PIC32MX250F128B-I/SP
MicrocontrollerThe PIC32MX250F128B-I/SP is a microcontroller from Microchip Technology. View the full PIC32MX250F128B-I/SP datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.
Manufacturer
Microchip Technology
Category
Microcontroller
Package
SOIC-28, SSOP-28, SPDIP-28
Lifecycle
Active
Key Specifications
| Parameter | Value |
|---|---|
| Connectivity | I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG |
| Core Processor | MIPS32® M4K™ |
| Core Size | 32-Bit |
| Data Converters | A/D 9x10b |
| DigiKey Programmable | Not Verified |
| DigiKey Programmable | Not Verified |
| DigiKey Programmable | Not Verified |
| DigiKey Programmable | Not Verified |
| Mounting Type | Through Hole |
| Number of I/O | 19 |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Oscillator Type | Internal |
| Oscillator Type | Internal |
| Oscillator Type | Internal |
| Oscillator Type | Internal |
| Package / Case | 28-DIP (0.300", 7.62mm) |
| Packaging | Tube |
| Packaging | Tube |
| Peripherals | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT |
| Flash Memory Size | 128KB (128K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 32K x 8 B |
| Clock Speed | 40MHz |
| Standard Pack Qty | 15 |
| Standard Pack Qty | 15 |
| Supplier Device Package | 28-SPDIP |
| Supplier Device Package | 28-SPDIP |
| Supplier Device Package | 28-SPDIP |
| Supplier Device Package | 28-SPDIP |
| Supply Voltage | 2.3V ~ 3.6V |
Overview
Part: PIC32MX1XX/2XX — null
Type: 32-bit Microcontrollers
Description: 32-bit MIPS32 M4K microcontrollers operating up to 50 MHz/83 DMIPS, with up to 256 KB Flash and 64 KB SRAM, featuring audio and graphics interfaces, USB, and advanced analog capabilities.
Operating Conditions:
- Supply voltage: 2.3V to 3.6V
- Operating temperature: -40 to +85 °C
- Max clock frequency: 50 MHz
Features:
- MIPS16e mode for up to 40% smaller code size
- 0.9% internal oscillator, programmable PLLs, Fail-Safe Clock Monitor
- Low-power management modes (Sleep and Idle)
- Integrated Power-on Reset and Brown-out Reset
- Audio Interface: I2S, LJ, RJ, DSP modes, SPI and I2C control, fractional clock generation
- ADC Module: 10-bit, 1.1 Msps rate with one S&H, up to 13 analog inputs
- Charge Time Measurement Unit (CTMU) for mTouch capacitive touch sensing, 1 ns resolution, on-chip temperature measurement
- Up to three Analog Comparator modules with programmable references
- Five General Purpose Timers (16-bit and 32-bit), five Output Compare, five Input Capture modules
- Real-Time Clock and Calendar (RTCC) module
- USB 2.0-compliant Full-speed OTG controller
- Two UART modules (12.5 Mbps) with LIN 2.0 and IrDA support
- Two 4-wire SPI modules (25 Mbps)
- Two I2C modules (up to 1 Mbaud) with SMBus support
- Parallel Master Port (PMP)
- Four channels of hardware DMA with automatic data size detection, two additional channels for USB
