ESP32-S3-MINI-1U-N8

Part: ESP32-S3-MINI-1 / ESP32-S3-MINI-1U — Espressif Type: Wi-Fi + Bluetooth LE MCU Module Description: Powerful, generic Wi-Fi (802.11 b/g/n) and Bluetooth LE (Bluetooth 5) MCU modules built around an Xtensa dual-core 32-bit LX7 microprocessor operating up to 240 MHz, featuring up to 8 MB Flash, optional 2 MB PSRAM, and a rich set of peripherals for IoT applications.

Operating Conditions:

• Supply voltage: 3.0–3.6 V
• Operating ambient temperature: -40 to 85 °C (85 °C version), -40 to 105 °C (105 °C version)
• CPU clock frequency: up to 240 MHz

Absolute Maximum Ratings:

• Max supply voltage: 3.6 V
• Max storage temperature: 105 °C

Key Specs:

• CPU: Xtensa dual-core 32-bit LX7 microprocessor
• ROM: 384 KB
• SRAM: 512 KB
• SRAM in RTC: 16 KB
• Flash: up to 8 MB Quad SPI
• PSRAM: 2 MB (optional, ESP32-S3FH4R2 only)
• Wi-Fi standard: 802.11 b/g/n
• Bluetooth LE speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
• High-level input current (I_IH): 50 nA (max)

Features:

• 2.4 GHz Wi-Fi (802.11 b/g/n)
• Bluetooth 5 (LE) and Bluetooth mesh
• Up to 39 GPIOs
• Rich set of peripherals: SPI, LCD, Camera interface, UART, I2C, I2S, remote control, pulse counter, LED PWM, USB 1.1 OTG, USB Serial/JTAG controller, MCPWM, SDIO host, GDMA, TWAI® controller (CAN Specification 2.0 compatible), ADC, touch sensor, temperature sensor, timers and watchdogs
• Internal co-existence mechanism for Wi-Fi and Bluetooth
• On-board PCB antenna (ESP32-S3-MINI-1) or external antenna connector (ESP32-S3-MINI-1U)
• 40 MHz crystal oscillator integrated

Applications:

• Generic Low-power IoT Sensor Hub
• Generic Low-power IoT Data Loggers
• Cameras for Video Streaming
• Over-the-top (OTT) Devices
• USB Devices
• Speech Recognition
• Image Recognition
• Mesh Network
• Home Automation
• Smart Building
• Industrial Automation
• Smart Agriculture
• Audio Applications
• Health Care Applications
• Wi-Fi-enabled Toys
• Wearable Electronics
• Retail & Catering Applications

Package:

• 15.4 × 20.5 × 2.4 mm (ESP32-S3-MINI-1 variants)
• 15.4 × 15.4 × 2.4 mm (ESP32-S3-MINI-1U variants)

• Generic Low-power IoT Sensor Hub

• Generic Low-power IoT Data Loggers

• Cameras for Video Streaming

• Over-the-top (OTT) Devices

• USB Devices

• Speech Recognition

• Image Recognition

• Mesh Network

• Home Automation

• Smart Building

• Industrial Automation

• Smart Agriculture

• Audio Applications

• Health Care Applications

• Wi-Fi-enabled Toys

• Wearable Electronics

• Retail & Catering Applications

The module has 65 pins. See pin definitions in Table 2.

For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to ESP32-S3 Series Datasheet .

