STM32F103T6

Part: STM32F103x4, STM32F103x6

Type: ARM-based 32-bit MCU

Description: Low-density performance line ARM-based 32-bit MCU with 16 or 32 KB Flash, 6 or 10 KB SRAM, USB, CAN, 6 timers, 2 ADCs, and 6 communication interfaces, operating at up to 72 MHz.

Operating Conditions:

• Supply voltage: 2.0 to 3.6 V
• Operating temperature: -40 to +85 °C
• Max CPU frequency: 72 MHz

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V
• Max continuous current: 120 mA (Total current into V DD / V DD A)
• Max junction temperature: 125 °C

Key Specs:

• CPU Core: ARM 32-bit Cortex-M3
• Flash Memory: 16 or 32 Kbytes
• SRAM: 6 or 10 Kbytes
• ADC: 2 x 12-bit, 1 μs, up to 16 channels
• SPI Speed: 18 Mbit/s
• Run mode current consumption: 10.8 mA (max, at 72 MHz, V DD = 3.6 V, T A = 85 °C, code from Flash)
• Stop mode current consumption: 2 μA (max, regulator in low-power mode, V DD = 3.6 V, T A = 85 °C)
• I/O Ports: Up to 51 fast I/O ports, almost all 5 V-tolerant

Features:

• Serial wire debug (SWD) & JTAG interfaces
• Six timers: Two 16-bit, one 16-bit motor control PWM, two watchdog, SysTick
• Six communication interfaces: 1x I2C, 2x USART, 1x SPI, CAN, USB 2.0 full-speed
• 7-channel DMA controller
• CRC calculation unit, 96-bit unique ID
• Low-power modes: Sleep, Stop, Standby

Package:

• LQFP64 (10 × 10 mm)
• LQFP48 (7 × 7mm)
• VFQFPN36 (6 × 6 mm)
• TFBGA64 (5 × 5 mm)
• UFQFPN48 (7 × 7 mm)

• ARM 32-bit Cortex™-M3 CPU Core
• -72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access
• -Single-cycle multiplication and hardware division
• Memories
• -16 or 32 Kbytes of Flash memory
• -6 or 10 Kbytes of SRAM
• Clock, reset and supply management
• -2.0 to 3.6 V application supply and I/Os
• -POR, PDR, and programmable voltage detector (PVD)
• -4-to-16 MHz crystal oscillator
• -Internal 8 MHz factory-trimmed RC
• -Internal 40 kHz RC
• -PLL for CPU clock
• -32 kHz oscillator for RTC with calibration
• Low power
• -Sleep, Stop and Standby modes
• -VBAT supply for RTC and backup registers
• 2 x 12-bit, 1 μs A/D converters (up to 16 channels)
• -Conversion range: 0 to 3.6 V
• -Dual-sample and hold capability
• -Temperature sensor
• DMA
• -7-channel DMA controller
• -Peripherals supported: timers, ADC, SPIs, I 2 Cs and USARTs
• Up to 51 fast I/O ports
• -26/37/51 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant

Figure 3. STM32F103xx performance line LQFP64 pinout

The definition and values of input/output AC characteristics are given in Figure 27 and Table 37 , respectively.

Unless otherwise specified, the parameters given in Table 37 are derived from tests performed under the ambient temperature and V DD supply voltage conditions summarized in Table 9 .

Table 37. I/O AC characteristics (1)

1. The maximum frequency is defined in Figure 27 .
2. Guaranteed by design, not tested in production.

98

Figure 27. I/O AC characteristics definition

Stresses above the absolute maximum ratings listed in Table 6: Voltage characteristics , Table 7: Current characteristics , and Table 8: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 6. Voltage characteristics

Table 7. Current characteristics

Table 7. Current characteristics

1. Positive injection is not possible on these I/Os. A negative injection is induced by V IN <V SS . I INJ(PIN) must never be exceeded. Refer to Table 6: Voltage characteristics for the maximum allowed input voltage values.
2. A positive injection is induced by V IN >VDD while a negative injection is induced by V IN <VSS . I INJ(PIN) must never be exceeded. Refer to Table 6: Voltage characteristics for the maximum allowed input voltage values.
3. When several inputs are submitted to a current injection, the maximum Σ I INJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values).

Table 8. Thermal characteristics

The maximum chip junction temperature (T J max) must never exceed the values given in Table 9: General operating conditions on page 33 .

The maximum chip-junction temperature, T J max, in degrees Celsius, may be calculated using the following equation:

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.