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STM32L471RX

The STM32L471RX is an electronic component from STMicroelectronics. View the full STM32L471RX datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

STMicroelectronics

Overview

The STM32L471xx devices are the ultra-low-power microcontrollers based on the highperformance ARM ® Cortex ® -M4 32-bit RISC core operating at a frequency of up to 80 MHz. The Cortex-M4 core features a Floating point unit (FPU) single precision which supports all ARM single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32L471xx devices embed high-speed memories (Flash memory up to 1 Mbyte, up to 128 Kbyte of SRAM), a flexible external memory controller (FSMC) for static memories (for devices with packages of 100 pins and more), a Quad SPI flash memories interface (available on all packages) and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.

The STM32L471xx devices embed several protection mechanisms for embedded Flash memory and SRAM: readout protection, write protection, proprietary code readout protection and Firewall.

The devices offer up to three fast 12-bit ADCs (5 Msps), two comparators, two operational amplifiers, two DAC channels, an internal voltage reference buffer, a low-power RTC, two general-purpose 32-bit timer, two 16-bit PWM timers dedicated to motor control, seven general-purpose 16-bit timers, and two 16-bit low-power timers. The devices support four digital filters for external sigma delta modulators (DFSDM).

In addition, up to 24 capacitive sensing channels are available.

They also feature standard and advanced communication interfaces.

  • Three I2Cs
  • Three SPIs
  • Three USARTs, two UARTs and one Low-Power UART.
  • Two SAIs (Serial Audio Interfaces)
  • One SDMMC
  • One CAN
  • One SWPMI (Single Wire Protocol Master Interface)

The STM32L471xx operates in the -40 to +85 °C (+105 °C junction), -40 to +105 °C (+125 °C junction) and -40 to +125 °C (+130 °C junction) temperature ranges from a 1.71 to 3.6 V power supply. A comprehensive set of power-saving modes allows the design of lowpower applications.

Some independent power supplies are supported: analog independent supply input for ADC, DAC, OPAMPs and comparators, and up to 14 I/Os can be supplied independently down to 1.08V. A VBAT input allows to backup the RTC and backup registers.

The STM32L471xx family offers four packages from 64-pin to 144-pin packages.

Table 2. STM32L471xx family device features and peripheral counts

PeripheralPeripheralSTM32L471ZxSTM32L471ZxSTM32L471QxSTM32L471QxSTM32L471VxSTM32L471VxSTM32L471RxSTM32L471Rx
Flash memoryFlash memory512KB1MB512KB1MB512KB1MB512KB1MB
SRAMSRAM128KB128KB128KB128KB128KB128KB128KB128KB
External memory controller for static memoriesExternal memory controller for static memoriesYesYesYesYesYes (1)Yes (1)NoNo
Quad SPIQuad SPIYesYesYesYesYesYesYesYes
Advanced control2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)
General purpose5 (16-bit) 2 (32-bit)5 (16-bit) 2 (32-bit)5 (16-bit) 2 (32-bit)5 (16-bit) 2 (32-bit)5 (16-bit) 2 (32-bit)5 (16-bit) 2 (32-bit)5 (16-bit) 2 (32-bit)5 (16-bit) 2 (32-bit)
Basic2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)
Low -power2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)2 (16-bit)
SysTick timer11111111
Watchdog timers (independent, window)22222222
SPI33333333
I 2 C33333333
USART UART LPUART3 2 13 2 13 2 13 2 13 2 13 2 13 2 13 2 1
SAI22222222
CAN11111111
SDMMCYesYesYesYesYesYesYesYes
SWPMIYesYesYesYesYesYesYesYes
Digital filters for sigma-delta modulatorsDigital filters for sigma-delta modulatorsYes (4 filters)Yes (4 filters)Yes (4 filters)Yes (4 filters)Yes (4 filters)Yes (4 filters)Yes (4 filters)Yes (4 filters)
Number of channelsNumber of channels88888888
RTCRTCYesYesYesYesYesYesYesYes
Tamper pinsTamper pins3 23 23 23 23 23 23 23 2
Random generatorRandom generatorYesYesYesYesYesYesYesYes
GPIOs Wakeup pins Nb of I/Os down to 1.08 VGPIOs Wakeup pins Nb of I/Os down to 1.08 V114 5 14114 5 14109 5109 582 5 082 5 051 4 051 4 0
Capacitive sensing Number of channelsCapacitive sensing Number of channels2424242421211212
12-bit ADCs Number of channels12-bit ADCs Number of channels3 243 243 193 193 163 163 163 16
12-bit DAC channels12-bit DAC channels22222222
Internal voltage reference bufferInternal voltage reference bufferNoNo
Analog comparatorAnalog comparator22222222
Operational amplifiersOperational amplifiers22222222
Max. CPU frequencyMax. CPU frequency80 MHz80 MHz80 MHz80 MHz80 MHz80 MHz80 MHz80 MHz
Operating voltageOperating voltage1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V1.71 to 3.6 V

