Part: ESP32-S3-MINI-1 / ESP32-S3-MINI-1U — Espressif Type: Wi-Fi + Bluetooth LE MCU Module Description: Powerful, generic Wi-Fi (802.11 b/g/n) and Bluetooth LE (Bluetooth 5) MCU modules built around an Xtensa dual-core 32-bit LX7 microprocessor operating up to 240 MHz, featuring up to 8 MB Flash, optional 2 MB PSRAM, and a rich set of peripherals for IoT applications.

Operating Conditions:

• Supply voltage: 3.0–3.6 V
• Operating ambient temperature: -40 to 85 °C (85 °C version), -40 to 105 °C (105 °C version)
• CPU clock frequency: up to 240 MHz

Absolute Maximum Ratings:

• Max supply voltage: 3.6 V
• Max storage temperature: 105 °C

Key Specs:

• CPU: Xtensa dual-core 32-bit LX7 microprocessor
• ROM: 384 KB
• SRAM: 512 KB
• SRAM in RTC: 16 KB
• Flash: up to 8 MB Quad SPI
• PSRAM: 2 MB (optional, ESP32-S3FH4R2 only)
• Wi-Fi standard: 802.11 b/g/n
• Bluetooth LE speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
• High-level input current (I_IH): 50 nA (max)

Features:

• 2.4 GHz Wi-Fi (802.11 b/g/n)
• Bluetooth 5 (LE) and Bluetooth mesh
• Up to 39 GPIOs
• Rich set of peripherals: SPI, LCD, Camera interface, UART, I2C, I2S, remote control, pulse counter, LED PWM, USB 1.1 OTG, USB Serial/JTAG controller, MCPWM, SDIO host, GDMA, TWAI® controller (CAN Specification 2.0 compatible), ADC, touch sensor, temperature sensor, timers and watchdogs
• Internal co-existence mechanism for Wi-Fi and Bluetooth
• On-board PCB antenna (ESP32-S3-MINI-1) or external antenna connector (ESP32-S3-MINI-1U)
• 40 MHz crystal oscillator integrated

Applications:

• Generic Low-power IoT Sensor Hub
• Generic Low-power IoT Data Loggers
• Cameras for Video Streaming
• Over-the-top (OTT) Devices
• USB Devices
• Speech Recognition
• Image Recognition
• Mesh Network
• Home Automation
• Smart Building
• Industrial Automation
• Smart Agriculture
• Audio Applications
• Health Care Applications
• Wi-Fi-enabled Toys
• Wearable Electronics
• Retail & Catering Applications

Package:

• 15.4 × 20.5 × 2.4 mm (ESP32-S3-MINI-1 variants)
• 15.4 × 15.4 × 2.4 mm (ESP32-S3-MINI-1U variants)

• Generic Low-power IoT Sensor Hub

• Generic Low-power IoT Data Loggers

• Cameras for Video Streaming

• Over-the-top (OTT) Devices

• USB Devices

• Speech Recognition

• Image Recognition

• Mesh Network

• Home Automation

• Smart Building

• Industrial Automation

• Smart Agriculture

• Audio Applications

• Health Care Applications

• Wi-Fi-enabled Toys

• Wearable Electronics

• Retail & Catering Applications

ESP32-S3-MINI-1 Pinout

Package: 65-pin module

Pin Number	Pin Name	Type	Function
1	GND	P	Ground
2	GND	P	Ground
3	3V3	P	Power supply (3.3V)
4	IO0	I/O/T	RTC_GPIO0, GPIO0
5	IO1	I/O/T	RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
6	IO2	I/O/T	RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
7	IO3	I/O/T	RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
8	IO4	I/O/T	RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
9	IO5	I/O/T	RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
10	IO6	I/O/T	RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5
11	IO7	I/O/T	RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
12	IO8	I/O/T	RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1
13	IO9	I/O/T	RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD
14	IO10	I/O/T	RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4, SUBSPICS0
15	IO11	I/O/T	RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5, SUBSPID
16	IO12	I/O/T	RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6, SUBSPICLK
17	IO13	I/O/T	RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7, SUBSPIQ
18	IO14	I/O/T	RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS, SUBSPIWP
19	IO15	I/O/T	RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
20	IO16	I/O/T	RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
21	IO17	I/O/T	RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6
22	IO18	I/O/T	RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3
23	IO19	I/O/T	RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D−
24	IO20	I/O/T	RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
25	IO21	I/O/T	RTC_GPIO21, GPIO21
26	IO26	I/O/T	SPICS1, GPIO26
27	IO47	I/O/T	SPICLK_P_DIFF, GPIO47, SUBSPICLK_P_DIFF
28	IO33	I/O/T	SPIIO4, GPIO33, FSPIHD, SUBSPIHD
29	IO34	I/O/T	SPIIO5, GPIO34, FSPICS0, SUBSPICS0
30	IO48	I/O/T	SPICLK_N_DIFF, GPIO48, SUBSPICLK_N_DIFF
31	IO35	I/O/T	SPIIO6, GPIO35, FSPID, SUBSPID
32	IO36	I/O/T	SPIIO7, GPIO36, FSPICLK, SUBSPICLK
33	IO37	I/O/T	SPIDQS, GPIO37, FSPIQ, SUBSPIQ
34	IO38	I/O/T	GPIO38, FSPIWP, SUBSPIWP
35	IO39	I/O/T	MTCK, GPIO39, CLK_OUT3, SUBSPICS1
36	IO40	I/O/T	MTDO, GPIO40, CLK_OUT2
37	IO41	I/O/T	MTDI, GPIO41, CLK_OUT1
38	IO42	I/O/T	MTMS, GPIO42
39	TXD0	I/O/T	U0TXD, GPIO43, CLK_OUT1
40	RXD0	I/O/T	U0RXD, GPIO44, CLK_OUT2
41	IO45	I/O/T	GPIO45
42	GND	P	Ground
43	GND	P	Ground
44	IO46	I/O/T	GPIO46
45	EN	I	Chip enable (High: on; Low: off). Do not leave floating.
46–65	GND	P	Ground

