GD25Q16C
<span id="page-28-0"></span>7.20. Release from Deep Power-Down or High Performance Mode and Read Device ID (RDI) (ABH)
Manufacturer
unknown
Overview
Part: GD25Q16C
Type: Serial Flash
Key Specs:
- Memory Size: 16M-bit (2048K-Byte)
- Page Size: 256 Bytes
- Sector Erase Time: 45ms typical
- Chip Erase Time: 7s typical
- Block Erase Time: 0.15/0.25s typical
- Page Program Time: 0.6ms typical
- Fast Read Clock Frequency: 120MHz
- Quad I/O Data Transfer Rate: up to 480Mbits/s
- Dual I/O Data Transfer Rate: up to 240Mbits/s
- Standby Current: 1uA typical
- Deep Power Down Current: 1uA typical
- Program/Erase Cycles: Minimum 100,000
- Data Retention: 20-year typical
- Supply Voltage Range: 2.7V to 3.6V
Features:
- Standard, Dual, Quad SPI
- Standard SPI: SCLK, CS#, SI, SO, WP#, HOLD#
- Dual SPI: SCLK, CS#, IO0, IO1, WP#, HOLD#
- Quad SPI: SCLK, CS#, IO0, IO1, IO2, IO3
- Write protect all/portion of memory via software
- 128-Bit Unique ID for each device
- Allows XIP (execute in place) Operation
- Continuous Read With 8/16/32/64-Byte Wrap
- Flexible Architecture: Uniform Sector of 4K-Byte
- Flexible Architecture: Uniform Block of 32/64K-Byte
- Software/Hardware Write Protection
- Enable/Disable protection with WP# Pin
- Top/Bottom Block protection
- 4x256-Byte security registers with OTP locks
- Discoverable parameters (SFDP) register
Applications:
- null
Package:
- SOP8: 150mil
- SOP8: 208mil
- VSOP8: 208mil
- DIP8: 300mil
- USON8: 3*2mm, THICKNESS 0.45mm
- USON8: 3*4mm
- USON8: 4*4MM, 0.45 THICKNESS
- WSON8: 6*5MM
- TFBGA-24BALL: 6*4 ball array
Features
-
-256 Bytes per programmable page -Sector Erase time: 45ms typical
-
◆ Standard, Dual, Quad SPI -Chip Erase time: 7s typical
-
-Standard SPI: SCLK, CS#, SI, SO, WP#, HOLD#
-
-Dual SPI: SCLK, CS#, IO0, IO1, WP#, HOLD# ◆Flexible Architecture
-
-Quad SPI: SCLK, CS#, IO0, IO1, IO2, IO3 -Uniform Sector of 4K-Byte
-
◆ High Speed Clock Frequency
-
-120MHz for fast read with 30PF load ◆ Low Power Consumption
- -Quad I/O Data transfer up to 480Mbits/s -1uA typical standby current
-
- -Write protect all/portion of memory via software -128-Bit Unique ID for each device
-
◆ Minimum 100,000 Program/Erase Cycles ◆ Single Power Supply Voltage
-
◆ Data Retention
-
-20-year data retention typical ◆ Package Information
-
◆ Allows XIP (execute in place) Operation -SOP8 (208mil)
- -Continuous Read With 8/16/32/64-Byte Wrap -VSOP8 (208mil)
-
◆ 16M-bit Serial Flash ◆ Fast Program/Erase Speed
-
-2048K-Byte -Page Program time: 0.6ms typical
-
-Block Erase time: 0.15/0.25s typical
-
-Uniform Block of 32/64K-Byte
-
-
-Dual I/O Data transfer up to 240Mbits/s -1uA typical deep power down current
-
◆ Software/Hardware Write Protection ◆ Advanced Security Features
-
-Enable/Disable protection with WP# Pin -4x256-Byte security registers with OTP locks
-
-Top/Bottom Block protection -Discoverable parameters (SFDP) register
-
-Full voltage range:2.7~3.6V
-
-SOP8 (150mil)
-
-DIP8 (300mil)
-
-USON8 (3*2mm)
-
-
-
-USON8 (3*4mm)
-
-USON8 (4*4mm)
- -WSON8 (6*5mm)
- -TFBGA-24(6*4 ball array)
Pin Configuration
| N DESCRIPTION |
|---|
| Pin Name I/O |
| CS# |
| SO (IO1) |
| WP# (IO2) I/O |
| VSS |
| SI (IO0) |
| SCLK |
| HOLD# (IO3) I/O |
| vcc |
| Note: CS# must be driven high if chip is not selected. Please don't leave CS# floating any time after power is on. |
Electrical Characteristics
(T= -40°C85°C, VCC=2.73.6V)
| Symbol | Parameter | Test Condition | Min. | Typ. | Max. | Unit. |
|---|---|---|---|---|---|---|
| ILI | Input Leakage Current | ±2 | μA | |||
| ILO | Output Leakage Current | ±2 | μA | |||
| ICC1 | Standby Current | CS#=VCC, | 1 | 5 | μA | |
| VIN=VCC or VSS | ||||||
| ICC2 | Deep Power-Down Current | CS#=VCC, | 1 | 5 | μA | |
| VIN=VCC or VSS | ||||||
| CLK=0.1VCC / | ||||||
| 0.9VCC | ||||||
| at 120MHz, | 15 | 20 | mA | |||
| Q=Open(*1,*2,*4 I/O) | ||||||
| ICC3 | Operating Current (Read) | CLK=0.1VCC / | ||||
| 0.9VCC | ||||||
| at 80MHz, | 13 | 18 | mA | |||
| Q=Open(*1,*2,*4 I/O) | ||||||
| ICC4 | Operating Current (PP) | CS#=VCC | 20 | mA | ||
| ICC5 | Operating Current (WRSR) | CS#=VCC | 20 | mA | ||
| ICC6 | Operating Current (SE) | CS#=VCC | 20 | mA | ||
| ICC7 | Operating Current (BE) | CS#=VCC | 20 | mA | ||
| ICC8 | Operating Current (CE) | CS#=VCC | 20 | mA | ||
| ICC9 | High Performance Current | 0.6 | 1.2 | mA | ||
| VIL | Input Low Voltage | 0.2VCC | V | |||
| VIH | Input High Voltage | 0.7VCC | V | |||
| VOL | Output Low Voltage | IOL =100μA | 0.2 | V | ||
| VOH | Output High Voltage | IOH =-100μA | VCC-0.2 | V |
-
- Typical values given for TA=25°C.
