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PIC18F26K22

Microcontroller

The PIC18F26K22 is a microcontroller from Microchip Technology. View the full PIC18F26K22 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Manufacturer

Microchip Technology

Category

Microcontroller

Key Specifications

ParameterValue
ConnectivityI2C, SPI, UART/USART
Core ProcessorPIC
Core Size8-Bit
Data ConvertersA/D 30x10b
DigiKey ProgrammableVerified
EEPROM Size256 x 8
Mounting TypeSurface Mount
Number of I/O35
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeInternal
Package / Case44-TQFP
PeripheralsBrown-out Detect/Reset, HLVD, POR, PWM, WDT
Flash Memory Size32KB (16K x 16)
Program Memory TypeFLASH
RAM Size1.5K x 8 B
Clock Speed64MHz
Supplier Device Package44-TQFP (10x10)
Supply Voltage2.3V ~ 5.5V

Overview

Part: PIC18F45K22-I/PT — Microchip Technology

Type: Low-Power, High-Performance Microcontroller with XLP Technology

Description: High-performance RISC microcontroller with XLP Technology, featuring up to 32 Kbytes Flash, 1536 Bytes SRAM, 256 Bytes EEPROM, and operating up to 16 MIPS from 2.3V to 5.5V.

Operating Conditions:

  • Supply voltage: 2.3V to 5.5V (for PIC18FXXK22 devices)
  • Max clock frequency: Up to 64 MHz
  • Max MIPS operation: Up to 16 MIPS

Key Specs:

  • CPU Architecture: C Compiler Optimized RISC
  • Program Memory: 32 Kbytes Flash (for PIC18F45K22)
  • Data Memory (SRAM): 1536 Bytes (for PIC18F45K22)
  • Data EEPROM: 256 Bytes (for PIC18F45K22)
  • ADC Resolution: 10-bit, up to 30 external channels
  • DAC Resolution: 5-bit resistive
  • Sleep Mode Current: 20 nA, typical
  • I/O Pins: Up to 36 (for PIC18(L)F4XK22 devices)

Features:

  • Optional extended instruction set
  • Priority levels for interrupts
  • 31-level, software accessible hardware stack
  • Precision 16 MHz internal oscillator block, factory calibrated to ±1%
  • Fail-Safe Clock Monitor
  • Two rail-to-rail analog comparators
  • Charge Time Measurement Unit (CTMU) for capacitive touch sensing
  • Peripheral Module Disable
  • Self-programmable under software control
  • Programmable Brown-out Reset (BOR)
  • In-Circuit Serial Programming (ICSP)
  • Two Master Synchronous Serial Port (MSSP) modules (SPI, I2C)
  • Two Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) modules (RS-485, RS-232, LIN)

Package:

  • 28-SSOP
  • 28-SOIC
  • 28-SPDIP
  • 28-QFN
  • 28-UQFN
  • 40-PDIP
  • 40-UQFN
  • 44-TQFP
  • 44-QFN

Features

  • Analog-to-Digital Converter (ADC) module:
  • -10-bit resolution, up to 30 external channels
  • -Auto-acquisition capability
  • -Conversion available during Sleep
  • -Fixed Voltage Reference (FVR) channel
  • -Independent input multiplexing
  • Analog Comparator module:
  • -Two rail-to-rail analog comparators
  • -Independent input multiplexing
  • Digital-to-Analog Converter (DAC) module:
  • -Fixed Voltage Reference (FVR) with 1.024V, 2.048V and 4.096V output levels
  • -5-bit rail-to-rail resistive DAC with positive and negative reference selection
  • Charge Time Measurement Unit (CTMU) module:
  • -Supports capacitive touch sensing for touch screens and capacitive switches

Applications

Pin Configuration

Port bitPort Function Priority by Port PinPort Function Priority by Port PinPort Function Priority by Port PinPort Function Priority by Port PinPort Function Priority by Port Pin
Port bitPORTAPORTBPORTCPORTD (2)PORTE (2)
5SRNQCCP3 (3)SDO1P1B
5C2OUTP3A (3)RC5RD5
5RA5P2B (1)(4)
5RB5
6OSC2PGCTX1/CK1TX2/CK2
6CLKOTX2/CK2 (1)CCP3 (1)(7)P1C
6RA6RB6P3A (1)(7)RD6
6ICDCKRC6
7RA7
7OSC1PGDRX1/DT1RX2/DT2
7RA7RX2/DT2 (1)P3B (1)P1D
7RB7RC7RD7
7ICDDT
  • 2: PIC18(L)F4XK22 devices.
  • 3: Function default pin.
  • 4: Function default pin (28-pin devices).
  • 5: Function default pin (40/44-pin devices).
  • 6: Function alternate pin.
  • 7: Function alternate pin (28-pin devices).
  • 8: Function alternate pin (40/44-pin devices)