Table 2. STM32L471xx family device features and peripheral counts

55

Table 2. STM32L471xx family device features and peripheral counts (continued)

PeripheralSTM32L471ZxSTM32L471QxSTM32L471VxSTM32L471Rx
Operating temperatureAmbient operating temperature: -40 to 85 °C / -40 to 105 °C / -40 to 125 °C Junction temperature: -40 to 105 °C / -40 to 125 °C / -40 to 130 °CAmbient operating temperature: -40 to 85 °C / -40 to 105 °C / -40 to 125 °C Junction temperature: -40 to 105 °C / -40 to 125 °C / -40 to 130 °CAmbient operating temperature: -40 to 85 °C / -40 to 105 °C / -40 to 125 °C Junction temperature: -40 to 105 °C / -40 to 125 °C / -40 to 130 °CAmbient operating temperature: -40 to 85 °C / -40 to 105 °C / -40 to 125 °C Junction temperature: -40 to 105 °C / -40 to 125 °C / -40 to 130 °C
PackagesLQFP144UFBGA132LQFP100LQFP64

Table 2. STM32L471xx family device features and peripheral counts (continued)

Figure 1. STM32L471xx block diagram

Note:

AF: alternate function on I/O pins.

55

Features

  • Ultra-low-power with FlexPowerControl
  • -1.71 V to 3.6 V power supply
  • --40 °C to 85/105/125 °C temperature range
  • -300 nA in V BAT mode: supply for RTC and 32x32-bit backup registers
  • -30 nA Shutdown mode (5 wakeup pins)
  • -120 nA Standby mode (5 wakeup pins)
  • -420 nA Standby mode with RTC
  • -1.1 μA Stop 2 mode, 1.4 μA Stop 2 with RTC
  • -100 μA/MHz run mode
  • -Batch acquisition mode (BAM)
  • -4 μs wakeup from Stop mode
  • -Brown out reset (BOR) in all modes except shutdown
  • -Interconnect matrix
  • Core: ARM ® 32-bit Cortex ® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait-state execution from Flash memory, frequency up to 80 MHz, MPU, 100DMIPS/1.25DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Clock Sources
  • -4 to 48 MHz crystal oscillator
  • -32 kHz crystal oscillator for RTC (LSE)
  • -Internal 16 MHz factory-trimmed RC (±1%)
  • -Internal low-power 32 kHz RC (±5%)
  • -Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25 % accuracy)
  • -3 PLLs for system clock, audio, ADC
  • RTC with HW calendar, alarms and calibration
  • Up to 24 capacitive sensing channels: support touchkey, linear and rotary touch sensors
  • 16x timers: 2 x 16-bit advanced motor-control, 2 x 32-bit and 5 x 16-bit general purpose, 2x 16-bit basic, 2x low-power 16-bit timers (available in Stop mode), 2x watchdogs, SysTick timer
  • Up to 114 fast I/Os, most 5 V-tolerant, up to 14 I/Os with independent supply down to 1.08 V

February 2016

DocID027226 Rev 1

Pin Configuration

Figure 5. STM32L471Zx LQFP144 pinout (1)

Electrical Characteristics

The definition and values of input/output AC characteristics are given in Figure 22 and Table 60 , respectively.

Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 22: General operating conditions .

Table 60. I/O AC characteristics (1)(2)

SpeedSymbolParameterConditionsMinMaxUnit
00FmaxMaximum frequencyC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-5MHz
00C=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-1MHz
00C=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-0.1MHz
00C=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-10MHz
00C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-1.5MHz
00C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-0.1MHz
00Tr/Tfrise and fall timeC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-25ns
00rise and fall timeC=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-52ns
00C=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-140ns
00C=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-17ns
00C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-37ns
00C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-110ns
01FmaxMaximum frequencyC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-25MHz
01Maximum frequencyC=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-10MHz
01Maximum frequencyC=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-1MHz
01Maximum frequencyC=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-50MHz
01Maximum frequencyC=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-15MHz
01Maximum frequencyC=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-1MHz
01Tr/Tfrise and fall timeC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-9ns
01rise and fall timeC=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-16ns
01rise and fall timeC=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-40ns
01C=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-4.5ns
01C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-9ns
01C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-21ns

Table 60. I/O AC characteristics (1)(2)

199

Table 60. I/O AC characteristics (1)(2) (continued)

