STM32F042K6

Part: STM32F042K6T6 (STM32F042x4/x6 family) — STMicroelectronics

Type: ARM Cortex-M0 32-bit MCU

Description: 48 MHz ARM Cortex-M0 MCU with up to 32 KB Flash and 6 KB SRAM, crystal-less USB FS 2.0, CAN, 9 timers, 12-bit ADC and multiple communication interfaces, operating from 2.0–3.6 V.

Operating Conditions:

• Supply voltage (VDD): 2.0–3.6 V
• Operating temperature: -40 to 85 °C (suffix 6, maximum power dissipation); suffix 6 allows up to 105 °C under low power dissipation
• Max AHB/APB clock: 48 MHz
• VDDA: VDD to 3.6 V (ADC not used); 2.4–3.6 V (ADC used)
• VDDIO2: 1.65–3.6 V
• VBAT: 1.65–3.6 V

Absolute Maximum Ratings:

• Max supply voltage (VDD–VSS): 4.0 V
• Input voltage on FT/FTf pins: VDDIOx + 4.0 V max; on TTa and other pins: 4.0 V max
• Total current into all VDD lines: 120 mA; per VDD pin: 100 mA
• Output current sunk/sourced by any I/O pin: 25 mA / -25 mA
• Total injected current (all I/O and control pins): ±25 mA
• Max junction temperature: 150 °C
• Storage temperature: -65 to +150 °C

Key Specs:

• Core clock: up to 48 MHz (fHCLK, fPCLK)
• Junction temperature range (suffix 6): -40 to 105 °C
• FT/FTf I/O input voltage: -0.3 to 5.5 V
• TTa I/O input voltage: -0.3 to VDDA + 0.3 V
• Power dissipation at TA = 85 °C (suffix 6): 351 mW (LQFP32), 526 mW (UFQFPN32)
• ADC: 12-bit, 1.0 μs, up to 10 channels, 0–3.6 V conversion range
• Memory: up to 32 KB Flash, 6 KB SRAM with HW parity

Features:

• ARM Cortex-M0 CPU up to 48 MHz
• Crystal-less USB 2.0 full-speed with internal 48 MHz oscillator, BCD and LPM support
• CAN interface
• Nine timers (including a 16-bit advanced-control timer, a 32-bit timer, watchdogs, SysTick)
• I2C with Fast Mode Plus (1 Mbit/s), two USARTs, two SPIs (18 Mbit/s, one with I2S)
• HDMI CEC
• 5-channel DMA, CRC unit
• Up to 14 capacitive sensing channels
• Up to 38 fast I/Os, up to 24 five-volt tolerant
• POR/PDR, PVD, low-power modes (Sleep, Stop, Standby), VBAT supply for RTC and backup registers
• Calendar RTC with alarm and periodic wakeup
• Serial wire debug (SWD), 96-bit unique ID
• ECOPACK 2 packages

Applications:

Package:

• LQFP32 (STM32F042K6T6 is the LQFP32 variant)
• Other family packages: LQFP48, UFQFPN48, WLCSP36, UFQFPN32, UFQFPN28, TSSOP20

• Core: ARM ® 32-bit Cortex ® -M0 CPU, frequency up to 48 MHz
• Memories
• -16 to 32 Kbytes of Flash memory
• -6 Kbytes of SRAM with HW parity
• CRC calculation unit
• Reset and power management
• -Digital and I/Os supply: V DD = 2 V to 3.6 V
• -Analog supply: V DDA = from V DD to 3.6 V
• -Selected I/Os: V DDIO2 = 1.65 V to 3.6 V
• -Power-on/Power down reset (POR/PDR)
• -Programmable voltage detector (PVD)
• -Low power modes: Sleep, Stop, Standby
• -VBAT supply for RTC and backup registers
• Clock management
• -4 to 32 MHz crystal oscillator
• -32 kHz oscillator for RTC with calibration
• -Internal 8 MHz RC with x6 PLL option
• -Internal 40 kHz RC oscillator
• -Internal 48 MHz oscillator with automatic trimming based on ext. synchronization
• Up to 38 fast I/Os
• -All mappable on external interrupt vectors
• -Up to 24 I/Os with 5 V tolerant capability and 8 with independent supply V DDIO2
• 5-channel DMA controller
• One 12-bit, 1.0 μs ADC (up to 10 channels)
• -Conversion range: 0 to 3.6 V
• -Separate analog supply: 2.4 V to 3.6 V
• Up to 14 capacitive sensing channels for touchkey, linear and rotary touch sensors
• Calendar RTC with alarm and periodic wakeup from Stop/Standby

Figure 3. LQFP48 package pinout

Figure 4. UFQFPN48 package pinout

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Figure 5. WLCSP36 package pinout

1. The above figure shows the package in top view, changing from bottom view in the previous document versions.

Figure 6. LQFP32 package pinout

Figure 5. WLCSP36 package pinout

Figure 7. UFQFPN32 package pinout

Figure 8. UFQFPN28 package

1. Pin pair PA11/12 can be remapped in place of pin pair PA9/10 using the SYSCFG_CFGR1 register.

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Figure 9. TSSOP20 package

Table 12. Legend/abbreviations used in the pinout table

Table 12. Legend/abbreviations used in the pinout table

Table 13. STM32F042x pin definitions

Table 13. STM32F042x pin definitions

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Table 13. STM32F042x pin definitions (continued)

Table 13. STM32F042x pin definitions (continued)

Table 13. STM32F042x pin definitions (continued)

Table 13. STM32F042x pin definitions (continued)

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Table 13. STM32F042x pin definitions (continued)

Table 13. STM32F042x pin definitions (continued)

The definition and values of input/output AC characteristics are given in Figure 24 and Table 52 , respectively. Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 21: General operating conditions .

Table 52. I/O AC characteristics (1)(2)

Table 52. I/O AC characteristics (1)(2)

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Table 52. I/O AC characteristics (1)(2) (continued)

1. Guaranteed by design, not tested in production.
2. The maximum frequency is defined in Figure 24 .
3. When Fm+ configuration is set, the I/O speed control is bypassed. Refer to the STM32F0xxxx reference manual RM0091 for a detailed description of Fm+ I/O configuration.

Figure 24. I/O AC characteristics definition

Stresses above the absolute maximum ratings listed in Table 18: Voltage characteristics , Table 19: Current characteristics and Table 20: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 18. Voltage characteristics (1)

Table 19. Current characteristics

1. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins referring to high pin count QFP packages.
2. A positive injection is induced by V IN > V DDIOx while a negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer to Table 18: Voltage characteristics for the maximum allowed input voltage values.
3. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
4. On these I/Os, a positive injection is induced by V IN > V DDA . Negative injection disturbs the analog performance of the device. See note (2) below Table 56: ADC accuracy .
5. When several inputs are submitted to a current injection, the maximum Σ I INJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values).

Table 20. Thermal characteristics

Table 20. Thermal characteristics

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The maximum chip junction temperature (T J max) must never exceed the values given in Table 21: General operating conditions .

The maximum chip-junction temperature, T J max, in degrees Celsius, may be calculated using the following equation:

$$T_J \max = T_A \max + (P_D \max \times \Theta_{JA})$$

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.