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STM32L471RG

Ultra-Low-Power ARM Cortex-M4 MCU

The STM32L471RG is a ultra-low-power arm cortex-m4 mcu from STMicroelectronics. View the full STM32L471RG datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

STM32L471RG shares its datasheet with STM32L471RCT6, whose page lists every part number it covers.

Official STM32L471RG datasheet (PDF) — the source this page was extracted from.

Manufacturer

STMicroelectronics

Package

LQFP-64

STM32L471RG Key Specifications

ParameterValue
ADC3x 12-bit, 5 Msps, up to 16-bit with oversampling
DAC2x 12-bit
DMA14-channel
SRAM128 KB (32 KB with hardware parity)
Timers16x (2 advanced motor-control, 2x 32-bit, 5x 16-bit GP, 2 basic, 2 low-power)
CPU CoreARM Cortex-M4 with FPU, up to 80 MHz, 100 DMIPS
Comparators2x ultra-low-power
Flash Memory1 MB (2 banks, read-while-write)
Run Mode Current100 µA/MHz
VBAT Mode Current300 nA
Stop 2 Mode Current1.1 µA (1.4 µA with RTC)
Standby Mode Current120 nA (420 nA with RTC)
Supply Voltage Range1.71V to 3.6V
Shutdown Mode Current30 nA
Wakeup Time From Stop4 µs
I/O Count (Family Max)up to 114 fast I/Os
Operational Amplifiers2x with built-in PGA
Communication Interfaces6x USART, 3x I2C FM+ (1 Mbit/s), 3x SPI (4x with Quad SPI), 2x SAI, CAN 2.0B, SDMMC, SWPMI, Quad SPI
Capacitive Sensing Channelsup to 24
Operating Temperature Range-40°C to 85/105/125°C

STM32L471RG Overview

Part: STM32L471RCT6 — STMicroelectronics (STM32L471xx family)

Type: Ultra-low-power ARM Cortex-M4 32-bit MCU with FPU

Description: Ultra-low-power 32-bit ARM Cortex-M4 MCU with FPU at up to 80 MHz (100 DMIPS), 1.71–3.6 V supply, up to 1 MB Flash and 128 KB SRAM, with rich analog and 17 communication interfaces.

Operating Conditions:

  • Supply voltage (VDD): 1.71–3.6 V
  • Operating temperature: -40 to 85 °C (suffix-dependent: suffix 6 is -40 to 85 °C at maximum power dissipation, suffix 7 is -40 to 105 °C, suffix 3 is -40 to 125 °C; see Table 22)
  • Max AHB/APB clock frequency: 80 MHz
  • Analog supply VDDA: 1.62–3.6 V when ADC or COMP used; VBAT: 1.55–3.6 V

Absolute Maximum Ratings:

  • Max supply voltage (VDDX - VSS): 4.0 V
  • Max current into all VDD lines (sum): 150 mA
  • Max output current sunk/sourced by any I/O pin: 20 mA
  • Max junction temperature: 150 °C
  • Storage temperature: -65 to +150 °C

Key Specs:

  • VDD range: 1.71–3.6 V
  • VDDIO2 (PG[15:2] I/Os) supply: 1.08–3.6 V when used
  • VBAT backup voltage: 1.55–3.6 V
  • fHCLK / fPCLK1 / fPCLK2: up to 80 MHz
  • Power dissipation (TA = 85 °C, suffix 6): 444 mW (LQFP64), 476 mW (LQFP100), 625 mW (LQFP144), 363 mW (UFBGA132)
  • Junction temperature range: -40 to 105 °C (suffix 6)
  • Typical low-power figures from feature list: 100 μA/MHz run mode, 30 nA Shutdown, 120 nA Standby, 1.1 μA Stop 2

Features:

  • ARM Cortex-M4 with FPU, MPU, DSP instructions, ART Accelerator
  • Up to 1 MB Flash (2 banks), up to 128 KB SRAM (32 KB with hardware parity)
  • FlexPowerControl low-power modes, BOR, 4 μs wakeup from Stop
  • 3× 12-bit ADC (5 Msps), 2× 12-bit DAC, 2× op-amps with PGA, 2× comparators
  • 6× USART, 3× I2C FM+, 3× SPI, 2× SAI, CAN 2.0B, SDMMC, SWPMI, Quad SPI
  • External memory interface (SRAM, PSRAM, NOR, NAND)
  • 14-channel DMA, 16 timers, RTC with calendar, true RNG, CRC, 96-bit unique ID
  • Up to 24 capacitive sensing channels
  • Up to 114 fast I/Os, most 5 V-tolerant
  • SWD, JTAG, Embedded Trace Macrocell