- Programmable Cyclic Redundancy Check (CRC)
- 10 mA source/sink on all I/O pins, 5V-tolerant pins
- Selectable open drain, pull-ups, and pull-downs
- External interrupts on all I/O pins
- In-circuit and in-application programming, 4-wire MIPS Enhanced JTAG interface
Package:
- SOIC (28-pin)
- SSOP (28-pin)
- SPDIP (28-pin)
- QFN (28-pin, 44-pin)
- VTLA (36-pin, 44-pin)
- TQFP (44-pin)
Features
- Data communication: I 2 S, LJ, RJ, and DSP modes
- Control interface: SPI and I 2 C
- Master clock:
- -Generation of fractional clock frequencies
- -Can be synchronized with USB clock
- -Can be tuned in run-time
Pin Configuration
PIC32MX250F128B-I/SP – SOIC-28 Pinout
| Pin # | Pin Name | Type | Description/Alternate Functions |
|---|---|---|---|
| 1 | MCLR | I | Master Clear (Reset) |
| 2 | RA0 | I/O | VREF+/CVREF+/AN0/C3INC/RPA0/CTED1 |
| 3 | RA1 | I/O | VREF−/CVREF−/AN1/RPA1/CTED2 |
| 4 | RB0 | I/O | PGED1/AN2/C1IND/C2INB/C3IND/RPB0 |
| 5 | RB1 | I/O | PGEC1/AN3/C1INC/C2INA/RPB1/CTED12 |
| 6 | RB2 | I/O | AN4/C1INB/C2IND/RPB2/SDA2/CTED13 |
| 7 | RB3 | I/O | AN5/C1INA/C2INC/RTCC/RPB3/SCL2 |
| 8 | VSS | P | Ground |
| 9 | RA2 | I/O | OSC1/CLKI/RPA2 |
| 10 | RA3 | I/O | OSC2/CLKO/RPA3/PMA0 |
| 11 | RB4 | I/O | SOSCI/RPB4 |
| 12 | RA4 | I/O | SOSCO/RPA4/T1CK/CTED9/PMA1 |
| 13 | VDD | P | Power Supply |
| 14 | RB5 | I/O | PGED3/RPB5/PMD7 |
| 15 | RB6 | I/O | PGEC3/RPB6/PMD6 |
| 16 | RB7 | I/O | TDI/RPB7/CTED3/PMD5/INT0 |
| 17 | RB8 | I/O | TCK/RPB8/SCL1/CTED10/PMD4 |
| 18 | RB9 | I/O | TDO/RPB9/SDA1/CTED4/PMD3 |
| 19 | VSS | P | Ground |
| 20 | VCAP | P | Decoupling Capacitor Pin |
| 21 | RB10 | I/O | PGED2/RPB10/CTED11/PMD2 |
| 22 | RB11 | I/O | PGEC2/TMS/RPB11/PMD1 |
| 23 | RB12 | I/O | AN12/PMD0 |
| 24 | RB13 | I/O | AN11/RPB13/CTPLS/PMRD |
| 25 | RB14 | I/O | CVREFOUT/AN10/C3INB/RPB14/SCK1/CTED5/PMWR |
| 26 | RB15 | I/O | AN9/C3INA/RPB15/SCK2/CTED6/PMCS1 |
| 27 | AVSS | P | Analog Ground |
| 28 | AVDD | P | Analog Power Supply |
Notes
- All I/O port pins (RAx, RBx) can be configured as change notification pins (CNAx, CNBx).
- Shaded pins in the original datasheet (pins 2–7, 16, 18, 25, 26) are 5V tolerant.
- RPn pins support remappable peripheral functions; see Section 11.3 "Peripheral Pin Select" for available mappings.
- VCAP (pin 20) requires a 10 µF decoupling capacitor to ground.
Electrical Characteristics
This section provides an overview of the PIC32MX1XX/2XX 28/36/44-pin Family electrical characteristics for devices that operate at 40 MHz. Refer to Section 31.0 '50 MHz Electrical Characteristics' for additional specifications for operations at higher frequency. Additional information will be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the PIC32MX1XX/2XX 28/36/44-pin Family devices are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied.
