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CH32H417WEU6

Dual-Core RISC-V Microcontroller

The CH32H417WEU6 is a dual-core risc-v microcontroller from WCH. View the full CH32H417WEU6 datasheet below including key specifications, electrical characteristics.

CH32H417WEU6 shares its datasheet with CH32H417QEU6, whose page lists every part number it covers.

Official CH32H417WEU6 datasheet (PDF) — the source this page was extracted from.

Manufacturer

WCH

Package

QFN-68 8x8mm

CH32H417WEU6 Key Specifications

ParameterValue
ADC2x 12-bit, up to 5Msps, 7+2 channels
CAN3 (2.0B active)
DAC1 unit (DAC2)
I2C4
I3C1
OPA1 (OPA1)
USBUSB 3.0 (5Gbps), USB 2.0 HS (480Mbps), USB PD/Type-C
QSPI1 (QSPI2)
SRAM896KB (incl. 128KB ITCM, 256KB DTCM)
HSADC10-bit, up to 20Msps, 4 channels
USART7
Timers2x 16-bit advanced, 4x 16-bit GP, 4x 32-bit GP, 2x 16-bit basic, 2x LPTIM
SPI/I2S3/2
EthernetMAC + 10/100M PHY
CPU CoresQingke RISC-V5F + RISC-V3F dual-core
GPIO Count50
Clock Sources25MHz external crystal, 32kHz LSE, internal 25MHz RC, ~40kHz RC
Max FrequencyV5F 400MHz, V3F 150MHz
Low-Power ModesSleep, Stop
Flash (CodeFlash)960KB
GPIO Power (VDDIO)3.3V rated, supports 1.8V
Package Dimensions8x8mm, 0.4mm pitch
System Power (VDD33)3.3V
High-Speed GPIO Power (VIO18)1.2/1.8/2.5/3.3V selectable

CH32H417WEU6 Overview

Part: CH32H417QEU6 — WCH (Nanjing Qinheng Microelectronics)

Type: Dual-core RISC-V microcontroller (Qingke RISC-V5F + RISC-V3F)

Description: Dual-core Qingke RISC-V5F (up to 400 MHz) and RISC-V3F (up to 150 MHz) MCU with 960 KB CodeFlash and 896 KB SRAM, integrating USB 3.0, 10/100M Ethernet MAC+PHY, SerDes and USB PD/Type-C, in a QFN128 package.

Operating Conditions:

  • Supply voltage: VDD33 2.4–3.6 V (3.15–3.45 V when USB, ETH or SerDes is used); VDDK core 1.17–1.27 V
  • Operating temperature: -40 to 85 °C (ambient); junction -40 to 105 °C
  • V5F core up to 400 MHz (LDO_VDDK = 011 default); system bus/V3F core up to 150 MHz
  • VDDIO 1.65–3.6 V; VIO18 1.1–3.6 V; VBAT 1.8–3.6 V

Key Specs:

  • V5F core frequency: 400 MHz max (LDO_VDDK = 011); 480 MHz only for commercial-grade use with TA ≤ 70 °C and good heat dissipation (LDO_VDDK = 101)
  • System bus / V3F core frequency: 150 MHz (180 MHz at LDO_VDDK = 101, TA ≤ 70 °C only)
  • VDD33A: 1.8–3.6 V (2.4 V min with ADC or DAC; 3.0 V min with HSADC)
  • VDD12A (USB 3.0): 1.17–1.27 V typ 1.2 V
  • VREFP: 2.4–3.6 V, must not exceed VDD33A
  • Memory: 960 KB CodeFlash, 896 KB SRAM (128 KB ITCM, 256 KB DTCM, 512 KB shared), 56 KB bootloader
  • ADC: 2 × 12-bit up to 5 Msps; HSADC 10-bit up to 20 Msps (7 channels)
  • GPIO: 95 I/O ports

Features:

  • Dual-core Qingke RISC-V5F and RISC-V3F with fast programmable interrupt controller
  • USB 3.0 (5 Gbps), USB 2.0 HS, and USB 2.0 FS/OTG controllers with PHY
  • 10M/100M Ethernet MAC and PHY, RGMII interface
  • SerDes long-distance isolated transceiver
  • USB PD 3.2 / Type-C controller (up to 240 W EPR)
  • SDMMC/SDIO, UHSIF, DVP, FMC (FSMC/SDRAM), LTDC, GPHA, DFSDM, SAI
  • 8 USART, 4 I2C, I3C, 4 SPI, 2 QSPI, 3 CAN, 2 I2S
  • 2 × 12-bit DAC, 3 OPA/PGA, comparator, 16 TouchKey channels
  • AES128/192/256 and SM4 encryption (ECDC), RNG
  • Sleep and Stop low-power modes; 16 DMA channels

