MAX78000EXG+

Part: MAX78000EXG+ — Maxim Integrated Type: Artificial Intelligence Microcontroller Description: An ultra-low-power AI microcontroller featuring an Arm Cortex-M4 with FPU up to 100MHz, a 32-bit RISC-V coprocessor up to 60MHz, 512KB Flash, 128KB SRAM, and a hardware-based convolutional neural network (CNN) accelerator with 442KB weight storage and 512KB data memory.

Operating Conditions:

• SIMO Supply Voltage Range: 2.0V to 3.6V
• Operating temperature: -40°C to +105°C
• Arm Cortex-M4 Processor: up to 100MHz
• RISC-V Coprocessor: up to 60MHz

Absolute Maximum Ratings:

• Max supply voltage (V DDIO, V DDIOH, V REGI): +3.6V
• Max supply voltage (V DDA): +1.89V
• Max continuous current (V DDIO Combined Pins sink): 100mA
• Max continuous current (V DDIOH Combined Pins sink): 100mA
• Max continuous current (V SS): 200mA
• Max continuous current (V SSPWR): 100mA
• Max output current (any GPIO Pin sink): 25mA
• Max output current (any GPIO Pin source): -25mA
• Max storage temperature: +150°C

Key Specs:

• Core Input Supply Voltage A (V COREA): 0.9V to 1.21V (rising)
• Core Input Supply Voltage B (V COREB): 0.9V to 1.21V (rising)
• Input Supply Voltage, Battery (V REGI): 2.45V to 3.6V (rising)
• Input Supply Voltage, Analog (V DDA): 1.71V to 1.89V
• Input Supply Voltage, GPIO (V DDIO): 1.71V to 1.89V
• Input Supply Voltage, GPIO (High) (V DDIOH): 1.71V to 3.6V
• CNN Weight Storage Memory: 442KB
• CNN Data Memory: 512KB
• Flash Memory: 512KB
• SRAM: 128KB

Features:

• Dual Core Ultra-Low-Power Microcontroller
• Arm Cortex-M4 Processor with FPU
• 32-Bit RISC-V Coprocessor
• Neural Network Accelerator highly optimized for Deep Convolutional Neural Networks
• Integrated Single-Inductor Multiple-Output (SIMO) Switch-Mode Power Supply (SMPS)
• Dynamic Voltage Scaling Minimizes Active Core Power Consumption
• Available Secure Boot
• AES 128/192/256 Hardware Acceleration Engine
• True Random Number Generator (TRNG) Seed Generator

Applications:

• Object Detection and Classification
• Audio Processing: Multi-Keyword Recognition, Sound Classification, Noise Cancellation
• Facial Recognition
• Time-Series Data Processing: Heart Rate/Health Signal Analysis, Multi-Sensor Analysis, Predictive Maintenance

Package:

• 81-pin CTBGA (8mm x 8mm, 0.8mm pitch)

• Dual Core Ultra-Low-Power Microcontroller
• Arm Cortex-M4 Processor with FPU up to 100MHz
• 512KB Flash and 128KB SRAM
• Optimized Performance with 16KB Instruction Cache
• Optional Error Correction Code (ECC-SEC-DED) for SRAM
• 32-Bit RISC-V Coprocessor up to 60MHz
• Up to 52 General-Purpose I/O Pins
• 12-Bit Parallel Camera Interface
• One I 2 S Master/Slave for Digital Audio Interface
• Neural Network Accelerator
• Highly Optimized for Deep Convolutional Neural Networks
• 442k 8-Bit Weight Capacity with 1,2,4,8-Bit Weights
• Programmable Input Image Size up to 1024 x 1024 pixels
• Programmable Network Depth up to 64 Layers
• Programmable per Layer Network Channel Widths up to 1024 Channels
• 1 and 2 Dimensional Convolution Processing
• Streaming Mode
• Flexibility to Support Other Network Types, Including MLP and Recurrent Neural Networks
• Power Management Maximizes Operating Time for Battery Applications
• Integrated Single-Inductor Multiple-Output (SIMO) Switch-Mode Power Supply (SMPS)
• 2.0V to 3.6V SIMO Supply Voltage Range
• Dynamic Voltage Scaling Minimizes Active Core Power Consumption
• 22.2μA/MHz While Loop Execution at 3.0V from Cache (CM4 Only)
• Selectable SRAM Retention in Low-Power Modes with Real-Time Clock (RTC) Enabled
• Security and Integrity
• Available Secure Boot
• AES 128/192/256 Hardware Acceleration Engine
• True Random Number Generator (TRNG) Seed Generator

Ordering Information appears at end of data sheet.

Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

CoreMark is a registered trademark of the Embedded Microprocessor Benchmark Consortium.

Motorola is a registered trademark of Motorola Trademark Holdings, LLC.

PyTorch is a trademark of Facebook, Inc.

TensorFlow is a trademark of Google, Inc.

• Object Detection and Classification
• Audio Processing: Multi-Keyword Recognition, Sound Classification, Noise Cancellation
• Facial Recognition
• Time-Series Data Processing: Heart Rate/Health Signal Analysis, Multi-Sensor Analysis, Predictive Maintenance

(Limits are 100% tested at T A = +25°C and T A = +105°C. TYP specifications are provided for T A = +25°C. Limits over the operating temperature range and relevant supply voltage range are guaranteed by design and characterization. Specifications marked GBD are guaranteed by design and not production tested. Specifications to the minimum operating temperature are guaranteed by design and are not production tested. GPIO are only tested at T A = +105°C.)

• V DDIO .................................................................... -0.3V to +3.6V

• V DDIOH .................................................................. -0.3V to +3.6V

• V REGI .................................................................... -0.3V to +3.6V

• V DDA ................................................................... -0.3V to +1.89V

• GPIO (V DDIO )............................................ -0.3V to V DDIO + 0.5V

• RSTN, GPIO (V DDIOH )............................-0.3V to V DDIOH + 0.5V

• 32KIN, 32KOUT ......................................... -0.3V to V DDA + 0.2V

• V DDIO Combined Pins (sink).............................................100mA

• V DDIOH Combined Pins (sink)...........................................100mA

• V ..................................................................................100mA

• V SSPWR .............................................................................100mA

• Output Current (sink) by any GPIO Pin................................25mA

• Output Current (source) by any GPIO Pin ......................... -25mA

• Continuous Package Power Dissipation CTBGA (multilayer

• board) T A = +70°C (derate 29.81mW/°C above +70°C)........................................................................2384.50mW

• Operating Temperature Range...........................-40°C to +105°C

• Storage Temperature Range..............................-65°C to +150°C

• Soldering Temperature .....................................................+260°C

Stresses beyond those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.