STM32F103T4

Part: STM32F103x4, STM32F103x6 — STMicroelectronics

Type: ARM Cortex-M3 32-bit Microcontroller

Description: Low-density performance line 32-bit ARM Cortex-M3 MCU operating up to 72 MHz with up to 32 KB Flash, 10 KB SRAM, USB, CAN, and dual 12-bit ADCs.

Operating Conditions:

• Supply voltage: 2.0 to 3.6 V
• Operating temperature: -40 to 85 °C (suffix 6)
• Maximum AHB clock frequency: 72 MHz
• Maximum APB1 clock frequency: 36 MHz

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V
• Max continuous current: 150 mA (I_VDD total source)
• Max junction/storage temperature: 150 °C

Key Specs:

• Maximum CPU clock frequency: 72 MHz
• Core performance: 1.25 DMIPS/MHz (Dhrystone 2.1)
• Flash memory size: 16 to 32 KB
• SRAM memory size: 6 to 10 KB
• Backup operating voltage: 1.8 to 3.6 V
• Analog operating voltage (ADC used): 2.4 to 3.6 V
• 12-bit ADC conversion time: 1 μs (up to 16 channels)
• General-purpose I/Os: up to 51 pins (5 V-tolerant)

Features:

• ARM 32-bit Cortex-M3 CPU core with single-cycle multiplication and hardware division
• 7-channel DMA controller supporting timers, ADCs, SPIs, I2Cs, and USARTs
• Serial wire debug (SWD) and JTAG interfaces
• 6 timers including motor control PWM timer with deadtime generation and emergency stop
• Two 12-bit 1 μs A/D converters with dual-sample and hold capability and integrated temperature sensor
• 96-bit unique device ID and CRC calculation unit
• Low-power modes: Sleep, Stop, and Standby

Applications:

• Motor drive and application control
• Medical and handheld equipment
• PC and gaming peripherals
• GPS platforms, industrial applications, and PLCs

Package:

• LQFP64 (10 × 10 mm)
• LQFP48 (7 × 7 mm)
• TFBGA64 (5 × 5 mm)
• UFQFPN48 (7 × 7 mm)
• VFQFPN36 (6 × 6 mm)

• ARM 32-bit Cortex™-M3 CPU Core
• -72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access
• -Single-cycle multiplication and hardware division
• Memories
• -16 or 32 Kbytes of Flash memory
• -6 or 10 Kbytes of SRAM
• Clock, reset and supply management
• -2.0 to 3.6 V application supply and I/Os
• -POR, PDR, and programmable voltage detector (PVD)
• -4-to-16 MHz crystal oscillator
• -Internal 8 MHz factory-trimmed RC
• -Internal 40 kHz RC
• -PLL for CPU clock
• -32 kHz oscillator for RTC with calibration
• Low power
• -Sleep, Stop and Standby modes
• -VBAT supply for RTC and backup registers
• 2 x 12-bit, 1 μs A/D converters (up to 16 channels)
• -Conversion range: 0 to 3.6 V
• -Dual-sample and hold capability
• -Temperature sensor
• DMA
• -7-channel DMA controller
• -Peripherals supported: timers, ADC, SPIs, I 2 Cs and USARTs
• Up to 51 fast I/O ports
• -26/37/51 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant

Figure 3. STM32F103xx performance line LQFP64 pinout

The definition and values of input/output AC characteristics are given in Figure 27 and Table 37 , respectively.

Unless otherwise specified, the parameters given in Table 37 are derived from tests performed under the ambient temperature and V DD supply voltage conditions summarized in Table 9 .

Table 37. I/O AC characteristics (1)

1. The maximum frequency is defined in Figure 27 .
2. Guaranteed by design, not tested in production.

98

Figure 27. I/O AC characteristics definition

Stresses above the absolute maximum ratings listed in Table 6: Voltage characteristics , Table 7: Current characteristics , and Table 8: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 6. Voltage characteristics

Table 7. Current characteristics

1. A positive injection is induced by V IN >VDD while a negative injection is induced by V IN <VSS . I INJ(PIN) must never be exceeded. Refer to Table 6: Voltage characteristics for the maximum allowed input voltage values.
2. When several inputs are submitted to a current injection, the maximum Σ I INJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values).

Table 8. Thermal characteristics

The maximum chip junction temperature (T J max) must never exceed the values given in Table 9: General operating conditions on page 33 .

The maximum chip-junction temperature, T J max, in degrees Celsius, may be calculated using the following equation:

T J max = T A max + (P D max × Θ JA )

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.