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EFM32

32-bit ARM Cortex-M4 Microcontroller

The EFM32 is a 32-bit arm cortex-m4 microcontroller from Silicon Labs. View the full EFM32 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

EFM32 shares its datasheet with EFM32GG11, whose page lists every part number it covers.

Official EFM32 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Silicon Labs

Category

Microcontrollers (MCU)

EFM32 Key Specifications

ParameterValue
ADC2x 12-bit 1 Msamples/s
CPUARM Cortex-M4 with FPU and DSP, up to 72 MHz
DAC2x 12-bit 500 ksamples/s VDAC
RAMup to 512 kB
GPIOup to 144 pins
SecurityAES 128/256, ECC, SHA-1/SHA-2, TRNG
Flash Memoryup to 2048 kB
Supply Voltage1.8V to 3.8V
Integrated DC-DCBuck, 1.8V output, up to 200 mA load
Available PackagesQFN64, TQFP64, TQFP100, BGA112, BGA120, BGA152, BGA192
Active Current (EM0)80 µA/MHz
Operating Temperature-40°C to 85°C (ambient) / -40°C to 125°C (junction), by grade
Communication InterfacesUSB 2.0 device/host, 10/100 Ethernet MAC, 2x CAN 2.0, SD/MMC/SDIO, Octal/Quad-SPI, 6x USART, 2x UART, 2x LEUART, 3x I2C
Deep Sleep Current (EM2)2.1 µA (RTCC running, RAM retention)

EFM32 Overview

Part: EFM32GG11 Family — Silicon Labs Type: ARM Cortex-M4 Microcontroller Description: The EFM32 Giant Gecko Series 1 MCUs are energy-friendly microcontrollers featuring a 32-bit ARM Cortex-M4 CPU at up to 72 MHz, up to 2048 kB Flash, up to 512 kB RAM, and robust security with a cryptographic hardware engine.

Operating Conditions:

  • Supply voltage: 1.8 V to 3.8 V
  • Operating temperature: -40 to +125 °C (Extended grade)
  • Max CPU frequency: 72 MHz

Absolute Maximum Ratings:

Key Specs:

  • CPU: ARM Cortex-M4 with DSP and FPU
  • Max CPU frequency: 72 MHz
  • Flash memory: Up to 2048 kB (dual-bank with read-while-write)
  • RAM data memory: Up to 512 kB (256 kB with ECC)
  • Active Mode current (EM0): 80 μA/MHz
  • Deep Sleep current (EM2): 2.1 μA (16 kB RAM retention and RTCC running)
  • GPIO pins: Up to 144 (5 V tolerant on select pins)
  • ADC: 2x 12-bit 1 Msamples/s

Features:

  • Integrated DC-DC buck converter
  • Octal/Quad-SPI memory interface with XIP
  • SD/MMC/SDIO Host Controller
  • 10/100 Ethernet MAC with 802.3az EEE, IEEE1588
  • Dual CAN 2.0 Bus Controller
  • Low-energy USB with Device and Host support
  • Hardware cryptographic engine (AES, ECC, SHA, TRNG)
  • Robust capacitive touch sense (up to 64 inputs)
  • Integrated Low-energy LCD Controller (up to 8x36 segments)
  • Backup Power Domain with RTCC and retention registers

Applications:

  • Smart energy meters
  • Industrial and factory automation
  • Home automation and security
  • Mid- and high-tier wearables
  • IoT devices

Package:

  • QFN64 (9x9 mm)
  • TQFP64 (10x10 mm)
  • TQFP100 (14x14 mm)
  • BGA112 (10x10 mm)
  • BGA120 (7x7 mm)
  • BGA152 (8x8 mm)
  • BGA192 (7x7mm)

EFM32 Applications

  • Smart energy meters
  • Industrial and factory automation
  • Home automation and security
  • ARM Cortex-M4 at 72 MHz
  • Ultra low energy operation
  • 80 μA/MHz in Energy Mode 0 (EM0)
  • 2.1 μA EM2 Deep Sleep current (RTCC running with state and RAM retention)
  • Octal/Quad-SPI memory interface w/ XIP
  • SD/MMC/SDIO Host Controller
  • 10/100 Ethernet MAC with 802.3az EEE, IEEE1588
  • Dual CAN 2.0 Bus Controller
  • Crystal-free low-energy USB
  • Hardware cryptographic engine supports AES, ECC, SHA, and TRNG
  • Robust capacitive touch sense
  • Footprint compatible with select EFM32 packages
  • 5 V tolerant I/O
  • Mid- and high-tier wearables
  • IoT devices

EFM32 Electrical Characteristics

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

  • Typical values are based on T AMB =25 °C and V DD = 3.3 V, by production test and/or technology characterization.
  • Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise.

Refer to 4.1.2.1 General Operating Conditions for more details about operational supply and temperature limits.

EFM32 Absolute Maximum Ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.