Applications:

  • Industrial networking and Ethernet communication
  • USB fast-charging / PD devices
  • Long-distance isolated differential communication

Package:

  • QFN128 (CH32H417QEU6)

CH32H417WEU6 Features

  • Programmable transfer data rate, supporting up to 1.5 Gbps
  • Supports high-voltage signal isolation via network transformers, and also supports low-voltage isolation via capacitors
  • Built-in 8b/10b encoding/decoding and CRC checking, supports sequence number matching
  • Built-in FIFO, supports double-buffered transmit and receive modes
  • Supports DMA functionality, with byte-aligned access addresses
  • Provides multiple transfer interrupt flags and status indications, providing timely feedback to the application layer
  • Differential transmission and reception, can directly drive optical fiber modules

CH32H417WEU6 Pin Configuration

ADC FunctionDefault Pin
ADC_IN0PA0
ADC_IN1PA1
ADC_IN2PA2
ADC_IN3PA3
ADC_IN4PA4
ADC_IN5PA5
ADC_IN6PA6
ADC_IN7PA7
ADC_IN8PB0
ADC_IN9PB1
ADC_IN10PC0
ADC_IN11PC1
ADC_IN12PC2
ADC_IN13PC3
ADC_IN14PC4
ADC_IN15PC5
ADC_IN16Temperature sensor
ADC_IN17Internal reference voltage V REFINT

CH32H417WEU6 Electrical Characteristics

SymbolParameterConditionMinTypMaxUnit
V DD33ASupply voltagef S < 2MHz2.73.6V
V DD33ASupply voltagef S ≥ 2MHz33.6V
V REFP (2)Positive reference voltageV REFP ≤ V DD33A2.43.33.6V
I DD33AADC supply current (excluding buffer)ADC_LP = 01.42mA
I DD33AADC supply current (excluding buffer)ADC_LP = 10.37mA
I BUFADC buffer currentADC_LP = 00.76mA
I BUFADC buffer currentADC_LP = 10.19mA
f ADCADC clock frequency1480MHz
f SSampling rate0.065MHz
f TRIGExternal trigger frequencyf ADC = 14MHz875kHz
f TRIGExternal trigger frequency161/f ADC
f TRIGExternal trigger frequencyf ADC = 80MHz4.4MHz
f TRIGExternal trigger frequency181/f ADC
V AINConversion voltage rangeV REFP ≥ V DDIO0V DDIOV
V AINConversion voltage rangeV REFP < V DDIO0V REFPV
R AINExternal input impedance50kΩ
R ADCSampling switch resistance0.61.5kΩ
C ADCInternal sample-and-hold capacitance4.5pF
t CALCalibration timef ADC = 14MHz2us
t Iatf ADC = 14MHz0.143us
t IatInjected trigger conversion latencyf ADC = 80MHz0.025
2
us
1/f ADC
t Iatrf ADC = 14MHz0.143us
t IatrRegular trigger conversion latencyf ADC = 80MHz0.025us
t Iatr21/f ADC
t sf ADC = 14MHz0.10717.11us
t sSampling time1.5239.51/f ADC
t sf ADC = 80MHz0.0372.49us
t s3.5239.51/f ADC
t STABPower-on time1us
t CONVTotal conversion time (including sampling time)f ADC = 14MHz118us
t CONVTotal conversion time (including sampling time)142521/f ADC
t CONVTotal conversion time (including sampling time)f ADC = 80MHz0.23.15us
t CONVTotal conversion time (including sampling time)162521/f ADC
  1. The external capacitor on VREFP should be placed as close as possible; otherwise, ADC performance will be affected.

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
CH32H417WCH—
CH32H417MEU6WCHQFN-88 10x10mm
CH32H417QEU6WCHQFN-128(12.3x12.3)
CH32H417RMWCH—

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All Microcontrollers (MCU) datasheetsAll WCH datasheets (94)

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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