EFM32GG11
Microcontroller (MCU)The EFM32GG11 is a microcontroller (mcu) from Silicon Labs. View the full EFM32GG11 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Official EFM32GG11 datasheet (PDF) — the source this page was extracted from.
EFM32GG11 Key Specifications
| Parameter | Value |
|---|---|
| CPU | ARM Cortex-M4 with DSP and FPU |
| Max CPU frequency | 72 MHz |
| Flash memory | Up to 2048 kB (dual-bank with read-while-write) |
| RAM data memory | Up to 512 kB (256 kB with ECC) |
| Active Mode current (EM0) | 80 μA/MHz |
| Deep Sleep current (EM2) | 2.1 μA (16 kB RAM retention and RTCC running) |
| GPIO pins | Up to 144 (5 V tolerant on select pins) |
| ADC | 2x 12-bit 1 Msamples/s |
EFM32GG11 Overview
Part: EFM32GG11 Family — Silicon Labs Type: ARM Cortex-M4 Microcontroller Description: The EFM32 Giant Gecko Series 1 MCUs are energy-friendly microcontrollers featuring a 32-bit ARM Cortex-M4 CPU at up to 72 MHz, up to 2048 kB Flash, up to 512 kB RAM, and robust security with a cryptographic hardware engine.
Operating Conditions:
- Supply voltage: 1.8 V to 3.8 V
- Operating temperature: -40 to +125 °C (Extended grade)
- Max CPU frequency: 72 MHz
Absolute Maximum Ratings:
Key Specs:
- CPU: ARM Cortex-M4 with DSP and FPU
- Max CPU frequency: 72 MHz
- Flash memory: Up to 2048 kB (dual-bank with read-while-write)
- RAM data memory: Up to 512 kB (256 kB with ECC)
- Active Mode current (EM0): 80 μA/MHz
- Deep Sleep current (EM2): 2.1 μA (16 kB RAM retention and RTCC running)
- GPIO pins: Up to 144 (5 V tolerant on select pins)
- ADC: 2x 12-bit 1 Msamples/s
Features:
- Integrated DC-DC buck converter
- Octal/Quad-SPI memory interface with XIP
- SD/MMC/SDIO Host Controller
- 10/100 Ethernet MAC with 802.3az EEE, IEEE1588
- Dual CAN 2.0 Bus Controller
- Low-energy USB with Device and Host support
- Hardware cryptographic engine (AES, ECC, SHA, TRNG)
- Robust capacitive touch sense (up to 64 inputs)
- Integrated Low-energy LCD Controller (up to 8x36 segments)
- Backup Power Domain with RTCC and retention registers
Applications:
- Smart energy meters
- Industrial and factory automation
- Home automation and security
- Mid- and high-tier wearables
- IoT devices
Package:
- QFN64 (9x9 mm)
- TQFP64 (10x10 mm)
- TQFP100 (14x14 mm)
- BGA112 (10x10 mm)
- BGA120 (7x7 mm)
- BGA152 (8x8 mm)
- BGA192 (7x7mm)
EFM32GG11 Applications
- Smart energy meters
- Industrial and factory automation
- Home automation and security
- ARM Cortex-M4 at 72 MHz
- Ultra low energy operation
- 80 μA/MHz in Energy Mode 0 (EM0)
- 2.1 μA EM2 Deep Sleep current (RTCC running with state and RAM retention)
- Octal/Quad-SPI memory interface w/ XIP
- SD/MMC/SDIO Host Controller
- 10/100 Ethernet MAC with 802.3az EEE, IEEE1588
- Dual CAN 2.0 Bus Controller
- Crystal-free low-energy USB
- Hardware cryptographic engine supports AES, ECC, SHA, and TRNG
- Robust capacitive touch sense
- Footprint compatible with select EFM32 packages
- 5 V tolerant I/O
- Mid- and high-tier wearables
- IoT devices
EFM32GG11 Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
- Typical values are based on T AMB =25 °C and V DD = 3.3 V, by production test and/or technology characterization.
- Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise.
Refer to 4.1.2.1 General Operating Conditions for more details about operational supply and temperature limits.
EFM32GG11 Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Storage temperature range | T STG | -50 | - | 150 | °C | |
| Voltage on supply pins other than VREGI and VBUS | V DDMAX | -0.3 | - | 3.8 | V | |
| Voltage ramp rate on any supply pin | V DDRAMPMAX | - | - | 1 | V / μs | |
| DC voltage on any GPIO pin | V DIGPIN | 5V tolerant GPIO pins 1 2 3 | -0.3 | - | Min of 5.25 and IOVDD +2 | V |
| DC voltage on any GPIO pin | V DIGPIN | LCD pins 3 | -0.3 | - | Min of 3.8 and IOVDD +2 | V |
| DC voltage on any GPIO pin | V DIGPIN | Standard GPIO pins | -0.3 | - | IOVDD+0.3 | V |
| Total current into VDD power lines | I VDDMAX | Source | - | - | 200 | mA |
| Total current into VSS ground lines | I VSSMAX | Sink | - | - | 200 | mA |
| Current per I/O pin | I IOMAX | Sink | - | - | 50 | mA |
| Current per I/O pin | I IOMAX | Source | - | - | 50 | mA |
| Current for all I/O pins | I IOALLMAX | Sink | - | - | 200 | mA |
| Current for all I/O pins | I IOALLMAX | Source | - | - | 200 | mA |
| Junction temperature | T J | -G grade devices | -40 | - | 105 | °C |
| Junction temperature | T J | -I grade devices | -40 | - | 125 | °C |
| Voltage on regulator supply pins VREGI and VBUS | V VREGI | -0.3 | - | 5.5 | V |
- When a GPIO pin is routed to the analog module through the APORT, the maximum voltage = IOVDD.
