Electronic Component Datasheets

2,725 components with extracted datasheet data

FXL0420-1R2-M

Cjiang Technology

1.2 μH ±20% wire wound molded SMD power inductor with low DCR and high saturation current, in the FXL0420 series (4.4 x 4.2 x 1.8 mm).

Wire Wound Molded SMD Power Inductors

FXL0420-1R5-M

Cjiang Technology

1.5 μH ±20% molded wire-wound SMD power inductor with alloy powder core, low core loss and ultra-low buzz noise, 125 °C max operation

Wire Wound Molded SMD Power Inductors

FXL0420-220-M

Cjiang Technology

22 µH ±20% molded wire-wound SMD power inductor in the FXL0420 size (4.4x4.2x1.8mm nominal body), with low core loss and low buzz noise

Wire Wound Molded SMD Power Inductors

FXL0420-2R2-M

Cjiang Technology

Halogen Free, RoHS compliant wire wound molded SMD power inductor with high rated current, low core loss, and ultra low buzz noise.

Wire Wound Molded SMD Power Inductors

FXL0420-3R3-M

Cjiang Technology

3.3 µH ±20% molded wire-wound SMD power inductor (FXL0420 series) with low DCR, high saturation current and low buzz noise for DC/DC converters.

Wire Wound Molded SMD Power Inductors

FXL0420-4R7-M

Cjiang Technology

4.7µH ±20% wire wound molded SMD power inductor, halogen-free, 125°C max operation, with low core loss and ultra-low buzz noise

Wire Wound Molded SMD Power InductorsSMD,4.4x4.2mm

FXL0420-6R8-M

Cjiang Technology

6.8 μH ±20% wire wound molded SMD power inductor with alloy powder core, 175 mΩ max DCR, and 2.0 A max saturation current

Wire Wound Molded SMD Power Inductors

FXL0420-R10-M

Cjiang Technology

0.1 µH ±20% wire wound molded SMD power inductor with alloy powder core, 4.4x4.2x1.8mm body, low DCR and high saturation current for DC/DC converters.

Wire Wound Molded SMD Power Inductors

FXL0420-R22-M

Cjiang Technology

0.22 µH ±20% wire wound molded SMD power inductor in the FXL0420 size (4.4x4.2x1.8mm body) with alloy powder core, low DCR and high saturation current for DC/DC converters.

Wire Wound Molded SMD Power Inductors

FXL0420-R33-M

Cjiang Technology

0.33 µH ±20% wire wound molded SMD power inductor in 4.4x4.2x1.8mm body with alloy powder core, low DCR and ultra-low buzz noise

Wire Wound Molded SMD Power Inductors

FXL0420-R47-M

Cjiang Technology

0.47 μH ±20% molded wire-wound SMD power inductor with alloy powder core, 14 mΩ max DCR and 7.6 A max saturation current, in the FXL0420 size (4.4 x 4.2 x 1.8 mm body).

Wire Wound Molded SMD Power Inductors

FXL0420-R56-M

Cjiang Technology

0.56 µH wire wound molded SMD power inductor with ±20% tolerance, 16 mΩ max DCR and 7.2 A max saturation current, in the FXL0420 series (4.4 x 4.2 x 1.8 mm body).

Wire Wound Molded SMD Power Inductors

FXL0420-R68-M

Cjiang Technology

0.68 µH ±20% molded wire-wound SMD power inductor (FXL0420 series) with alloy powder core, low DCR and high saturation current for DC/DC converter applications

Wire Wound Molded SMD Power Inductors

FXL0420-XXX

Cjiang Technology

Wire wound molded SMD power inductor in the FXL0420 size (4.4x4.2x1.8mm nominal), 0.1uH to 22uH, with high saturation current and low buzz noise for DC/DC converter applications

Wire Wound Molded SMD Power Inductors

FXL0630-3R3-M

Cjiang Technology

3.3 µH ±20% molded wire wound SMD power inductor with alloy powder core, low DCR and high rated current, up to 125 °C operation

Power InductorSMD,7x6.6mm

G6K-2F-Y-DC5

Omron

Low Signal Relays - PCB Gullwing NoLatch 3.2 DPDT 5VDC 100mW

Low Signal RelaySMT gullwing

GCM188R71E105KA64D

Murata

CAP CER 1UF 25V X7R 0603

Chip Monolithic Ceramic Capacitor0603 (1608 Metric)

GCM188R71H104KA57D

Murata

CAP CER 0.1UF 50V X7R 0603

Chip Multilayer Ceramic Capacitor0603 (1608 Metric)

GD25Q128ESIG

GigaDevice

NOR Flash

Serial Flash MemorySOP-8-208mil

GD25Q16C

GigaDevice

16M-bit (2M-Byte) Serial NOR Flash memory with Standard, Dual, and Quad SPI interfaces, supporting up to 120MHz clock frequency and 480Mbits/s data transfer.

Serial FlashSOP8 (150mil)

GD25Q16CEEG

GigaDevice

16Mbit (2MB) 3.3V uniform sector serial NOR flash memory with standard, dual and quad SPI interfaces, rated for -40 °C to +125 °C operation

3.3V Dual/Quad SPI NOR FlashUSON8 3x2mm

GD25Q16CEIG

GigaDevice

16Mbit 3.3V uniform sector serial NOR flash with standard, dual and quad SPI interfaces, supporting XIP operation

Dual/Quad SPI NOR FlashUSON8 3x2mm

GD25Q16CEJG

GigaDevice

3.3V 16Mbit uniform sector serial NOR flash memory with standard, dual and quad SPI interfaces, supporting XIP operation.

16Mbit Dual/Quad SPI NOR FlashUSON-8 3x2mm

GD25Q16CNEG

GigaDevice

16Mbit 3.3V uniform-sector serial NOR flash memory with standard, dual and quad SPI interfaces, XIP support, and an industrial temperature range of -40 °C to +125 °C for the E-grade part.

3.3V Dual/Quad SPI NOR FlashUSON-8 3x4mm

GD25Q16CNIG

GigaDevice

16Mbit 3.3V uniform-sector serial NOR flash memory with standard, dual and quad SPI interfaces

3.3V Dual/Quad SPI NOR FlashUSON8 3x4mm

GD25Q16CNJG

GigaDevice

16M-bit (2M-Byte) Serial Flash memory supporting Standard, Dual, and Quad SPI interfaces with high-speed data transfer, flexible architecture, and low power consumption.

Serial NOR Flash MemoryS

GD25Q16CPEG

GigaDevice

3.3V 16Mbit uniform-sector serial NOR flash with standard, dual and quad SPI interfaces, supporting XIP, block protection and security registers

16Mbit Dual/Quad SPI NOR Flash

GD25Q16CPIG

GigaDevice

16Mbit 3.3V uniform-sector serial NOR flash memory with standard, dual and quad SPI interfaces, supporting XIP operation

3.3V Dual/Quad SPI NOR Flash

GD25Q16CPJG

GigaDevice

16Mbit 3.3V uniform sector serial NOR flash with standard, dual and quad SPI interfaces, XIP support, and 105C industrial temperature range (J grade).

3.3V Dual/Quad SPI NOR Flash

GD25Q16CQEG

GigaDevice

3.3V 16Mbit uniform-sector serial NOR flash with standard, dual and quad SPI, supporting XIP operation, in a USON8 4x4mm package for the -40 °C to +125 °C temperature range.

16Mbit Dual/Quad SPI NOR FlashUSON-8 4x4mm

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