SpeedSymbolParameterConditionsMinMaxUnit
10Maximum frequencyC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-50MHz
10C=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-25MHz
10C=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-5MHz
10FmaxC=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-100 (3)MHz
10C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-37.5MHz
10C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-5MHz
10Tr/TfOutput rise and fall timeC=50 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-5.8ns
10Output rise and fall timeC=50 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-11ns
10C=50 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-28ns
10C=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-2.5ns
10C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-5ns
10C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-12ns
11FmaxMaximum frequencyC=30 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-120 (3)MHz
11Maximum frequencyC=30 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-50MHz
11Maximum frequencyC=30 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-10MHz
11Maximum frequencyC=10 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-180 (3)MHz
11C=10 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-75MHz
11C=10 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-10MHz
11Output rise and fallC=30 pF, 2.7 V ≤ V DDIOx ≤ 3.6 V-3.3ns
11Tr/TftimeC=30 pF, 1.62 V ≤ V DDIOx ≤ 2.7 V-6ns
11C=30 pF, 1.08 V ≤ V DDIOx ≤ 1.62 V-16ns
Fm+FmaxMaximum frequencyC=50 pF, 1.6 V ≤ V DDIOx ≤ 3.6 V-1MHz
Fm+TfOutput fall time (4)C=50 pF, 1.6 V ≤ V DDIOx ≤ 3.6 V-5ns
  1. This value represents the I/O capability but the maximum system frequency is limited to 80 MHz.
  2. The fall time is defined between 70% and 30% of the output waveform accordingly to I 2 C specification.

Figure 22. I/O AC characteristics definition (1)

  1. Refer to Table 60: I/O AC characteristics .

Absolute Maximum Ratings

Stresses above the absolute maximum ratings listed in Table 19: Voltage characteristics , Table 20: Current characteristics and Table 21: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 19. Voltage characteristics (1)

SymbolRatingsMinMaxUnit
V DDX - V SSExternal main supply voltage (including V DD , V DDA , V DDIO2 , V BAT )-0.34.0V
V IN (2)Input voltage on FT_xxx pinsV SS -0.3min (V DD , V DDA , V DDIO2 ) + 4.0 (3)(4)V
V IN (2)Input voltage on TT_xx pinsV SS -0.34.0V
V IN (2)Input voltage on BOOT0 pinV SS9.0V
V IN (2)Input voltage on any other pinsV SS -0.34.0V
\∆ V DDx \Variations between different V DDX power pins of the same domain-
\V SSx -V SS \Variations between all the different ground pins (5)-
  1. To sustain a voltage higher than 4 V the internal pull-up/pull-down resistors must be disabled.

  2. Include VREF- pin.

199

Table 20. Current characteristics

SymbolRatingsMaxUnit
∑ IV DDTotal current into sum of all V DD power lines (source) (1)150mA
∑ IV SSTotal current out of sum of all V SS ground lines (sink) (1)150mA
IV DD(PIN)Maximum current into each V DD power pin (source) (1)100mA
IV SS(PIN)Maximum current out of each V SS ground pin (sink) (1)100mA
I IO(PIN)Output current sunk by any I/O and control pin except FT_f20mA
I IO(PIN)Output current sunk by any FT_f pin20mA
I IO(PIN)Output current sourced by any I/O and control pin20mA
∑ I IO(PIN)Total output current sunk by sum of all I/Os and control pins (2)100mA
∑ I IO(PIN)Total output current sourced by sum of all I/Os and control pins (2)100mA
I INJ(PIN) (3)Injected current on FT_xxx, TT_xx, RST and B pins, except PA4, PA5-5/+0 (4)mA
I INJ(PIN) (3)Injected current on PA4, PA5-5/0mA
∑ \I INJ(PIN) \Total injected current (sum of all I/Os and control pins) (5)
  1. A negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer also to Table 19: Voltage characteristics for the minimum allowed input voltage values.

  2. When several inputs are submitted to a current injection, the maximum ∑ |I INJ(PIN) | is the absolute sum of the negative injected currents (instantaneous values).

Thermal Information

SymbolRatingsValueUnit
T STGStorage temperature range-65 to +150°C
T JMaximum junction temperature150°C

Package Information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
STM32L471STMicroelectronics
STM32L471QESTMicroelectronics
STM32L471QGSTMicroelectronics
STM32L471QXSTMicroelectronics
STM32L471RCT6STMicroelectronics
STM32L471RESTMicroelectronics
STM32L471RGSTMicroelectronics
STM32L471VESTMicroelectronics
STM32L471VGSTMicroelectronics
STM32L471VXSTMicroelectronics
STM32L471XXSTMicroelectronics
STM32L471ZESTMicroelectronics
STM32L471ZGSTMicroelectronics
STM32L471ZXSTMicroelectronics
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