- Valid for IOVDD in valid operating range or when IOVDD is undriven (high-Z). If IOVDD is connected to a low-impedance source below the valid operating range (e.g. IOVDD shorted to VSS), the pin voltage maximum is IOVDD + 0.3 V, to avoid exceeding the maximum IO current specifications.
- To operate above the IOVDD supply rail, over-voltage tolerance must be enabled according to the GPIO_Px_OVTDIS register. Pins with over-voltage tolerance disabled have the same limits as Standard GPIO.
EFM32GG11 Thermal Information
Table 4.3. Thermal Characteristics
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Thermal resistance, QFN64 Package | THETA JA_QFN64 | 4-Layer PCB, Air velocity = 0 m/s | - | 17.8 | - | °C/W |
| Thermal resistance, QFN64 Package | 4-Layer PCB, Air velocity = 1 m/s | - | 15.4 | - | °C/W | |
| Thermal resistance, QFN64 Package | 4-Layer PCB, Air velocity = 2 m/s | - | 13.8 | - | °C/W | |
| Thermal resistance, TQFP64 Package | THE- TA JA_TQFP64 | 4-Layer PCB, Air velocity = 0 m/s | - | 33.9 | - | °C/W |
| Thermal resistance, TQFP64 Package | 4-Layer PCB, Air velocity = 1 m/s | - | 32.1 | - | °C/W | |
| Thermal resistance, TQFP64 Package | 4-Layer PCB, Air velocity = 2 m/s | - | 30.1 | - | °C/W | |
| Thermal resistance, TQFP100 Package | THE- TA JA_TQFP100 | 4-Layer PCB, Air velocity = 0 m/s | - | 44.1 | - | °C/W |
| Thermal resistance, TQFP100 Package | 4-Layer PCB, Air velocity = 1 m/s | - | 37.7 | - | °C/W | |
| Thermal resistance, TQFP100 Package | 4-Layer PCB, Air velocity = 2 m/s | - | 35.5 | - | °C/W | |
| Thermal resistance, BGA112 Package | THE- TA JA_BGA112 | 4-Layer PCB, Air velocity = 0 m/s | - | 42 | - | °C/W |
| Thermal resistance, BGA112 Package | 4-Layer PCB, Air velocity = 1 m/s | - | 37 | - | °C/W | |
| Thermal resistance, BGA112 Package | 4-Layer PCB, Air velocity = 2 m/s | - | 35.3 | - | °C/W | |
| Thermal resistance, BGA120 Package | THE- TA JA_BGA120 | 4-Layer PCB, Air velocity = 0 m/s | - | 47.9 | - | °C/W |
| Thermal resistance, BGA120 Package | 4-Layer PCB, Air velocity = 1 m/s | - | 41.8 | - | °C/W | |
| Thermal resistance, BGA120 Package | 4-Layer PCB, Air velocity = 2 m/s | - | 39.6 | - | °C/W | |
| Thermal resistance, BGA152 Package | THE- TA JA_BGA152 | 4-Layer PCB, Air velocity = 0 m/s | - | 35.7 | - | °C/W |
| Thermal resistance, BGA152 Package | 4-Layer PCB, Air velocity = 1 m/s | - | 31 | - | °C/W | |
| Thermal resistance, BGA152 Package | 4-Layer PCB, Air velocity = 2 m/s | - | 29.5 | - | °C/W | |
| Thermal resistance, BGA192 Package | THE- TA JA_BGA192 | 4-Layer PCB, Air velocity = 0 m/s | - | 47.9 | - | °C/W |
| Thermal resistance, BGA192 Package | 4-Layer PCB, Air velocity = 1 m/s | - | 41.8 | - | °C/W | |
| Thermal resistance, BGA192 Package | 4-Layer PCB, Air velocity = 2 m/s | - | 39.6 | - | °C/W |
EFM32GG11 Package Information
Figure 6.1. BGA192 Package Drawing
Table 6.1. BGA192 Package Dimensions
| Dimension | Min | Typ | Max |
|---|---|---|---|
| A | 0.77 | 0.83 | 0.89 |
| A1 | 0.13 | 0.18 | 0.23 |
| A3 | 0.16 | 0.20 | 0.24 |
| A2 | 0.45 REF | 0.45 REF | 0.45 REF |
| D | 7.00 BSC | 7.00 BSC | 7.00 BSC |
| e | 0.40 BSC | 0.40 BSC | 0.40 BSC |
| E | 7.00 BSC | 7.00 BSC | 7.00 BSC |
| D1 | 6.00 BSC | 6.00 BSC | 6.00 BSC |
| E1 | 6.00 BSC | 6.00 BSC | 6.00 BSC |
| b | 0.20 | 0.25 | 0.30 |
| aaa | 0.10 | 0.10 | 0.10 |
| bbb | 0.10 | 0.10 | 0.10 |
| ddd | 0.08 | 0.08 | 0.08 |
| eee | 0.15 | 0.15 | 0.15 |
| fff | 0.05 | 0.05 | 0.05 |
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All dimensions shown are in millimeters (mm) unless otherwise noted.
-
Dimensioning and Tolerancing per ANSI Y14.5M-1994.
-
Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
Variants on the same datasheet
These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.
| Part Number | Manufacturer | Package |
|---|---|---|
| EFM32 | Silicon Labs | — |
More part numbers on this datasheet
Their pages show this same datasheet. Some are linked through their part family rather than checked part by part, so confirm the exact part in the ordering information.
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