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PIC32MX250F128B-I/SP

Microcontroller

The PIC32MX250F128B-I/SP is a microcontroller from Microchip Technology. View the full PIC32MX250F128B-I/SP datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.

Manufacturer

Microchip Technology

Category

Microcontroller

Package

SOIC-28, SSOP-28, SPDIP-28

Lifecycle

Active

Key Specifications

ParameterValue
ConnectivityI2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Core ProcessorMIPS32® M4K™
Core Size32-Bit
Data ConvertersA/D 9x10b
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
Mounting TypeThrough Hole
Number of I/O19
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeInternal
Oscillator TypeInternal
Oscillator TypeInternal
Oscillator TypeInternal
Package / Case28-DIP (0.300", 7.62mm)
PackagingTube
PackagingTube
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Flash Memory Size128KB (128K x 8)
Program Memory TypeFLASH
RAM Size32K x 8 B
Clock Speed40MHz
Standard Pack Qty15
Standard Pack Qty15
Supplier Device Package28-SPDIP
Supplier Device Package28-SPDIP
Supplier Device Package28-SPDIP
Supplier Device Package28-SPDIP
Supply Voltage2.3V ~ 3.6V

Overview

Part: PIC32MX1XX/2XX — null

Type: 32-bit Microcontrollers

Description: 32-bit MIPS32 M4K microcontrollers operating up to 50 MHz/83 DMIPS, with up to 256 KB Flash and 64 KB SRAM, featuring audio and graphics interfaces, USB, and advanced analog capabilities.

Operating Conditions:

  • Supply voltage: 2.3V to 3.6V
  • Operating temperature: -40 to +85 °C
  • Max clock frequency: 50 MHz

Features:

  • MIPS16e mode for up to 40% smaller code size
  • 0.9% internal oscillator, programmable PLLs, Fail-Safe Clock Monitor
  • Low-power management modes (Sleep and Idle)
  • Integrated Power-on Reset and Brown-out Reset
  • Audio Interface: I2S, LJ, RJ, DSP modes, SPI and I2C control, fractional clock generation
  • ADC Module: 10-bit, 1.1 Msps rate with one S&H, up to 13 analog inputs
  • Charge Time Measurement Unit (CTMU) for mTouch capacitive touch sensing, 1 ns resolution, on-chip temperature measurement
  • Up to three Analog Comparator modules with programmable references
  • Five General Purpose Timers (16-bit and 32-bit), five Output Compare, five Input Capture modules
  • Real-Time Clock and Calendar (RTCC) module
  • USB 2.0-compliant Full-speed OTG controller
  • Two UART modules (12.5 Mbps) with LIN 2.0 and IrDA support
  • Two 4-wire SPI modules (25 Mbps)
  • Two I2C modules (up to 1 Mbaud) with SMBus support
  • Parallel Master Port (PMP)
  • Four channels of hardware DMA with automatic data size detection, two additional channels for USB
  • Programmable Cyclic Redundancy Check (CRC)
  • 10 mA source/sink on all I/O pins, 5V-tolerant pins
  • Selectable open drain, pull-ups, and pull-downs
  • External interrupts on all I/O pins
  • In-circuit and in-application programming, 4-wire MIPS Enhanced JTAG interface

Package:

  • SOIC (28-pin)
  • SSOP (28-pin)
  • SPDIP (28-pin)
  • QFN (28-pin, 44-pin)
  • VTLA (36-pin, 44-pin)
  • TQFP (44-pin)

Features

  • Data communication: I 2 S, LJ, RJ, and DSP modes
  • Control interface: SPI and I 2 C
  • Master clock:
  • -Generation of fractional clock frequencies
  • -Can be synchronized with USB clock
  • -Can be tuned in run-time

Pin Configuration

PIC32MX250F128B-I/SP – SOIC-28 Pinout

Pin #Pin NameTypeDescription/Alternate Functions
1MCLRIMaster Clear (Reset)
2RA0I/OVREF+/CVREF+/AN0/C3INC/RPA0/CTED1
3RA1I/OVREF−/CVREF−/AN1/RPA1/CTED2
4RB0I/OPGED1/AN2/C1IND/C2INB/C3IND/RPB0
5RB1I/OPGEC1/AN3/C1INC/C2INA/RPB1/CTED12
6RB2I/OAN4/C1INB/C2IND/RPB2/SDA2/CTED13
7RB3I/OAN5/C1INA/C2INC/RTCC/RPB3/SCL2
8VSSPGround
9RA2I/OOSC1/CLKI/RPA2
10RA3I/OOSC2/CLKO/RPA3/PMA0
11RB4I/OSOSCI/RPB4
12RA4I/OSOSCO/RPA4/T1CK/CTED9/PMA1
13VDDPPower Supply
14RB5I/OPGED3/RPB5/PMD7
15RB6I/OPGEC3/RPB6/PMD6
16RB7I/OTDI/RPB7/CTED3/PMD5/INT0
17RB8I/OTCK/RPB8/SCL1/CTED10/PMD4
18RB9I/OTDO/RPB9/SDA1/CTED4/PMD3
19VSSPGround
20VCAPPDecoupling Capacitor Pin
21RB10I/OPGED2/RPB10/CTED11/PMD2
22RB11I/OPGEC2/TMS/RPB11/PMD1
23RB12I/OAN12/PMD0
24RB13I/OAN11/RPB13/CTPLS/PMRD
25RB14I/OCVREFOUT/AN10/C3INB/RPB14/SCK1/CTED5/PMWR
26RB15I/OAN9/C3INA/RPB15/SCK2/CTED6/PMCS1
27AVSSPAnalog Ground
28AVDDPAnalog Power Supply

