ST25DV04KC-JF6L3
Dynamic NFC/RFID Tag ICThe ST25DV04KC-JF6L3 is a dynamic nfc/rfid tag ic from STMicroelectronics. View the full ST25DV04KC-JF6L3 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Official ST25DV04KC-JF6L3 datasheet (PDF) — the source this page was extracted from.
Manufacturer
STMicroelectronicsCategory
Memory ICsPackage
10-XFBGA, WLCSP
Lifecycle
Production (Last Updated: 3 months ago)
ST25DV04KC-JF6L3 Key Specifications
| Parameter | Value |
|---|---|
| Frequency | 13.56MHz |
| Interface | I2C |
| Lifecycle Status | Production (Last Updated: 3 months ago) |
| Memory Type | EEPROM |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 10-XFBGA, WLCSP |
| Packaging | MouseReel |
| REACH SVHC | Yes |
| RoHS | Compliant |
| Standard Pack Qty | 5000 |
| Standards | ISO 15693, NFC |
| Supplier Device Package | 10-WLCSP (1.65x1.48) |
| Type | RFID Transponder |
| Supply Voltage | 1.8V ~ 5.5V |
ST25DV04KC-JF6L3 Overview
Part: ST25DV04KC / ST25DV16KC / ST25DV64KC — STMicroelectronics
Type: Dynamic NFC/RFID Tag IC with EEPROM
Description: Dynamic NFC Forum Type 5 / ISO/IEC 15693 tag IC with 4-, 16- or 64-Kbit EEPROM, 1 MHz I²C interface (1.8–5.5 V supply), a 256-byte fast transfer mode buffer and energy harvesting output.
Operating Conditions:
- Supply voltage (I²C, VCC): 1.8–5.5 V
- Operating temperature: -40 to 85 °C (Range 6, all packages); Range 8 extends to 105 °C (UFDFPN8/UFDFPN12) or 125 °C on the I²C interface (SO8N/TSSOP8, RF interface 105 °C max)
- I²C clock: up to 1 MHz
- VCC must not rise faster than 1 V/μs at power-up
Absolute Maximum Ratings:
- Max supply voltage (VCC): 6.5 V (min -0.50 V)
- I²C input/output voltage (VIO): -0.50 to 6.5 V
- Max DC output current: 5 mA on SDA, 1.5 mA on GPO
- RF input voltage between AC0 and AC1 (peak to peak): 11 V
- AC voltage between AC0/AC1 and VSS: -0.50 to 5.5 V
- Storage temperature: -65 to 150 °C
- ESD (HBM, all pins): 2000 V
Key Specs:
- Memory: 4, 16 or 64 Kbit EEPROM (512 / 2048 / 8192 bytes)
- I²C write time: typical 5 ms for 1 to 16 bytes; RF write time: typical 5 ms per block
- Data retention: 40 years
- Write endurance: 1 million cycles at 25 °C, 600k at 85 °C, 500k at 105 °C, 400k at 125 °C
- RF fast read: up to 53 Kbit/s
- Internal tuning capacitance: 28.5 pF
- Fast transfer buffer: 256 bytes, half-duplex
- LPD mode: regulator consumption below 1 μA (10-ball and 12-pin packages only)
Features:
- ISO/IEC 15693 contactless interface, NFC Forum Type 5 certified
- I²C interface with configurable target address and multi-byte programming (up to 256 bytes)
- Fast transfer mode between I²C and RF interfaces
- Energy harvesting analog output (V_EH)
- Configurable GPO interrupt pin (open drain or CMOS depending on package)
- Up to four configurable user memory areas, each protectable by passwords (three 64-bit RF passwords and one 64-bit I²C password)
- Low power down (LPD) input on 10-ball and 12-pin packages
- RF command interpreter can be enabled or disabled from the I²C host, and I²C has priority (immediate RF switch off)
- ECOPACK2 (RoHS compliant)
Applications:
- NFC/RFID contactless tagging with a wired host interface
- Data exchange between an NFC reader (e.g. smartphone) and an I²C host controller
Package:
- SO8N (8-pin)
- TSSOP8 (8-pin)
- UFDFPN8 (8-pin)
- WLCSP10 (10-ball)
- UFDFPN12 (12-pin)
ST25DV04KC-JF6L3 Features
The devices offer the following features:
- A fast transfer mode (FTM), to achieve a fast link between RF and contact worlds, via a 256-byte buffer called mailbox. This mailbox dynamic buffer of 256 bytes can be filled or emptied via either RF or I²C.
- A GPO pin, which indicates incoming events to the contact side, like RF events (RF field changes, RF activity, RF writing completion, or mailbox message availability) or I²C events (I²C write completion, RF switch off from I²C).
- An energy harvesting element to deliver mW of power when external conditions make it possible.
- RF management, which allows ST25DVxxKC to ignore RF requests.