-
- Value guaranteed by design and/or characterization, not 100% tested in production.
(T= -40°C105°C, VCC=2.73.6V)
| Symbol | Parameter | Test Condition | Min. | Typ. | Max. | Unit. |
|---|---|---|---|---|---|---|
| ILI | Input Leakage Current | ±2 | μA | |||
| ILO | Output Leakage Current | ±2 | μA | |||
| ICC1 | Standby Current | CS#=VCC, | 1 | 25 | μA | |
| VIN=VCC or VSS | ||||||
| ICC2 | Deep Power-Down | CS#=VCC, | 1 | 25 | μA | |
| Current | VIN=VCC or VSS | |||||
| CLK=0.1VCC / | ||||||
| 0.9VCC | ||||||
| at 80MHz, | 15 | 20 | mA | |||
| Operating Current (Read) | Q=Open(*1 I/O) | |||||
| ICC3 | CLK=0.1VCC / | 13 | ||||
| 0.9VCC | ||||||
| at 60MHz, | 18 | mA | ||||
| Q=Open(*1,*2,*4 I/O) | ||||||
| ICC4 | Operating Current (PP) | CS#=VCC | 25 | mA | ||
| ICC5 | Operating Current(WRSR) | CS#=VCC | 25 | mA | ||
| ICC6 | Operating Current (SE) | CS#=VCC | 25 | mA | ||
| ICC7 | Operating Current (BE) | CS#=VCC | 25 | mA | ||
| ICC8 | Operating Current (CE) | CS#=VCC | 25 | mA | ||
| ICC9 | High Performance Current | 0.6 | 1.5 | mA | ||
| VIL | Input Low Voltage | -0.5 | 0.2VCC | V | ||
| VIH | Input High Voltage | 0.7VCC | VCC+0.4 | V | ||
| VOL | Output Low Voltage | IOL =100uA | 0.2 | V | ||
| VOH | Output High Voltage | IOH =-100μA | VCC-0.2 | V |
-
- Typical values given for TA=25°C.
-
- Value guaranteed by design and/or characterization, not 100% tested in production.
(T= -40°C125°C, VCC=2.73.6V)
| Symbol | Parameter | Test Condition | Min. | Typ. | Max. | Unit. |
|---|---|---|---|---|---|---|
| ILI | Input Leakage Current | ±2 | μA | |||
| ILO | Output Leakage Current | ±2 | μA | |||
| ICC1 | Standby Current | CS#=VCC, | 1 | 30 | μA | |
| VIN=VCC or VSS | ||||||
| ICC2 | Deep Power-Down | CS#=VCC, | 1 | 30 | μA | |
| Current | VIN=VCC or VSS | |||||
| CLK=0.1VCC / | ||||||
| 0.9VCC | ||||||
| Operating Current (Read) | at 80MHz, | 15 | 20 | mA | ||
| Q=Open(*1 I/O) | ||||||
| ICC3 | CLK=0.1VCC / | 13 | ||||
| 0.9VCC | mA | |||||
| at 60MHz, | 18 | |||||
| Q=Open(*1,*2,*4 I/O) | ||||||
| ICC4 | Operating Current (PP) | CS#=VCC | 25 | mA | ||
| ICC5 | Operating Current(WRSR) | CS#=VCC | 25 | mA | ||
| ICC6 | Operating Current (SE) | CS#=VCC | 25 | mA | ||
| ICC7 | Operating Current (BE) | CS#=VCC | 25 | mA | ||
| ICC8 | Operating Current (CE) | CS#=VCC | 25 | mA | ||
| ICC9 | High Performance Current | 0.6 | 1.5 | mA | ||
| VIL | Input Low Voltage | -0.5 | 0.2VCC | V | ||
| VIH | Input High Voltage | 0.7VCC | VCC+0.4 | V | ||
| VOL | Output Low Voltage | IOL =100uA | 0.2 | V | ||
| VOH | Output High Voltage | IOH =-100μA | VCC-0.2 | V |
-
- Typical values given for TA=25°C.
-
- Value guaranteed by design and/or characterization, not 100% tested in production.
Absolute Maximum Ratings
| Parameter | Value | Unit |
|---|---|---|
| Ambient Operating Temperature | -40 to 85 | °C |
| -40 to 105 | ||
| -40 to 125 | ||
| Storage Temperature | -65 to 150 | °C |
| Applied Input / Output Voltage | -0.6 to VCC+0.4 | V |
| Transient Input / Output Voltage(note: overshoot) | -2.0 to VCC+2.0 | V |
| VCC | -0.6 to 4.2 | V |
Figure38. Maximum Negative and Positive Overshoot Waveform
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