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ESP32-S3-MINI-1

Wi-Fi + Bluetooth LE MCU Module

The ESP32-S3-MINI-1 is a wi-fi + bluetooth le mcu module from Espressif Systems. View the full ESP32-S3-MINI-1 datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.

Official ESP32-S3-MINI-1 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Espressif Systems

Package

Module (15.4 x 20.5 x 2.4 mm), Module (15.4 x 15.4 x 2.4 mm)

ESP32-S3-MINI-1 Key Specifications

ParameterValue
CPUXtensa dual-core 32-bit LX7 microprocessor
ROM384 KB
SRAM512 KB
SRAM in RTC16 KB
Flashup to 8 MB Quad SPI
PSRAM2 MB (optional, ESP32-S3FH4R2 only)
Wi-Fi standard802.11 b/g/n
Bluetooth LE speed125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
High-level input current (I_IH)50 nA (max)

ESP32-S3-MINI-1 Overview

Part: ESP32-S3-MINI-1 / ESP32-S3-MINI-1U — Espressif Type: Wi-Fi + Bluetooth LE MCU Module Description: Powerful, generic Wi-Fi (802.11 b/g/n) and Bluetooth LE (Bluetooth 5) MCU modules built around an Xtensa dual-core 32-bit LX7 microprocessor operating up to 240 MHz, featuring up to 8 MB Flash, optional 2 MB PSRAM, and a rich set of peripherals for IoT applications.

Operating Conditions:

  • Supply voltage: 3.0–3.6 V
  • Operating ambient temperature: -40 to 85 °C (85 °C version), -40 to 105 °C (105 °C version)
  • CPU clock frequency: up to 240 MHz

Absolute Maximum Ratings:

  • Max supply voltage: 3.6 V
  • Max storage temperature: 105 °C

Key Specs:

  • CPU: Xtensa dual-core 32-bit LX7 microprocessor
  • ROM: 384 KB
  • SRAM: 512 KB
  • SRAM in RTC: 16 KB
  • Flash: up to 8 MB Quad SPI
  • PSRAM: 2 MB (optional, ESP32-S3FH4R2 only)
  • Wi-Fi standard: 802.11 b/g/n
  • Bluetooth LE speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
  • High-level input current (I_IH): 50 nA (max)

Features:

  • 2.4 GHz Wi-Fi (802.11 b/g/n)
  • Bluetooth 5 (LE) and Bluetooth mesh
  • Up to 39 GPIOs
  • Rich set of peripherals: SPI, LCD, Camera interface, UART, I2C, I2S, remote control, pulse counter, LED PWM, USB 1.1 OTG, USB Serial/JTAG controller, MCPWM, SDIO host, GDMA, TWAI® controller (CAN Specification 2.0 compatible), ADC, touch sensor, temperature sensor, timers and watchdogs
  • Internal co-existence mechanism for Wi-Fi and Bluetooth
  • On-board PCB antenna (ESP32-S3-MINI-1) or external antenna connector (ESP32-S3-MINI-1U)
  • 40 MHz crystal oscillator integrated

Applications:

  • Generic Low-power IoT Sensor Hub
  • Generic Low-power IoT Data Loggers
  • Cameras for Video Streaming
  • Over-the-top (OTT) Devices
  • USB Devices
  • Speech Recognition
  • Image Recognition
  • Mesh Network
  • Home Automation
  • Smart Building
  • Industrial Automation
  • Smart Agriculture
  • Audio Applications
  • Health Care Applications
  • Wi-Fi-enabled Toys
  • Wearable Electronics
  • Retail & Catering Applications

Package:

  • 15.4 × 20.5 × 2.4 mm (ESP32-S3-MINI-1 variants)
  • 15.4 × 15.4 × 2.4 mm (ESP32-S3-MINI-1U variants)

