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PIC16F946T

8-Bit Flash MCU with LCD Driver

The PIC16F946T is a 8-bit flash mcu with lcd driver from Microchip Technology. View the full PIC16F946T datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

PIC16F946T shares its datasheet with PIC16F917, whose page lists every part number it covers.

Official PIC16F946T datasheet (PDF) — the source this page was extracted from.

Package

TQFP-64

PIC16F946T Key Specifications

ParameterValue
ADC10-bit, 8 channels
Timers2x 8-bit, 1x 16-bit
I/O Pins53 I/O plus 1 input-only
Comparators2 analog comparators with programmable voltage reference
Data Retention>40 years
Supply Voltage2.0V to 5.5V
Flash Endurance100,000 write cycles
Max Clock SpeedDC to 20 MHz (200 ns instruction cycle)
Standby Current<100 nA @ 2.0V typical
EEPROM Endurance1,000,000 write cycles
Operating Current11 µA @ 32 kHz, 2.0V; 220 µA @ 4 MHz, 2.0V typical
Data Memory (SRAM)336 bytes
Internal Oscillator8 MHz to 125 kHz software selectable, factory calibrated ±1% typical; 31 kHz internal oscillator
LCD Segment Drivers42 segments, four commons
Data Memory (EEPROM)256 bytes
Program Memory (Flash)8K words / 14 KB
Watchdog Timer Current1 µA @ 2.0V typical
Communication InterfacesAUSART, SSP (SPI/I2C)
Capture/Compare/PWM Modules2
Operating Temperature Range-40°C to +85°C (I), -40°C to +125°C (E)

PIC16F946T Overview

Part: PIC16F917 — Microchip Technology (PIC16F913/914/916/917/946 family)

Type: 8-Bit Flash CMOS Microcontroller with LCD Driver

Description: 8-bit PIC16 RISC MCU with 8K words (14 KB) Flash, 352 bytes SRAM, 256 bytes EEPROM, up to 20 MHz clock, 2.0–5.5 V operation, a 24-segment LCD driver and nanoWatt low-power technology.

Operating Conditions:

  • Supply voltage: 2.0–5.5 V
  • Operating temperature: -40 to +125 °C (industrial and extended ranges)
  • Clock: DC – 20 MHz (200 ns instruction cycle)
  • Internal oscillator: 8 MHz to 125 kHz, factory calibrated to ±1% typical

Absolute Maximum Ratings:

  • Max supply voltage (VDD to VSS): -0.3 to +6.5 V
  • MCLR voltage: -0.3 to +13.5 V
  • Voltage on other pins: -0.3 V to VDD + 0.3 V
  • Max current into VDD pin: 95 mA
  • Max current out of VSS pin: 95 mA
  • Max current per I/O pin: 25 mA sink or source
  • Max current, all ports combined: 90 mA sink or 90 mA source
  • Total power dissipation: 800 mW
  • Storage temperature: -65 to +150 °C
  • Ambient temperature under bias: -40 to +125 °C

Key Specs:

  • Standby current: <100 nA typical at 2.0 V
  • Operating current: 11 μA typical at 32 kHz, 2.0 V
  • Operating current: 220 μA typical at 4 MHz, 2.0 V
  • Watchdog Timer current: 1 μA typical at 2.0 V
  • Memory: 8K words Flash, 352 B SRAM, 256 B EEPROM
  • I/O: 35 pins
  • ADC: 10-bit, 8 channels
  • LCD: 24 segment drivers, four commons
  • Flash endurance 100,000 writes; EEPROM endurance 1,000,000 writes; retention >40 years

Features:

  • 35-instruction RISC CPU, single-cycle except branches
  • 8-level hardware stack
  • Precision internal oscillator with Two-Speed Start-up, fail-safe clock monitor and clock switching
  • 31 kHz internal oscillator
  • POR, PWRT, OST, BOR and enhanced low-current WDT
  • Two analog comparators with programmable voltage reference
  • 2 CCP modules (16-bit capture, 16-bit compare, 10-bit PWM)
  • AUSART and SSP with I²C
  • Timer0 (8-bit), Timer1 (16-bit), Timer2 (8-bit)
  • High-current I/O for direct LED drive, interrupt-on-change, weak pull-ups
  • ICSP via two pins
  • Programmable code protection

Applications:

  • LCD-based low-power embedded products

Package:

  • 40-pin (PIC16F914/917)
  • 44-pin TQFP
  • 44-pin QFN

PIC16F946T Features

  • Precision Internal Oscillator:
  • -Factory calibrated to ±1%, typical
  • -Software selectable frequency range of 8 MHz to 125 kHz
  • -Software tunable
  • -Two-Speed Start-up mode
  • -External Oscillator fail detect for critical applications
  • -Clock mode switching during operation for power savings
  • Software selectable 31 kHz internal oscillator
  • Power-Saving Sleep mode
  • Wide operating voltage range (2.0V-5.5V)
  • Industrial and Extended temperature range
  • Power-on Reset (POR)
  • Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
  • Brown-out Reset (BOR) with software control option
  • Enhanced Low-Current Watchdog Timer (WDT) with on-chip oscillator (software selectable nominal 268 seconds with full prescaler) with software enable
  • Multiplexed Master Clear with pull-up/input pin
  • Programmable code protection
  • High-Endurance Flash/EEPROM cell:
  • -100,000 write Flash endurance
  • -1,000,000 write EEPROM endurance
  • -Flash/Data EEPROM retention: > 40 years

PIC16F946T Pin Configuration

Each PORTA pin is multiplexed with other functions. The pins and their combined functions are briefly described here. For specific information about individual functions, refer to the appropriate section in this data sheet.