Notes

  • All I/O port pins (RAx, RBx) can be configured as change notification pins (CNAx, CNBx).
  • Shaded pins in the original datasheet (pins 2–7, 16, 18, 25, 26) are 5V tolerant.
  • RPn pins support remappable peripheral functions; see Section 11.3 "Peripheral Pin Select" for available mappings.
  • VCAP (pin 20) requires a 10 µF decoupling capacitor to ground.

Electrical Characteristics

This section provides an overview of the PIC32MX1XX/2XX 28/36/44-pin Family electrical characteristics for devices that operate at 40 MHz. Refer to Section 31.0 '50 MHz Electrical Characteristics' for additional specifications for operations at higher frequency. Additional information will be provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the PIC32MX1XX/2XX 28/36/44-pin Family devices are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied.

Absolute Maximum Ratings

(See Note 1)

Ambient temperature under bias.............................................................................................................-40°C to+105°C
Storage temperature ..............................................................................................................................-65°C to +150°C
Voltage on VDD with respect to VSS .........................................................................................................-0.3V to +4.0V
Voltage on any pin that is not 5V tolerant, with respect to VSS (Note 3) ......................................... -0.3Vto (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD 2.3V (Note 3) ........................................-0.3V to +5.5V
Voltage on any 5V tolerant pin with respect to VSS when VDD < 2.3V (Note 3) ........................................-0.3V to +3.6V
Voltage on D+ or D- pin with respect to VUSB3V3 .................................................................... -0.3V to (VUSB3V3 + 0.3V)
Voltage on VBUS with respect to VSS .......................................................................................................-0.3V to +5.5V
Maximum current out of VSS pin(s) .......................................................................................................................300mA
Maximum current into VDD pin(s) (Note 2) ............................................................................................................300mA
Maximum output current sunk by any I/O pin..........................................................................................................15mA
Maximum output current sourced by any I/O pin ....................................................................................................15mA
Maximum current sunk by all ports .......................................................................................................................200mA
Maximum current sourced by all ports (Note 2) ....................................................................................................200mA

Note 1: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

  • 2: Maximum allowable current is a function of device maximum power dissipation (see Table 30-2).
  • 3: See the 'Pin Diagrams' section for the 5V tolerant pins.

Thermal Information

RatingSymbolMin.TypicalMax.Unit
Industrial Temperature Devices
Operating Junction Temperature RangeTJ-40-+125°C
Operating Ambient Temperature RangeTA-40-+85°C
V-temp Temperature Devices
Operating Junction Temperature RangeTJ-40-+140°C
Operating Ambient Temperature RangeTA-40-+105°C
Power Dissipation:
Internal Chip Power Dissipation: PINT = VDD x (IDD - S I OH)PDPINT + PI /OPINT + PI /OPINT + PI /OW
I/O Pin Power Dissipation: I/O = S (({VDD - VOH} x I OH) + S (V OL x
Maximum Allowed Power DissipationPDMAX(T J - TA)/ JA(T J - TA)/ JA(T J - TA)/ JAW

Typical Application

Examples of typical application connections are shown

in Figure 2-5 and Figure 2-6.

FIGURE 2-5: CAPACITIVE TOUCH SENSING WITH GRAPHICS APPLICATION

FIGURE 2-6: AUDIO PLAYBACK APPLICATION

Ordering Information

MPNPackageTemperature RangePacking
PIC32MX250F128B-I/SOSOIC-40°C to +85°Cnull
PIC32MX250F128B-I/SSSSOP-40°C to +85°Cnull
PIC32MX250F128B-I/SPSPDIP-40°C to +85°Cnull
PIC32MX250F128B-I/MLQFN-40°C to +85°Cnull
PIC32MX250F128C-I/TLVTLA-40°C to +85°Cnull
PIC32MX250F128D-I/TLVTLA-40°C to +85°Cnull
PIC32MX250F128D-I/PTTQFP-40°C to +85°Cnull
PIC32MX250F128D-I/MLQFN-40°C to +85°Cnull

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
PIC32MX110F016Microchip Technology
PIC32MX110F016BMicrochip Technology
PIC32MX120F032Microchip Technology
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PIC32MX130F256Microchip Technology
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PIC32MX220F032Microchip Technology
PIC32MX230F064Microchip Technology
PIC32MX230F256Microchip Technology
PIC32MX250F128Microchip Technology
PIC32MX250F128BMicrochip Technology
PIC32MX250F128CMicrochip Technology
PIC32MX250F128DMicrochip Technology
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