Applications:

  • Ultra-low-power battery-powered embedded systems
  • Audio and analog signal acquisition applications

Package:

  • LQFP64 (STM32L471RCT6 is the 64-pin LQFP variant)
  • Other family packages: LQFP100, LQFP144, UFBGA132

STM32L471RG Features

  • Ultra-low-power with FlexPowerControl
  • -1.71 V to 3.6 V power supply
  • --40 °C to 85/105/125 °C temperature range
  • -300 nA in V BAT mode: supply for RTC and 32x32-bit backup registers
  • -30 nA Shutdown mode (5 wakeup pins)
  • -120 nA Standby mode (5 wakeup pins)
  • -420 nA Standby mode with RTC
  • -1.1 μA Stop 2 mode, 1.4 μA Stop 2 with RTC
  • -100 μA/MHz run mode
  • -Batch acquisition mode (BAM)
  • -4 μs wakeup from Stop mode
  • -Brown out reset (BOR) in all modes except shutdown
  • -Interconnect matrix
  • Core: ARM ® 32-bit Cortex ® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait-state execution from Flash memory, frequency up to 80 MHz, MPU, 100DMIPS/1.25DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Clock Sources
  • -4 to 48 MHz crystal oscillator
  • -32 kHz crystal oscillator for RTC (LSE)
  • -Internal 16 MHz factory-trimmed RC (±1%)
  • -Internal low-power 32 kHz RC (±5%)
  • -Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25 % accuracy)
  • -3 PLLs for system clock, audio, ADC
  • RTC with HW calendar, alarms and calibration
  • Up to 24 capacitive sensing channels: support touchkey, linear and rotary touch sensors
  • 16x timers: 2 x 16-bit advanced motor-control, 2 x 32-bit and 5 x 16-bit general purpose, 2x 16-bit basic, 2x low-power 16-bit timers (available in Stop mode), 2x watchdogs, SysTick timer
  • Up to 114 fast I/Os, most 5 V-tolerant, up to 14 I/Os with independent supply down to 1.08 V

February 2016

DocID027226 Rev 1

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STM32L471RG Pin Configuration

Figure 5. STM32L471Zx LQFP144 pinout (1)

STM32L471RG Electrical Characteristics

The definition and values of input/output AC characteristics are given in Figure 22 and Table 60 , respectively.

Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 22: General operating conditions .

Table 60. I/O AC characteristics (1)(2)

SpeedSymbolParameterConditionsMinMaxUnit
00FmaxMaximum frequencyC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-5MHz
00C=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-1MHz
00C=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-0.1MHz
00C=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-10MHz
00C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-1.5MHz
00C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-0.1MHz
00Tr/Tfrise and fall timeC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-25ns
00rise and fall timeC=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-52ns
00C=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-140ns
00C=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-17ns
00C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-37ns
00C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-110ns
01FmaxMaximum frequencyC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-25MHz
01Maximum frequencyC=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-10MHz
01Maximum frequencyC=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-1MHz
01Maximum frequencyC=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-50MHz
01Maximum frequencyC=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-15MHz
01Maximum frequencyC=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-1MHz
01Tr/Tfrise and fall timeC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-9ns
01rise and fall timeC=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-16ns
01rise and fall timeC=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-40ns
01C=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-4.5ns
01C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-9ns
01C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-21ns

Table 60. I/O AC characteristics (1)(2)

199

Table 60. I/O AC characteristics (1)(2) (continued)