ESP32-S3-MINI-1 Applications

  • Generic Low-power IoT Sensor Hub

  • Generic Low-power IoT Data Loggers

  • Cameras for Video Streaming

  • Over-the-top (OTT) Devices

  • USB Devices

  • Speech Recognition

  • Image Recognition

  • Mesh Network

  • Home Automation

  • Smart Building

  • Industrial Automation

  • Smart Agriculture

  • Audio Applications

  • Health Care Applications

  • Wi-Fi-enabled Toys

  • Wearable Electronics

  • Retail & Catering Applications

ESP32-S3-MINI-1 Pin Configuration

ESP32-S3-MINI-1 Pinout

Package: Module (15.4 × 20.5 × 2.4 mm), 65 pins

PinNameTypeFunction
1GNDPGround
2GNDPGround
33V3PPower supply (3.3V)
4IO0I/O/TRTC_GPIO0, GPIO0
5IO1I/O/TRTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
6IO2I/O/TRTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
7IO3I/O/TRTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
8IO4I/O/TRTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
9IO5I/O/TRTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
10IO6I/O/TRTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5
11IO7I/O/TRTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
12IO8I/O/TRTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1
13IO9I/O/TRTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD
14IO10I/O/TRTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4, SUBSPICS0
15IO11I/O/TRTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5, SUBSPID
16IO12I/O/TRTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6, SUBSPICLK
17IO13I/O/TRTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7, SUBSPIQ
18IO14I/O/TRTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS, SUBSPIWP
19IO15I/O/TRTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
20IO16I/O/TRTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
21IO17I/O/TRTC_GPIO17, GPIO17, U1TXD, ADC2_CH6
22IO18I/O/TRTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3
23IO19I/O/TRTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D−
24IO20I/O/TRTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
25IO21I/O/TRTC_GPIO21, GPIO21
26IO26I/O/TSPICS1, GPIO26
27IO47I/O/TSPICLK_P_DIFF, GPIO47, SUBSPICLK_P_DIFF
28IO33I/O/TSPIIO4, GPIO33, FSPIHD, SUBSPIHD
29IO34I/O/TSPIIO5, GPIO34, FSPICS0, SUBSPICS0
30IO48I/O/TSPICLK_N_DIFF, GPIO48, SUBSPICLK_N_DIFF
31IO35I/O/TSPIIO6, GPIO35, FSPID, SUBSPID
32IO36I/O/TSPIIO7, GPIO36, FSPICLK, SUBSPICLK
33IO37I/O/TSPIDQS, GPIO37, FSPIQ, SUBSPIQ
34IO38I/O/TGPIO38, FSPIWP, SUBSPIWP
35IO39I/O/TMTCK, GPIO39, CLK_OUT3, SUBSPICS1
36IO40I/O/TMTDO, GPIO40, CLK_OUT2
37IO41I/O/TMTDI, GPIO41, CLK_OUT1
38IO42I/O/TMTMS, GPIO42
39TXD0I/O/TU0TXD, GPIO43, CLK_OUT1
40RXD0I/O/TU0RXD, GPIO44, CLK_OUT2
41IO45I/O/TGPIO45
42GNDPGround
43GNDPGround
44IO46I/O/TGPIO46
45ENIChip enable (High: on; Low: off). Do not leave floating.
46–65GNDPGround

Notes

  • Type legend: P = Power, I = Input, I/O = Input/Output, T = 3.3V tolerant
  • Pin 26 (IO26): Marked with superscript "b" in source; no additional constraint specified in provided text.
  • EN pin (45): Critical control pin; must not be left floating.
  • USB pins (IO19, IO20): GPIO19 and GPIO20 support USB_D− and USB_D+ respectively.
  • 32 kHz crystal pins (IO15, IO16): Support external 32 kHz oscillator (XTAL_32K_P/N).
  • All GPIO pins support 3.3V logic levels and are touch-capable where indicated (TOUCH0–TOUCH14).