All these features can be programmed by setting the static and/or dynamic registers. The devices can be partially customized using configuration registers located in the system area. These registers are:
- Dedicated to data memory organization and protection: ENDA i , I2CSS, RFAiSS, LOCK_CCFILE.
- Dedicated to fast transfer mode: FTM
- Dedicated to observation: GPO, IT_TIME
- Dedicated to RF: RF_MNGT, EH_MODE
- Dedicated the structure: LOCK_CFG
- Dedicated to I²C configuration: I2C_CFG
A set of additional registers (such as (DSFID, AFI, IC_REF) allows the user to identify and customize the product .
ST25DV04KC-JF6L3 Electrical Characteristics
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device in RF mode.
The parameters in the following tables are derived from tests performed under the measurement conditions summarized in the relevant tables. Check that the operating conditions in the circuit match the measurement conditions when relying on the quoted parameters.
Table 256. RF characteristics
| Symbol | Parameter | Condition | Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|
| f CC | External RF signal frequency | - | - | 13.553 | 13.56 | 13.567 | MHz |
| H_ISO | Operating field according to ISO (1) | Range 6 | T A = -40 °C to 85 °C | 150 | - | 5000 | mA/m |
| H_ISO | Operating field according to ISO (1) | Range 8 | T A = -40 °C to 105 °C | 150 | - | 5000 | mA/m |
| MI CARRIER | 10% carrier modulation index MI=(A-B)/(A+B) (1) | 150 mA/m > H_ISO > 1000 mA/m | 150 mA/m > H_ISO > 1000 mA/m | 10 | - | 30 | % |
| MI CARRIER | 100% carrier modulation index (1) | MI=(A-B)/(A+B) | MI=(A-B)/(A+B) | 95 | - | 100 | % |
| t MINCD | Minimum time from carrier generation to first data (1) | From H-field min | From H-field min | - | - | 1 | ms |
| f SH | Subcarrier frequency high (1) | f CC /32 | f CC /32 | - | 423.75 | - | kHz |
| f SL | Subcarrier frequency low (1) | f CC /28 | f CC /28 | - | 484.28 | - | kHz |
| t 1 | Time for ST25DVxxKC response (1) | 4352/f CC | 4352/f CC | 318.6 | 320.9 | 323.3 | μs |
| t 2 | Time between commands (1) | 4192/f CC | 4192/f CC | 309 | 311.5 | 314 | μs |
| t 3 | Time between commands (1) | 4384/f CC | 4384/f CC | 323.3 | - | - | μs |
| W t_Block | RF User memory write time (including internal Verify) (1)(2) | 1 block | 1 block | - | 5.2 | - | ms |
| W t_Block | RF User memory write time (including internal Verify) (1)(2) | 4 blocks | 4 blocks | - | 19.7 | - | ms |
| W t_Byte | RF system memory write time including internal Verify) (1)(2) | 1 byte | 1 byte | - | 4.9 | - | ms |
| W t_MB | RF Mailbox write time (from VCD request SOF to ST25DVxxKC response EOF) (1)(2) | 256 bytes | 256 bytes | - | 80.7 | - | ms |
| Read_MB | RF Mailbox read time (from VCD request SOF to ST25DVxxKC response EOF) (1)(2) | 256 bytes | 256 bytes | - | 81 | - | ms |
| C TUN | Internal tuning capacitor (3) | f = 13.56 MHz | f = 13.56 MHz | 26.5 | 28.5 | 30.5 | pF |
| V BACK | Backscattered level as defined by ISO test (1) | - | - | 10 | - | - | mV |
| V MIN_1 | RF input voltage amplitude between AC0 and AC1, V pin left floating, VAC0-VAC1 | Inventory and Read operations | Inventory and Read operations | - | 4.8 | - | V |
| V MIN_1 | SS peak to peak (1) | Write operations | Write operations | - | 5.25 | - | V |
| V MIN_2 | AC voltage between AC0 and V SS or between AC1 and V SS (1) | Inventory and Read operations | Inventory and Read operations | - | 2.25 | - | V |
| V MIN_2 | AC voltage between AC0 and V SS or between AC1 and V SS (1) | Write operations | Write operations | - | 2.7 | - | V |
| t bootRF | Without DC supply (No V CC ) (1) | Set up time | Set up time | - | 0.6 | - | ms |
| t RF_OFF | RF OFF time (1) | Chip reset | Chip reset | 2 | - | - | ms |
Note:
All timing characterization where performed on a reference antenna with the following characteristics:
- ISO antenna class 1
- Tuning frequency = 13.7 MHz
Table 257. Operating conditions
| Symbol | Parameter | Parameter | Min. | Max. | Unit |
|---|---|---|---|---|---|
| T A | Ambient operating temperature | Range 6 Range 8 | -40 -40 | 85 105 | °C |
Figure 83. ASK modulated signal shows an ASK modulated signal from the VCD to the ST25DVxxKC. The test conditions for the AC/DC parameters are:
- Close coupling condition with tester antenna (1 mm)
- ST25DVxxKC performance measured at the tag antenna
- ST25DVxxKC synchronous timing, transmit and receive
Figure 83. ASK modulated signal
ST25DV04KC-JF6L3 Absolute Maximum Ratings
Stressing the device above the ratings listed in Table 245 may cause permanent damage to the device. These are stress ratings only, and operation of the device, at these or any other conditions above those indicated in the operating sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 qualification standard. Extended mission profiles can be assessed on demand.
