5 and Figure 2-6.

FIGURE 2-5: CAPACITIVE TOUCH SENSING WITH GRAPHICS APPLICATION

FIGURE 2-6: AUDIO PLAYBACK APPLICATION

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
PIC32MX110F016Microchip Technology—
PIC32MX110F016BMicrochip Technology—
PIC32MX120F032Microchip Technology—
PIC32MX130F064Microchip Technology—
PIC32MX130F256Microchip Technology—
PIC32MX150F128Microchip Technology—
PIC32MX170F256Microchip Technology—
PIC32MX210F016Microchip Technology—
PIC32MX220F032Microchip Technology—
PIC32MX230F064Microchip Technology—
PIC32MX230F256Microchip Technology—
PIC32MX250F128BMicrochip Technology—
PIC32MX250F128B-I/SPMicrochip Technology28-DIP (0.300", 7.62mm)
PIC32MX250F128CMicrochip Technology—
PIC32MX250F128DMicrochip Technology—
PIC32MX270F256Microchip Technology—

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All Microcontrollers (MCU) datasheetsAll Microchip Technology datasheets (599)

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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