Absolute Maximum Ratings
(See Note 1)
| Ambient temperature under bias.............................................................................................................-40°C to | +105°C |
|---|---|
| Storage temperature .............................................................................................................................. | -65°C to +150°C |
| Voltage on VDD with respect to VSS ......................................................................................................... | -0.3V to +4.0V |
| Voltage on any pin that is not 5V tolerant, with respect to VSS (Note 3) ......................................... -0.3V | to (VDD + 0.3V) |
| Voltage on any 5V tolerant pin with respect to VSS when VDD 2.3V (Note 3) ........................................ | -0.3V to +5.5V |
| Voltage on any 5V tolerant pin with respect to VSS when VDD < 2.3V (Note 3) ........................................ | -0.3V to +3.6V |
| Voltage on D+ or D- pin with respect to VUSB3V3 .................................................................... -0.3V to (V | USB3V3 + 0.3V) |
| Voltage on VBUS with respect to VSS ....................................................................................................... | -0.3V to +5.5V |
| Maximum current out of VSS pin(s) .......................................................................................................................300 | mA |
| Maximum current into VDD pin(s) (Note 2) ............................................................................................................300 | mA |
| Maximum output current sunk by any I/O pin..........................................................................................................15 | mA |
| Maximum output current sourced by any I/O pin ....................................................................................................15 | mA |
| Maximum current sunk by all ports .......................................................................................................................200 | mA |
| Maximum current sourced by all ports (Note 2) ....................................................................................................200 | mA |
Note 1: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
- 2: Maximum allowable current is a function of device maximum power dissipation (see Table 30-2).
- 3: See the 'Pin Diagrams' section for the 5V tolerant pins.
Thermal Information
| Rating | Symbol | Min. | Typical | Max. | Unit |
|---|---|---|---|---|---|
| Industrial Temperature Devices | |||||
| Operating Junction Temperature Range | TJ | -40 | - | +125 | °C |
| Operating Ambient Temperature Range | TA | -40 | - | +85 | °C |
| V-temp Temperature Devices | |||||
| Operating Junction Temperature Range | TJ | -40 | - | +140 | °C |
| Operating Ambient Temperature Range | TA | -40 | - | +105 | °C |
| Power Dissipation: | |||||
| Internal Chip Power Dissipation: PINT = VDD x (IDD - S I OH) | PD | PINT + PI /O | PINT + PI /O | PINT + PI /O | W |
| I/O Pin Power Dissipation: I/O = S (({VDD - VOH} x I OH) + S (V OL x | |||||
| Maximum Allowed Power Dissipation | PDMAX | (T J - TA)/ JA | (T J - TA)/ JA | (T J - TA)/ JA | W |
Typical Application
Examples of typical application connections are shown
in Figure 2-5 and Figure 2-6.
FIGURE 2-5: CAPACITIVE TOUCH SENSING WITH GRAPHICS APPLICATION
FIGURE 2-6: AUDIO PLAYBACK APPLICATION
Ordering Information
| MPN | Package | Temperature Range | Packing |
|---|---|---|---|
| PIC32MX250F128B-I/SO | SOIC | -40°C to +85°C | null |
| PIC32MX250F128B-I/SS | SSOP | -40°C to +85°C | null |
| PIC32MX250F128B-I/SP | SPDIP | -40°C to +85°C | null |
| PIC32MX250F128B-I/ML | QFN | -40°C to +85°C | null |
| PIC32MX250F128C-I/TL | VTLA | -40°C to +85°C | null |
| PIC32MX250F128D-I/TL | VTLA | -40°C to +85°C | null |
| PIC32MX250F128D-I/PT | TQFP | -40°C to +85°C | null |
| PIC32MX250F128D-I/ML | QFN | -40°C to +85°C | null |
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| PIC32MX110F016 | Microchip Technology | — |
| PIC32MX110F016B | Microchip Technology | — |
| PIC32MX120F032 | Microchip Technology | — |
| PIC32MX130F064 | Microchip Technology | — |
| PIC32MX130F256 | Microchip Technology | — |
| PIC32MX150F128 | Microchip Technology | — |
| PIC32MX170F256 | Microchip Technology | — |
| PIC32MX1XX/2XX | Microchip Technology | — |
| PIC32MX210F016 | Microchip Technology | — |
| PIC32MX220F032 | Microchip Technology | — |
| PIC32MX230F064 | Microchip Technology | — |
| PIC32MX230F256 | Microchip Technology | — |
| PIC32MX250F128 | Microchip Technology | — |
| PIC32MX250F128B | Microchip Technology | — |
| PIC32MX250F128C | Microchip Technology | — |
| PIC32MX250F128D | Microchip Technology | — |
| PIC32MX270F256 | Microchip Technology | — |
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