Electrical Characteristics

PIC18(L)F2X/4XK22PIC18(L)F2X/4XK22PIC18(L)F2X/4XK22PIC18(L)F2X/4XK22Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C T A +125°CStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C T A +125°CStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C T A +125°CStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C T A +125°CStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C T A +125°C
Param No.SymbolCharacteristicMinTypMaxUnitsConditions
D001VDDSupply VoltagePIC18LF2X/4XK221.8-3.6V
D001VDDSupply VoltagePIC18F2X/4XK222.3-5.5V
D002VDRRAM Data Retention Voltage (1)RAM Data Retention Voltage (1)1.5--V
D003VPORVDD Start Voltage to ensure internal Power-on Reset signalVDD Start Voltage to ensure internal Power-on Reset signal--0.7VSee section on Power-on Reset for details
D004SVDDVDD Rise Rate to ensure internal Power-on Reset signalVDD Rise Rate to ensure internal Power-on Reset signal0.05--V/msSee section on Power-on Reset for details
D005VBORBrown-out Reset VoltageBrown-out Reset VoltageBrown-out Reset VoltageBrown-out Reset VoltageBrown-out Reset VoltageBrown-out Reset VoltageBrown-out Reset Voltage
D005VBORBORV<1:0> = 11 (2)BORV<1:0> = 11 (2)1.751.92.05V
D005VBORBORV<1:0> = 10BORV<1:0> = 102.052.22.35V
D005VBORBORV<1:0> = 01BORV<1:0> = 012.352.52.65V
D005VBORBORV<1:0> = 00 (3)BORV<1:0> = 00 (3)2.652.853.05V

Absolute Maximum Ratings

Ambient temperature under bias.............................................................................................................-40°Cto +125°C
Storage temperature ..............................................................................................................................-65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, and MCLR) .................................................. -0.3V to (VDD +0.3V)
Voltage on VDD with respect to VSS
PIC18LF2X/4XK22 ...................................................................................................-0.3V to +4.5V
PIC18F2X/4XK22 .....................................................................................................-0.3V to +6.5V
Voltage on MCLR with respect to VSS (Note 2) ............................................................................................0Vto +11.0V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of VSS pin (-40°C to +85°C) ..............................................................................................300 mA
Maximum current out of VSS pin (+85°C to +125°C)............................................................................................125 mA
Maximum current into VDD pin (-40°C to +85°C) ........................................................................ ........................200 mA
Maximum current into VDD pin (+85°C to +125°C) ................................................................................................85mA
Input clamp current, I IK (V I < 0 or VI > VDD)20 mA
Output clamp current, I OK (VO < 0 or VO > VDD)20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25mA
Maximum output current sourced by any I/O pin ....................................................................................................25mA
Maximum current sunk by all ports (-40°C to +85°C)...........................................................................................200 mA
Maximum current sunk by all ports (+85°C to +125°C).........................................................................................110mA
Maximum current sourced by all ports (-40°C to +85°C) ......................................................................................185mA
Maximum current sourced by all ports (+85°C to +125°C) .....................................................................................70mA
  • Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOL x IOL)
  • 2: Voltage spikes below VSS at the MCLR/VPP/RE3 pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a 'low' level to the MCLR/VPP/ RE3 pin, rather than pulling this pin directly to VSS.

† NOTICE: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

FIGURE 27-1: PIC18LF2X/4XK22 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL TEMPERATURE)

Note 1: Maximum Frequency 20 MHz, 1.8V to 2.7V, -40°C to +85°C

2: Maximum Frequency 64 MHz, 2.7V to 3.6V, -40°C to +85°C

FIGURE 27-2: PIC18LF2X/4XK22 FAMILY VOLTAGE-FREQUENCY GRAPH (EXTENDED TEMPERATURE)

Note 1: Maximum Frequency 16 MHz, 1.8V to 2.7V, +85°C to +125°C

2: Maximum Frequency 48 MHz, 2.7V to 3.6V, +85°C to +125°C

FIGURE 27-3: PIC18F2X/4XK22 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL TEMPERATURE)

FIGURE 27-4: PIC18F2X/4XK22 FAMILY VOLTAGE-FREQUENCY GRAPH (EXTENDED TEMPERATURE)

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
PIC18F23K22Microchip Technology
PIC18F24K22Microchip Technology
PIC18F25K22Microchip Technology
PIC18F43K22Microchip Technology
PIC18F44K22Microchip Technology
PIC18F45K22Microchip Technology
PIC18F45K22-I/PTMicrochip Technology44-TQFP
PIC18F46K22Microchip Technology
PIC18FXXK22Microchip Technology
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