PIC16LF1825

Part: PIC16F1827-I/SS — Microchip Technology

Type: 8-bit Enhanced Mid-range PIC Flash Microcontroller with XLP (nanoWatt XLP)

Description: 8-bit PIC MCU at up to 32 MHz (125 ns instruction cycle) with 1.8–5.5 V operation (PIC16F1827), 10-bit ADC with up to 12 channels, dual MSSP and EUSART. The datasheet covers the PIC16(L)F1825/1829 14/20-pin family.

Operating Conditions:

• Supply voltage: 1.8–5.5 V (PIC16F1825/9); 1.8–3.6 V (PIC16LF1825/9)
• Operating temperature: -40 to +85 °C (industrial); extended grade to +125 °C
• Clock: DC–32 MHz

Absolute Maximum Ratings:

• Max supply voltage (VDD to VSS): -0.3 to +6.5 V (PIC16F1825/9); -0.3 to +4.0 V (PIC16LF1825/9)
• MCLR voltage: -0.3 to +9.0 V
• Voltage on other pins: -0.3 V to VDD + 0.3 V
• Max current into VDD pin: 80 mA (-40 to +85 °C); 30 mA (-40 to +125 °C)
• Max current out of VSS pin: 85 mA (-40 to +85 °C); 35 mA (-40 to +125 °C)
• Max current sunk or sourced by any I/O pin: 25 mA
• Total power dissipation: 800 mW
• Ambient temperature under bias: -40 to +125 °C
• Storage temperature: -65 to +150 °C

Key Specs:

• Instruction set: 49 instructions, single-cycle except branches
• Internal oscillator: factory calibrated to ±1% typical, 31 kHz to 32 MHz software selectable
• ADC: 10-bit, up to 12 channels
• Sleep current (PIC16LF, XLP): 20 nA typical at 1.8 V
• Watchdog timer current (PIC16LF, XLP): 300 nA typical at 1.8 V
• Operating current (PIC16LF, XLP): 48 μA/MHz typical at 1.8 V
• I/O: up to 17 I/O pins plus 1 input-only pin, 25 mA sink/source per pin
• Hardware stack: 16 levels

Features:

• 16 KB maximum linear program memory addressing, 1024 bytes maximum data memory addressing
• 4x PLL, fail-safe clock monitor, two-speed start-up
• Two CCP and two ECCP modules with auto-shutdown and PWM steering
• Up to two MSSP (SPI and I²C) modules, EUSART
• Two rail-to-rail comparators, FVR (1.024/2.048/4.096 V), 5-bit DAC
• mTouch capacitive sensing with up to 12 channels
• Data Signal Modulator and SR Latch
• Programmable brown-out reset, extended WDT
• ICSP and ICD via two pins, self-programmable flash

Applications:

• Low-power battery-operated embedded designs
• Capacitive touch sensing interfaces
• Motor and PWM control

Package:

• SSOP (20-pin)
• Other family packages: PDIP, SOIC, TSSOP (14-pin); QFN, UQFN (16/20-pin)

• 1.8V-5.5V Operation - PIC16F1825/9
• 1.8V-3.6V Operation - PIC16LF1825/9
• Self-Programmable under Software Control
• Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
• Programmable Brown-out Reset (BOR)
• Extended Watchdog Timer (WDT)
• In-Circuit Serial Programming™ (ICSP™) via two pins
• In-Circuit Debug (ICD) via Two Pins
• Enhanced Low-Voltage Programming (LVP)
• Programmable Code Protection
• Power-Saving Sleep mode

Since the PxA and PxB outputs are multiplexed with the PORT data latches, the associated TRIS bits must be cleared to configure PxA and PxB as outputs.

The Alternate Pin Function Control 0 (APFCON0) and Alternate Pin Function Control 1 (APFCON1) registers are used to steer specific peripheral input and output functions between different pins. The APFCON0 and APFCON1 registers are shown in Register 12-1 and Register 12-2. For this device family, the following functions can be moved between different pins.

• RX/DT/TX/CK
• SDO1
• SS (Slave Select)
• T1G
• P1B/P1C/P1D/P2B
• CCP1/P1A/CCP2

These bits have no effect on the values of any TRIS register. PORT and TRIS overrides will be routed to the correct pin. The unselected pin will be unaffected.

• Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
• 2: PLL required for 32 MHz operation.

Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOl x IOL).

† NOTICE: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability.

Note 1: IDD is current to run the chip alone without driving any load on the output pins.

2: TA = Ambient Temperature, TJ = Junction Temperature.

1. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-2257A