Table 2: Pin Definitions

Name	No.	Type a	Function
GND	1, 2, 42, 43, 46-65	P	GND
3V3	3	P	Power supply
IO0	4	I/O/T	RTC_GPIO0, GPIO0
IO1	5	I/O/T	RTC_GPIO1, GPIO1 , TOUCH1, ADC1_CH0
IO2	6	I/O/T	RTC_GPIO2, GPIO2 , TOUCH2, ADC1_CH1
IO3	7	I/O/T	RTC_GPIO3, GPIO3 , TOUCH3, ADC1_CH2
IO4	8	I/O/T	RTC_GPIO4, GPIO4 , TOUCH4, ADC1_CH3
IO5	9	I/O/T	RTC_GPIO5, GPIO5 , TOUCH5, ADC1_CH4
IO6	10	I/O/T	RTC_GPIO6, GPIO6 , TOUCH6, ADC1_CH5
IO7	11	I/O/T	RTC_GPIO7, GPIO7 , TOUCH7, ADC1_CH6
IO8	12	I/O/T	RTC_GPIO8, GPIO8 , TOUCH8, ADC1_CH7, SUBSPICS1
IO9	13	I/O/T	RTC_GPIO9, GPIO9 , TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD
IO10	14	I/O/T	RTC_GPIO10, GPIO10 , TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4, SUBSPICS0
IO11	15	I/O/T	RTC_GPIO11, GPIO11 , TOUCH11, ADC2_CH0, FSPID, FSPIIO5, SUBSPID
IO12	16	I/O/T	RTC_GPIO12, GPIO12 , TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6, SUBSPICLK
IO13	17	I/O/T	RTC_GPIO13, GPIO13 , TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7, SUBSPIQ
IO14	18	I/O/T	RTC_GPIO14, GPIO14 , TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS, SUBSPIWP
IO15	19	I/O/T	RTC_GPIO15, GPIO15 , U0RTS, ADC2_CH4, XTAL_32K_P
IO16	20	I/O/T	RTC_GPIO16, GPIO16 , U0CTS, ADC2_CH5, XTAL_32K_N
IO17	21	I/O/T	RTC_GPIO17, GPIO17 , U1TXD, ADC2_CH6
IO18	22	I/O/T	RTC_GPIO18, GPIO18 , U1RXD, ADC2_CH7, CLK_OUT3
IO19	23	I/O/T	RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D­
IO20	24	I/O/T	RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO21	25	I/O/T	RTC_GPIO21, GPIO21
IO26 b	26	I/O/T	SPICS1, GPIO26
IO47	27	I/O/T	SPICLK_P_DIFF, GPIO47 , SUBSPICLK_P_DIFF
IO33	28	I/O/T	SPIIO4, GPIO33 , FSPIHD, SUBSPIHD
IO34	29	I/O/T	SPIIO5, GPIO34 , FSPICS0, SUBSPICS0
IO48	30	I/O/T	SPICLK_N_DIFF, GPIO48 , SUBSPICLK_N_DIFF
IO35	31	I/O/T	SPIIO6, GPIO35 , FSPID, SUBSPID
IO36	32	I/O/T	SPIIO7, GPIO36 , FSPICLK, SUBSPICLK

Cont'd on next page

Table 2: Pin Definitions

Table 2 - cont'd from previous page

Name	No.	Type a	Function
IO37	33	I/O/T	SPIDQS, GPIO37 , FSPIQ, SUBSPIQ
IO38	34	I/O/T	GPIO38 , FSPIWP, SUBSPIWP
IO39	35	I/O/T	MTCK , GPIO39, CLK_OUT3, SUBSPICS1
IO40	36	I/O/T	MTDO , GPIO40, CLK_OUT2
IO41	37	I/O/T	MTDI , GPIO41, CLK_OUT1
IO42	38	I/O/T	MTMS , GPIO42
TXD0	39	I/O/T	U0TXD , GPIO43, CLK_OUT1
RXD0	40	I/O/T	U0RXD , GPIO44, CLK_OUT2
IO45	41	I/O/T	GPIO45
IO46	44	I/O/T	GPIO46
EN	45	I	High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating.

Table 9: DC Characteristics (3.3 V, 25 °C)

Symbol	Parameter	Min	Typ	Max	Unit
C IN	Pin capacitance	-	2	-	pF
V IH	High-level input voltage	0.75 × VDD 1	-	VDD 1 + 0.3	V
V IL	Low-level input voltage	-0.3	-	0.25 × VDD 1	V
I IH	High-level input current	-	-	50	nA
I IL	Low-level input current	-	-	50	nA
V OH 2	High-level output voltage	0.8 × VDD 1	-	-	V
V OL 2	Low-level output voltage	-	-	0.1 × VDD 1	V
I OH	High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3)	-	40	-	mA
I OL	Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3)	-	28	-	mA
R PU	Internal weak pull-up resistor	-	45	-	k Ω
R PD	Internal weak pull-down resistor	-	45	-	k Ω
V IH _ nRST	Chip reset release voltage (EN voltage is within the specified range)	0.75 × VDD 1	-	VDD 1 + 0.3	V

Cont'd on next page

Table 9 - cont'd from previous page

Symbol	Parameter	Min	Typ	Max	Unit
V IL _ nRST	Chip reset voltage (EN voltage is within the specified range)	-0.3	-	0.25 × VDD 1	V

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 7: Absolute Maximum Ratings

Symbol	Parameter	Min	Max	Unit
VDD33	Power supply voltage	-0.3	3.6	V
T STORE	Storage temperature	-40	105	°C

Table 8: Recommended Operating Conditions

Symbol	Parameter		Min Typ	Max		Unit
VDD33	Power supply voltage	Power supply voltage	3	3.3	3.6	V
I VDD	Current delivered by external power supply	Current delivered by external power supply	0.5	-	-	A
T A	Operating ambient temperature	85 °C version 105 °C version	-40	-	85 105	°C

Figure 10: ESP32­S3­MINI­1 Recommended PCB Land Pattern

Figure 10: ESP32­S3­MINI­1 Recommended PCB Land Pattern

Figure 11: ESP32­S3­MINI­1U Recommended PCB Land Pattern