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W25Q32JV

The W25Q32JV is an electronic component from Winbond Electronics. View the full W25Q32JV datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Winbond Electronics

Category

Integrated Circuits (ICs)

Overview

The W25Q32JV (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with 1μA for power-down. All devices are offered in space-saving packages.

The W25Q32JV array is organized into 16,384 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32JV has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.)

The W25Q32JV support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI Quad Peripheral Interface (QPI) as well as Double Transfer Rate(DTR) : Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O and QPI instructions. These 3transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation.

A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device ID and SFDP Register, a 64-bit Unique Serial Number and three 256-bytes Security Registers.

Features

  • Software and Hardware Write-Protect
  • Power Supply Lock-Down and OTP protection
  • Top/Bottom, Complement array protection
  • Individual Block/Sector array protection
  • 64-Bit Unique ID for each device
  • Discoverable Parameters (SFDP) Register
  • 3X256-Bytes Security Registers with OTP locks
  • Volatile & Non-volatile Status Register Bits

Pin Configuration

Figure 1a. W25Q32JV Pin Assignments, 8-pin SOIC 150/208-mil (Package Code SN/SS)

Electrical Characteristics

PARAMETERSYMBOLCONDITIONSSPECSPECSPECUNIT
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNIT
Input CapacitanceCIN (1)VIN = 0V (1)6pF
Output CapacitanceCout (1)VOUT = 0V (1)8pF
Input LeakageI LI±2μA
I/O LeakageILO±2μA
Standby CurrentICC1/CS = VCC, VIN = GND or VCC1050μA
Power-down CurrentICC2/CS = VCC, VIN = GND or VCC115μA
Current Read Data / Dual /Quad 50MHz (2)ICC3C = 0.1 VCC / 0.9 VCC DO = Open815mA
Current Read Data / Dual /Quad 80MHz (2)ICC3C = 0.1 VCC / 0.9 VCC DO = Open1018mA
Current Read Data / Dual /Quad 104MHz (2)ICC3C = 0.1 VCC / 0.9 VCC DO = Open1220mA
Current Write Status RegisterICC4/CS = VCC2025mA
Current Page ProgramICC5/CS = VCC2025mA
Current Sector/Block EraseICC6/CS = VCC2025mA
Current Chip EraseICC7/CS = VCC2025mA
Input Low VoltageVIL-0.5VCC x 0.3V
Input High VoltageVIHVCC x 0.7VCC + 0.4V
Output Low VoltageVOLIOL = 100 μA0.2V
Output High VoltageVOHIOH = -100 μAVCC - 0.2V
  1. Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 3.0V.

  2. Checker Board Pattern.

Absolute Maximum Ratings

PARAMETERSSYMBOLCONDITIONSRANGEUNIT
Supply VoltageVCC-0.6 to 4.6V
Voltage Applied to Any PinVIORelative to Ground-0.6 to VCC+0.4V
Transient Voltage on any PinVIOT<20nS Transient Relative to Ground-2.0V to VCC+2.0VV
Storage TemperatureTSTG-65 to +150° C
Lead TemperatureTLEADSee Note (2)° C
Electrostatic Discharge VoltageVESDHuman Body Model (3)-2000 to +2000V
  1. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device reliability. Exposure beyond absolute maximum ratings may cause permanent damage.
  2. Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly and the European directive on restrictions on hazardous substances (RoHS) 2002/95/EU.
  3. JEDEC Std JESD22-A114A (C1=100pF, R1=1500 ohms, R2=500 ohms).

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
W25Q32JV-DTRWinbond Electronics
W25Q32JV-IMWinbond Electronics
W25Q32JVSSIMWinbond Electronics8-SOIC (0.209", 5.30mm Width)
W25Q32JVXGIMWinbond Electronics
W25Q32JVXGJMWinbond Electronics
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