Refer also to the STMicroelectronics SURE program and other relevant quality documents.
Table 245. Absolute maximum ratings
| Symbol | Parameter | Parameter | Parameter | Parameter | Min. | Max. | Unit |
|---|---|---|---|---|---|---|---|
| T A | Ambient operating temperature | Range 6 | All packages | RF and I 2 C interfaces | -40 | 85 | °C |
| T A | Ambient operating temperature | Range 8 | UFDFPN8, UFDFPN12 | RF and I 2 C interfaces | - 40 | 105 | °C |
| T A | Ambient operating temperature | Range 8 | SO8N, TSSOP | RF interface | - 40 | 105 | °C |
| T A | Ambient operating temperature | Range 8 | SO8N, TSSOP | I 2 C interface | - 40 | 125 | °C |
| T STG | Storage temperature | UFDFPN8 (MLP8),SO8N, TSSOP8, UFDFPN12, WLCSP10 | UFDFPN8 (MLP8),SO8N, TSSOP8, UFDFPN12, WLCSP10 | UFDFPN8 (MLP8),SO8N, TSSOP8, UFDFPN12, WLCSP10 | - 65 | 150 | °C |
| T LEAD | Lead temperature during soldering | Lead temperature during soldering | Lead temperature during soldering | Lead temperature during soldering | see note (1) | see note (1) | °C |
| V IO | I 2 C input or output range | I 2 C input or output range | I 2 C input or output range | I 2 C input or output range | - 0.50 | 6.5 | V |
| V CC | I 2 C supply voltage | I 2 C supply voltage | I 2 C supply voltage | I 2 C supply voltage | - 0.50 | 6.5 | V |
| I OL_MAX_SDA | DC output current on pin SDA (when equal to 0) | DC output current on pin SDA (when equal to 0) | DC output current on pin SDA (when equal to 0) | DC output current on pin SDA (when equal to 0) | - | 5 | mA |
| I OL_MAX_GPO | DC output current on pin GPO (when equal to 0) | DC output current on pin GPO (when equal to 0) | DC output current on pin GPO (when equal to 0) | DC output current on pin GPO (when equal to 0) | - | 1.5 | mA |
| V MAX_1 | RF input voltage amplitude peak to peak between AC0 and AC1, V SS pin left floating (2) | RF input voltage amplitude peak to peak between AC0 and AC1, V SS pin left floating (2) | RF input voltage amplitude peak to peak between AC0 and AC1, V SS pin left floating (2) | V AC0 - V AC1 | - | 11 | V |
| V MAX_2 | AC voltage between AC0 and V SS , or AC1 and V SS (2) | AC voltage between AC0 and V SS , or AC1 and V SS (2) | AC voltage between AC0 and V SS , or AC1 and V SS (2) | V AC0 - V SS , or V AC1 - V SS | - 0.50 | 5.5 | V |
| V ESD | Electrostatic discharge voltage (human body model) (3) | Electrostatic discharge voltage (human body model) (3) | Electrostatic discharge voltage (human body model) (3) | All pins | - | 2000 | V |
- Evaluated by characterization - Not tested in production.
- AEC-Q100-002 (compliant with JEDEC Std JESD22-A114, C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω)
ST25DV04KC-JF6L3 Thermal Information
Table 258. Thermal characteristics
| Symbol | Parameter | Value | Unit |
|---|---|---|---|
| Ɵ JA | Thermal resistance junction-ambient SO8N 4.9 x 6 mm, 1.27 mm pitch package (1) | 219 | °C/W |
| Ɵ JA | Thermal resistance junction-ambient TSSOP8 3 x 6.4 mm, 0.65 mm pitch package (1) | 255 | °C/W |
| Ɵ JA | Thermal resistance junction-ambient UFDFN8 2 × 3 mm, 0.5 mm pitch package (1)(2) | 67 | °C/W |
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Jedec JESD51-7 2s2p board
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Exposed pad soldered to board
DT19784V1
ST25DV04KC-JF6L3 Package Information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
Variants on the same datasheet
These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.
| Part Number | Manufacturer | Package |
|---|---|---|
| ST25DV04KC | STMicroelectronics | TSSOP-8 |
| ST25DV04KC-IE | STMicroelectronics | SO8N |
| ST25DV04KC-JF | STMicroelectronics | — |
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All Memory ICs datasheetsAll STMicroelectronics datasheets (808)
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