PIC16F946T Electrical Characteristics

DC CHARACTERISTICS - Param No.DC CHARACTERISTICS - Sym.DC CHARACTERISTICS - CharacteristicStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended - Min.Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended - Typ†Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended - Max.Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended - UnitsStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended - Conditions
D001 D001C D001DVDDSupply Voltage2.0 2.0 3.0 4.5- - - -5.5 5.5 5.5 5.5V V V VFOSC < = 8 MHz: HFINTOSC, EC FOSC < = 4 MHz FOSC < = 10 MHz FOSC < = 20 MHz
D002*VDRRAM Data Retention Voltage (1)1.5--VDevice in Sleep mode
D003VPORVDD Start Voltage to ensure internal Power-on Reset signal-VSS-VSee Section 16.2.1 'Power-on Reset (POR)' for details.
D004*SVDDVDD Rise Rate to ensure internal Power-on Reset signal0.05--V/msSee Section 16.2.1 'Power-on Reset (POR)' for details.

Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.

PIC16F946T Absolute Maximum Ratings

Ambient temperature under bias..........................................................................................................-40°to +125°C
Storage temperature ........................................................................................................................-65°C to +150°C
Voltage on VDD with respect to VSS ...................................................................................................-0.3V to +6.5V
Voltage on MCLR with respect to Vss ...............................................................................................-0.3V to +13.5V
Voltage on all other pins with respect to VSS ........................................................................... -0.3V to(VDD + 0.3V)
Total power dissipation (1) ...............................................................................................................................800mW
Maximum current out of VSS pin .......................................................................................................................95mA
Maximum current into VDD pin ..........................................................................................................................95mA
Input clamp current, I IK (VI < 0 or VI > VDD) ................................................................................................................±20 mA
Output clamp current, IOK (Vo < 0 or Vo >VDD) ..........................................................................................................±20 mA
Maximum output current sunk by any I/O pin....................................................................................................25mA
Maximum output current sourced by any I/O pin ..............................................................................................25mA
Maximum current sourced by all ports (combined) ...........................................................................................90mA
Maximum current sunk by all ports (combined) ................................................................................................90mA

Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD -∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑ (VOL x IOL). 2: PORTD and PORTE are not implemented in PIC16F913/916 devices.

† NOTICE: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

FIGURE 19-1: PIC16F913/914/916/917/946 VOLTAGE-FREQUENCY GRAPH, -40°C ≤ TA ≤ +125°C

PIC16F946T Thermal Information

Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C - Param No.Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C - SymbolStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C - CharacteristicStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C - Typ.Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C - UnitsStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C - Conditions
TH01θ JAThermal Resistance Junction to Ambient60.0°C/W28-pin PDIP package
TH01θ JAThermal Resistance Junction to Ambient80.0°C/W28-pin SOIC package
TH01θ JAThermal Resistance Junction to Ambient90.0°C/W28-pin SSOP package
TH01θ JAThermal Resistance Junction to Ambient27.5°C/W28-pin QFN 6x6 mm package
TH01θ JAThermal Resistance Junction to Ambient47.2°C/W40-pin PDIP package
TH01θ JAThermal Resistance Junction to Ambient46.0°C/W44-pin TQFP package
TH01θ JAThermal Resistance Junction to Ambient24.4°C/W44-pin QFN 8x8 mm package
TH01θ JAThermal Resistance Junction to Ambient77.0°C/W64-pin TQFP package
TH02θ JCThermal Resistance Junction to Case31.4°C/W28-pin PDIP package
TH02θ JCThermal Resistance Junction to Case24.0°C/W28-pin SOIC package
TH02θ JCThermal Resistance Junction to Case24.0°C/W28-pin SSOP package
TH02θ JCThermal Resistance Junction to Case20.0°C/W28-pin QFN 6x6 mm package
TH02θ JCThermal Resistance Junction to Case24.7°C/W40-pin PDIP package
TH02θ JCThermal Resistance Junction to Case14.5°C/W44-pin TQFP package
TH02θ JCThermal Resistance Junction to Case20.0°C/W44-pin QFN 8x8 mm package
TH02θ JCThermal Resistance Junction to Case24.4°C/W64-pin TQFP package
TH03TJJunction Temperature150°CFor derated power calculations
TH04PDPower Dissipation-WPD = PINTERNAL + PI/O
TH05PINTERNALInternal Power Dissipation-WPINTERNAL = IDD x VDD (NOTE 1)
TH06PI/OI/O Power Dissipation-WPI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
TH07PDERDerated Power-WPDER = (TJ - TA)/ θ JA (NOTE 2, 3)

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
PIC16Microchip Technology—
PIC16FMicrochip TechnologyPDIP
PIC16F676Microchip Technology—
PIC16F87XAMicrochip Technology—
PIC16F913Microchip Technology—
PIC16F913/914Microchip Technology—
PIC16F913/914/916/917Microchip Technology—
PIC16F913/916Microchip Technology—
PIC16F913TMicrochip Technology—
PIC16F914Microchip Technology—
PIC16F914/917Microchip Technology—
PIC16F914TMicrochip Technology—
PIC16F916Microchip Technology—
PIC16F916/917Microchip Technology—
PIC16F916/917/946Microchip Technology—
PIC16F916TMicrochip Technology—
PIC16F917Microchip Technology—
PIC16F917TMicrochip Technology—
PIC16F91X/946Microchip Technology—
PIC16F91X/946-ICDMicrochip Technology—
PIC16F946Microchip Technology—

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