ESP32-S3-MINI-1 Electrical Characteristics

Table 9: DC Characteristics (3.3 V, 25 °C)

SymbolParameterMinTypMaxUnit
C INPin capacitance-2-pF
V IHHigh-level input voltage0.75 × VDD 1-VDD 1 + 0.3V
V ILLow-level input voltage-0.3-0.25 × VDD 1V
I IHHigh-level input current--50nA
I ILLow-level input current--50nA
V OH 2High-level output voltage0.8 × VDD 1--V
V OL 2Low-level output voltage--0.1 × VDD 1V
I OHHigh-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3)-40-mA
I OLLow-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3)-28-mA
R PUInternal weak pull-up resistor-45-k Ω
R PDInternal weak pull-down resistor-45-k Ω
V IH _ nRSTChip reset release voltage (EN voltage is within the specified range)0.75 × VDD 1-VDD 1 + 0.3V

Cont'd on next page

Table 9 - cont'd from previous page

SymbolParameterMinTypMaxUnit
V IL _ nRSTChip reset voltage (EN voltage is within the specified range)-0.3-0.25 × VDD 1V

ESP32-S3-MINI-1 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 7: Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDD33Power supply voltage-0.33.6V
T STOREStorage temperature-40105°C

Table 8: Recommended Operating Conditions

SymbolParameterMin TypMaxUnit
VDD33Power supply voltagePower supply voltage33.33.6V
I VDDCurrent delivered by external power supplyCurrent delivered by external power supply0.5--A
T AOperating ambient temperature85 °C version 105 °C version-40-85 105°C

ESP32-S3-MINI-1 Package Information

Figure 10: ESP32­S3­MINI­1 Recommended PCB Land Pattern

Figure 10: ESP32­S3­MINI­1 Recommended PCB Land Pattern

Figure 11: ESP32­S3­MINI­1U Recommended PCB Land Pattern

ESP32-S3-MINI-1 Ordering Information

MPNPackageTemperature RangePacking
ESP32-S3-MINI-1-N8Module (15.4 x 20.5 x 2.4 mm)-40 ~ 85 °Cnull
ESP32-S3-MINI-1-N4R2Module (15.4 x 20.5 x 2.4 mm)-40 ~ 85 °Cnull
ESP32-S3-MINI-1-H4R2Module (15.4 x 20.5 x 2.4 mm)-40 ~ 105 °Cnull
ESP32-S3-MINI-1U-N8Module (15.4 x 15.4 x 2.4 mm)-40 ~ 85 °Cnull
ESP32-S3-MINI-1U-N4R2Module (15.4 x 15.4 x 2.4 mm)-40 ~ 85 °Cnull
ESP32-S3-MINI-1U-H4R2Module (15.4 x 15.4 x 2.4 mm)-40 ~ 105 °Cnull

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
ESP32Espressif SystemsESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm)
ESP32-SEspressif Systems—
ESP32-S2-MINI-2Espressif Systems—
ESP32-S2FH4Espressif SystemsQFN-56-EP(7x7)
ESP32-S3Espressif Systems56-VFQFN Exposed Pad
ESP32-S3-MINIEspressif Systems—
ESP32-S3-MINI-1-H4R2Espressif SystemsModule (15.4 x 20.5 x 2.4 mm)
ESP32-S3-MINI-1-N4R2Espressif Systems65-SMD Module
ESP32-S3-MINI-1-N8Espressif Systems41-SMD Module
ESP32-S3-MINI-1UEspressif Systems—
ESP32-S3-MINI-1U-H4R2Espressif SystemsModule (15.4 x 15.4 x 2.4 mm)
ESP32-S3-MINI-1U-N4R2Espressif SystemsModule (15.4 x 15.4 x 2.4 mm)
ESP32-S3-MINI-1U-N8Espressif Systems65-SMD Module
ESP32-S3FN8Espressif Systems56-VFQFN Exposed Pad
ESP32-S3R2Espressif SystemsQFN56
ESP32-S3R8Espressif Systems56-VFQFN Exposed Pad
ESP32-S3R8VEspressif SystemsQFN56

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