W25Q32JVXGJM

Part: W25Q32JV-DTR — Winbond

Type: Serial NOR Flash Memory

Description: 3 V, 32M-bit serial NOR Flash memory supporting Standard, Dual, Quad SPI, QPI, and DTR with up to 133 MHz clock frequency.

Operating Conditions:

• Supply voltage: 2.7 V to 3.6 V

Absolute Maximum Ratings:

• Max supply voltage: 4.6 V (-0.6 to 4.6 V)
• Voltage applied to any pin: -0.6 to VCC+0.4 V
• Transient voltage on any pin: -2.0 V to VCC+2.0 V (<20 ns transient relative to ground)
• Max junction/storage temperature: -65 to +150 °C (storage temperature)
• Electrostatic discharge voltage: -2000 to +2000 V (Human Body Model)

Key Specs:

• Memory density: 32M-bit (4M-byte)
• Page size: 256 bytes (16,384 programmable pages)
• Sector erase size: 4 KB (1,024 erasable sectors)
• Block erase sizes: 32 KB and 64 KB (64 erasable 64KB blocks)
• Max clock frequency: up to 133 MHz (equivalent to 266 MHz for Dual I/O, 532 MHz for Quad I/O)
• Power-down current: 1 μA

Features:

• Standard SPI, Dual/Quad SPI, QPI, and DTR (Double Transfer Rate) support
• Continuous Read Mode for Execute-in-Place (XIP) operation
• Uniform 4KB sectors, 32KB / 64KB blocks, and chip erase capabilities
• Write protection features including /WP pin, individual block/sector lock, and volatile/non-volatile status registers
• Dedicated /HOLD or /RESET pin functionality

Applications:

• Code shadowing to RAM
• Execute-in-place (XIP) direct code execution
• Voice, text, and data storage in space-, pin-, and power-constrained systems

Package:

• 8-pin SOIC 150-mil (Package Code SN)
• 8-pin SOIC 208-mil (Package Code SS)
• 8-pad WSON 6x5-mm (Package Code ZP)
• 8-pad XSON 4x4x0.45-mm (Package Code XG)
• 16-pin SOIC 300-mil (Package Code SF)
• 24-ball TFBGA 8x6-mm (Package Code TB, 5x5 ball array)
• 24-ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)

• Software and Hardware Write-Protect
• Power Supply Lock-Down and OTP protection
• Top/Bottom, Complement array protection
• Individual Block/Sector array protection
• 64-Bit Unique ID for each device
• Discoverable Parameters (SFDP) Register
• 3X256-Bytes Security Registers with OTP locks
• Volatile & Non-volatile Status Register Bits

Figure 1a. W25Q32JV Pin Assignments, 8-pin SOIC 150/208-mil (Package Code SN/SS)

1. Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 3.0V.

2. Checker Board Pattern.

1. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device reliability. Exposure beyond absolute maximum ratings may cause permanent damage.
2. Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly and the European directive on restrictions on hazardous substances (RoHS) 2002/95/EU.
3. JEDEC Std JESD22-A114A (C1=100pF, R1=1500 ohms, R2=500 ohms).