SpeedSymbolParameterConditionsMinMaxUnit
10Maximum frequencyC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-50MHz
10C=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-25MHz
10C=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-5MHz
10FmaxC=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-100 (3)MHz
10C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-37.5MHz
10C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-5MHz
10Tr/TfOutput rise and fall timeC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-5.8ns
10Output rise and fall timeC=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-11ns
10C=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-28ns
10C=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-2.5ns
10C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-5ns
10C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-12ns
11FmaxMaximum frequencyC=30 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-120 (3)MHz
11Maximum frequencyC=30 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-50MHz
11Maximum frequencyC=30 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-10MHz
11Maximum frequencyC=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-180 (3)MHz
11C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-75MHz
11C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-10MHz
11Output rise and fallC=30 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-3.3ns
11Tr/TftimeC=30 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-6ns
11C=30 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-16ns
Fm+FmaxMaximum frequencyC=50 pF, 1.6 V ≤ V DDIOx ≤ 3.6 V-1MHz
Fm+TfOutput fall time (4)C=50 pF, 1.6 V ≤ V DDIOx ≤ 3.6 V-5ns
  1. This value represents the I/O capability but the maximum system frequency is limited to 80 MHz.
  2. The fall time is defined between 70% and 30% of the output waveform accordingly to I 2 C specification.

Figure 22. I/O AC characteristics definition (1)

  1. Refer to Table 60: I/O AC characteristics .

STM32L471RG Absolute Maximum Ratings

Stresses above the absolute maximum ratings listed in Table 19: Voltage characteristics , Table 20: Current characteristics and Table 21: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 19. Voltage characteristics (1)

SymbolRatingsMinMaxUnit
V DDX - V SSExternal main supply voltage (including V DD , V DDA , V DDIO2 , V BAT )-0.34.0V
V IN (2)Input voltage on FT_xxx pinsV SS -0.3min (V DD , V DDA , V DDIO2 ) + 4.0 (3)(4)V
V IN (2)Input voltage on TT_xx pinsV SS -0.34.0V
V IN (2)Input voltage on BOOT0 pinV SS9.0V
V IN (2)Input voltage on any other pinsV SS -0.34.0V
| ∆ V DDx |Variations between different V DDX power pins of the same domain-50mV
|V SSx -V SS |Variations between all the different ground pins (5)-50mV
  1. To sustain a voltage higher than 4 V the internal pull-up/pull-down resistors must be disabled.

  2. Include VREF- pin.

199

Table 20. Current characteristics

SymbolRatingsMaxUnit
∑ IV DDTotal current into sum of all V DD power lines (source) (1)150mA
∑ IV SSTotal current out of sum of all V SS ground lines (sink) (1)150mA
IV DD(PIN)Maximum current into each V DD power pin (source) (1)100mA
IV SS(PIN)Maximum current out of each V SS ground pin (sink) (1)100mA
I IO(PIN)Output current sunk by any I/O and control pin except FT_f20mA
I IO(PIN)Output current sunk by any FT_f pin20mA
I IO(PIN)Output current sourced by any I/O and control pin20mA
∑ I IO(PIN)Total output current sunk by sum of all I/Os and control pins (2)100mA
∑ I IO(PIN)Total output current sourced by sum of all I/Os and control pins (2)100mA
I INJ(PIN) (3)Injected current on FT_xxx, TT_xx, RST and B pins, except PA4, PA5-5/+0 (4)mA
I INJ(PIN) (3)Injected current on PA4, PA5-5/0mA
∑ |I INJ(PIN) |Total injected current (sum of all I/Os and control pins) (5)25mA
  1. A negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer also to Table 19: Voltage characteristics for the minimum allowed input voltage values.

  2. When several inputs are submitted to a current injection, the maximum ∑ |I INJ(PIN) | is the absolute sum of the negative injected currents (instantaneous values).

STM32L471RG Thermal Information

SymbolRatingsValueUnit
T STGStorage temperature range-65 to +150°C
T JMaximum junction temperature150°C

STM32L471RG Package Information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
STM32L471STMicroelectronics—
STM32L471QESTMicroelectronicsUFBGA-132
STM32L471QGSTMicroelectronicsUFBGA-132
STM32L471QXSTMicroelectronicsUFBGA-132
STM32L471RCT6STMicroelectronicsLQFP-64
STM32L471RESTMicroelectronicsLQFP-64
STM32L471RXSTMicroelectronics—
STM32L471VESTMicroelectronicsLQFP-100
STM32L471VGSTMicroelectronicsLQFP144
STM32L471VXSTMicroelectronicsLQFP-100
STM32L471ZESTMicroelectronics—
STM32L471ZGSTMicroelectronicsLQFP-144
STM32L471ZXSTMicroelectronics—

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