Notes

• Type abbreviations: P = Power, I/O/T = Input/Output/Tri-state capable
• EN pin (45): Critical control pin; must not be left floating. Pull high to enable the chip.
• USB pins (IO19, IO20): GPIO19 and GPIO20 support USB_D− and USB_D+ functions respectively.
• 32 kHz crystal pins (IO15, IO16): GPIO15 and GPIO16 support XTAL_32K_P and XTAL_32K_N for optional 32 kHz oscillator.
• JTAG pins (IO39–IO42): GPIO39–GPIO42 support MTCK, MTDO, MTDI, MTMS for JTAG debugging.
• SPI pins: Multiple GPIO pins support both main SPI (FSPI) and subsystem SPI (SUBSPI) interfaces.
• ADC pins: IO1–IO10 support ADC1 channels; IO11–IO20 support ADC2 channels.
• Touch-capable pins: IO1–IO14 support capacitive touch sensing.

Table 9: DC Characteristics (3.3 V, 25 °C)

Symbol	Parameter	Min	Typ	Max	Unit
C IN	Pin capacitance	-	2	-	pF
V IH	High-level input voltage	0.75 × VDD 1	-	VDD 1 + 0.3	V
V IL	Low-level input voltage	-0.3	-	0.25 × VDD 1	V
I IH	High-level input current	-	-	50	nA
I IL	Low-level input current	-	-	50	nA
V OH 2	High-level output voltage	0.8 × VDD 1	-	-	V
V OL 2	Low-level output voltage	-	-	0.1 × VDD 1	V
I OH	High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3)	-	40	-	mA
I OL	Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3)	-	28	-	mA
R PU	Internal weak pull-up resistor	-	45	-	k Ω
R PD	Internal weak pull-down resistor	-	45	-	k Ω
V IH _ nRST	Chip reset release voltage (EN voltage is within the specified range)	0.75 × VDD 1	-	VDD 1 + 0.3	V

Cont'd on next page

Table 9 - cont'd from previous page

Symbol	Parameter	Min	Typ	Max	Unit
V IL _ nRST	Chip reset voltage (EN voltage is within the specified range)	-0.3	-	0.25 × VDD 1	V

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 7: Absolute Maximum Ratings

Symbol	Parameter	Min	Max	Unit
VDD33	Power supply voltage	-0.3	3.6	V
T STORE	Storage temperature	-40	105	°C

Table 8: Recommended Operating Conditions

Symbol	Parameter		Min Typ	Max		Unit
VDD33	Power supply voltage	Power supply voltage	3	3.3	3.6	V
I VDD	Current delivered by external power supply	Current delivered by external power supply	0.5	-	-	A
T A	Operating ambient temperature	85 °C version 105 °C version	-40	-	85 105	°C

Figure 10: ESP32­S3­MINI­1 Recommended PCB Land Pattern

Figure 10: ESP32­S3­MINI­1 Recommended PCB Land Pattern

Figure 11: ESP32­S3­MINI­1U Recommended PCB Land Pattern

MPN	Package	Temperature Range	Packing
ESP32-S3-MINI-1-N8	Module (15.4 x 20.5 x 2.4 mm)	-40 ~ 85 °C	null
ESP32-S3-MINI-1-N4R2	Module (15.4 x 20.5 x 2.4 mm)	-40 ~ 85 °C	null
ESP32-S3-MINI-1-H4R2	Module (15.4 x 20.5 x 2.4 mm)	-40 ~ 105 °C	null
ESP32-S3-MINI-1U-N8	Module (15.4 x 15.4 x 2.4 mm)	-40 ~ 85 °C	null
ESP32-S3-MINI-1U-N4R2	Module (15.4 x 15.4 x 2.4 mm)	-40 ~ 85 °C	null
ESP32-S3-MINI-1U-H4R2	Module (15.4 x 15.4 x 2.4 mm)	-40 ~ 105 °C	null