Table 4.1. Absolute Maximum Ratings

ParameterSymbolTest ConditionMinTypMaxUnit
Storage temperature rangeT STG-50-150°C
Voltage on supply pins other than VREGI and VBUSV DDMAX-0.3-3.8V
Voltage ramp rate on any supply pinV DDRAMPMAX--1V / μs
DC voltage on any GPIO pinV DIGPIN5V tolerant GPIO pins 1 2 3-0.3-Min of 5.25 and IOVDD +2V
DC voltage on any GPIO pinV DIGPINLCD pins 3-0.3-Min of 3.8 and IOVDD +2V
DC voltage on any GPIO pinV DIGPINStandard GPIO pins-0.3-IOVDD+0.3V
Total current into VDD power linesI VDDMAXSource--200mA
Total current into VSS ground linesI VSSMAXSink--200mA
Current per I/O pinI IOMAXSink--50mA
Current per I/O pinI IOMAXSource--50mA
Current for all I/O pinsI IOALLMAXSink--200mA
Current for all I/O pinsI IOALLMAXSource--200mA
Junction temperatureT J-G grade devices-40-105°C
Junction temperatureT J-I grade devices-40-125°C
Voltage on regulator supply pins VREGI and VBUSV VREGI-0.3-5.5V
  1. When a GPIO pin is routed to the analog module through the APORT, the maximum voltage = IOVDD.
  2. Valid for IOVDD in valid operating range or when IOVDD is undriven (high-Z). If IOVDD is connected to a low-impedance source below the valid operating range (e.g. IOVDD shorted to VSS), the pin voltage maximum is IOVDD + 0.3 V, to avoid exceeding the maximum IO current specifications.
  3. To operate above the IOVDD supply rail, over-voltage tolerance must be enabled according to the GPIO_Px_OVTDIS register. Pins with over-voltage tolerance disabled have the same limits as Standard GPIO.

EFM32 Thermal Information

Table 4.3. Thermal Characteristics

ParameterSymbolTest ConditionMinTypMaxUnit
Thermal resistance, QFN64 PackageTHETA JA_QFN644-Layer PCB, Air velocity = 0 m/s-17.8-°C/W
Thermal resistance, QFN64 Package4-Layer PCB, Air velocity = 1 m/s-15.4-°C/W
Thermal resistance, QFN64 Package4-Layer PCB, Air velocity = 2 m/s-13.8-°C/W
Thermal resistance, TQFP64 PackageTHE- TA JA_TQFP644-Layer PCB, Air velocity = 0 m/s-33.9-°C/W
Thermal resistance, TQFP64 Package4-Layer PCB, Air velocity = 1 m/s-32.1-°C/W
Thermal resistance, TQFP64 Package4-Layer PCB, Air velocity = 2 m/s-30.1-°C/W
Thermal resistance, TQFP100 PackageTHE- TA JA_TQFP1004-Layer PCB, Air velocity = 0 m/s-44.1-°C/W
Thermal resistance, TQFP100 Package4-Layer PCB, Air velocity = 1 m/s-37.7-°C/W
Thermal resistance, TQFP100 Package4-Layer PCB, Air velocity = 2 m/s-35.5-°C/W
Thermal resistance, BGA112 PackageTHE- TA JA_BGA1124-Layer PCB, Air velocity = 0 m/s-42-°C/W
Thermal resistance, BGA112 Package4-Layer PCB, Air velocity = 1 m/s-37-°C/W
Thermal resistance, BGA112 Package4-Layer PCB, Air velocity = 2 m/s-35.3-°C/W
Thermal resistance, BGA120 PackageTHE- TA JA_BGA1204-Layer PCB, Air velocity = 0 m/s-47.9-°C/W
Thermal resistance, BGA120 Package4-Layer PCB, Air velocity = 1 m/s-41.8-°C/W
Thermal resistance, BGA120 Package4-Layer PCB, Air velocity = 2 m/s-39.6-°C/W
Thermal resistance, BGA152 PackageTHE- TA JA_BGA1524-Layer PCB, Air velocity = 0 m/s-35.7-°C/W
Thermal resistance, BGA152 Package4-Layer PCB, Air velocity = 1 m/s-31-°C/W
Thermal resistance, BGA152 Package4-Layer PCB, Air velocity = 2 m/s-29.5-°C/W
Thermal resistance, BGA192 PackageTHE- TA JA_BGA1924-Layer PCB, Air velocity = 0 m/s-47.9-°C/W
Thermal resistance, BGA192 Package4-Layer PCB, Air velocity = 1 m/s-41.8-°C/W
Thermal resistance, BGA192 Package4-Layer PCB, Air velocity = 2 m/s-39.6-°C/W

EFM32 Package Information

Figure 6.1. BGA192 Package Drawing

Table 6.1. BGA192 Package Dimensions

DimensionMinTypMax
A0.770.830.89
A10.130.180.23
A30.160.200.24
A20.45 REF0.45 REF0.45 REF
D7.00 BSC7.00 BSC7.00 BSC
e0.40 BSC0.40 BSC0.40 BSC
E7.00 BSC7.00 BSC7.00 BSC
D16.00 BSC6.00 BSC6.00 BSC
E16.00 BSC6.00 BSC6.00 BSC
b0.200.250.30
aaa0.100.100.10
bbb0.100.100.10
ddd0.080.080.08
eee0.150.150.15
fff0.050.050.05

  1. All dimensions shown are in millimeters (mm) unless otherwise noted.

  2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

  3. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
EFM32GG11Silicon LabsQFN64 (9x9 mm)

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All Microcontrollers (MCU) datasheetsAll Silicon Labs datasheets (179)

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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