ST25DV04KC

The ST25DV04KC, ST25DV16KC, and ST25DV64KC devices (hereinafter referred collectively to as ST25DVxxKC) are NFC RFID tags offering, respectively, 4, 16, and 64 -Kbit of electrically erasable programmable memory (EEPROM). These devices feature two interfaces: the first one is an I²C serial link that can be operated from a DC power supply, the second one is an RF link activated when the device acts as a contactless memory powered by the received carrier electromagnetic wave.

In I²C mode, the user memory contains 512 (ST25DV04KC), 2048 (ST25DV16KC), or 8192 (ST25DV64KC) bytes, which can be split in four flexible and protectable areas.

In RF mode, following ISO/IEC 15693 or NFC Forum Type 5 recommendations, the user memory contains 128 (ST25DV04KC), 512 (ST25DV16KC), or 2048 (ST25DV64KC) blocks of 4 bytes, which can be split in four flexible and protectable areas.

These devices offer a fast transfer mode between the RF and contact interfaces, thanks to a 256 bytes volatile buffer (also called mailbox). In addition, the GPO pin provides data about incoming events, like RF field detection, RF activity in progress, or mailbox message availability. An energy harvesting feature is also available.

The devices offer the following features:

• A fast transfer mode (FTM), to achieve a fast link between RF and contact worlds, via a 256-byte buffer called mailbox. This mailbox dynamic buffer of 256 bytes can be filled or emptied via either RF or I²C.
• A GPO pin, which indicates incoming events to the contact side, like RF events (RF field changes, RF activity, RF writing completion, or mailbox message availability) or I²C events (I²C write completion, RF switch off from I²C).
• An energy harvesting element to deliver mW of power when external conditions make it possible.
• RF management, which allows ST25DVxxKC to ignore RF requests.

All these features can be programmed by setting the static and/or dynamic registers. The devices can be partially customized using configuration registers located in the system area. These registers are:

• Dedicated to data memory organization and protection: ENDA i , I2CSS, RFAiSS, LOCK_CCFILE.
• Dedicated to fast transfer mode: FTM
• Dedicated to observation: GPO, IT_TIME
• Dedicated to RF: RF_MNGT, EH_MODE
• Dedicated the structure: LOCK_CFG
• Dedicated to I²C configuration: I2C_CFG

A set of additional registers (such as (DSFID, AFI, IC_REF) allows the user to identify and customize the product .

This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device in RF mode.

The parameters in the following tables are derived from tests performed under the measurement conditions summarized in the relevant tables. Check that the operating conditions in the circuit match the measurement conditions when relying on the quoted parameters.

Table 256. RF characteristics

Note:

All timing characterization where performed on a reference antenna with the following characteristics:

• ISO antenna class 1
• Tuning frequency = 13.7 MHz

Table 257. Operating conditions

Figure 83. ASK modulated signal shows an ASK modulated signal from the VCD to the ST25DVxxKC. The test conditions for the AC/DC parameters are:

• Close coupling condition with tester antenna (1 mm)
• ST25DVxxKC performance measured at the tag antenna
• ST25DVxxKC synchronous timing, transmit and receive

Figure 83. ASK modulated signal

Stressing the device above the ratings listed in Table 245 may cause permanent damage to the device. These are stress ratings only, and operation of the device, at these or any other conditions above those indicated in the operating sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 qualification standard. Extended mission profiles can be assessed on demand.

Refer also to the STMicroelectronics SURE program and other relevant quality documents.

Table 245. Absolute maximum ratings

1. Evaluated by characterization - Not tested in production.
2. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114, C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω)

Table 258. Thermal characteristics

1. Jedec JESD51-7 2s2p board

2. Exposed pad soldered to board

DT19784V1

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.