PIC32MX250F128

Part: PIC32MX1XX/2XX — Microchip Type: 32-bit Microcontroller Description: 32-bit microcontroller with a 50 MHz/83 DMIPS MIPS32 M4K core, up to 256 KB Flash and 64 KB SRAM, featuring audio and graphics interfaces, USB, and advanced analog capabilities.

Operating Conditions:

• Supply voltage: 2.3V to 3.6V
• Operating temperature: -40°C to +105°C
• Max clock frequency: 50 MHz

Key Specs:

• Core: MIPS32 M4K, 50 MHz, 83 DMIPS
• Program Memory: Up to 256 KB Flash (plus 3 KB boot Flash)
• Data Memory: Up to 64 KB SRAM
• ADC: 10-bit, 1.1 Msps rate with one S&H, up to 13 analog inputs
• Dynamic current: 0.5 mA/MHz (typical)
• IPD current: 20 μA (typical)
• I/O source/sink current: 10 mA (all I/O pins), up to 14 mA (non-standard VOH)
• Internal oscillator accuracy: 0.9%

Features:

• MIPS16e mode for up to 40% smaller code size
• Programmable PLLs and oscillator clock sources
• Low-power management modes (Sleep and Idle)
• Charge Time Measurement Unit (CTMU) for mTouch capacitive touch sensing and on-chip temperature measurement
• USB 2.0-compliant Full-speed OTG controller
• Peripheral Pin Select (PPS) to allow function remap
• Real-Time Clock and Calendar (RTCC) module
• Four channels of hardware DMA with automatic data size detection, plus two dedicated for USB
• 5V-tolerant pins

Package:

• SOIC (28-pin)
• SSOP (28-pin)
• SPDIP (28-pin)
• QFN (28-pin, 44-pin)
• VTLA (36-pin, 44-pin)
• TQFP (44-pin)

• Data communication: I 2 S, LJ, RJ, and DSP modes
• Control interface: SPI and I 2 C™
• Master clock:
• -Generation of fractional clock frequencies
• -Can be synchronized with USB clock
• -Can be tuned in run-time

This section provides an overview of the PIC32MX1XX/2XX electrical characteristics for devices that operate at 40 MHz. Refer to Section 30.0 '50 MHz Electrical Characteristics' for additional specifications for operations at higher frequency. Additional information will be provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the PIC32MX1XX/2XX devices are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied.

Examples of typical application connections are shown

in Figure 2-5 and Figure 2-6.

FIGURE 2-5: CAPACITIVE TOUCH SENSING WITH GRAPHICS APPLICATION

FIGURE 2-6: AUDIO PLAYBACK APPLICATION