GD25Q16C
Serial FlashThe GD25Q16C is a serial flash from GigaDevice. View the full GD25Q16C datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
GigaDevice
Category
Integrated CircuitsPackage
SOP8 (150mil), SOP8 (208mil), VSOP8 (208mil), DIP8 (300mil), USON8 (3*2mm, thickness 0.45mm), USON8
Overview
Part: GD25Q16C
Type: Serial Flash
Description: A 16M-bit (2048K-Byte) serial flash memory supporting Standard, Dual, and Quad SPI interfaces, operating from 2.7–3.6V with a high-speed clock frequency of 120MHz.
Operating Conditions:
- Supply voltage: 2.7–3.6V
- Max clock frequency: 120MHz (for fast read with 30PF load)
- Dual I/O Data transfer: up to 240Mbits/s
- Quad I/O Data transfer: up to 480Mbits/s
Absolute Maximum Ratings:
- Max supply voltage: null
- Max continuous current: null
- Max junction/storage temperature: null
Key Specs:
- Memory size: 16M-bit (2048K-Byte)
- Page size: 256 Bytes
- Sector size: 4K-Byte (uniform)
- Block size: 32/64K-Byte (uniform)
- Minimum Program/Erase Cycles: 100,000
- Data Retention: 20-year typical
- Deep power down current: 1μA typical
- Standby current: 1μA typical
Features:
- 16M-bit Serial Flash
- Standard, Dual, Quad SPI
- High Speed Clock Frequency (120MHz)
- Software/Hardware Write Protection
- Minimum 100,000 Program/Erase Cycles
- 20-year data retention typical
- Allows XIP (execute in place) Operation
- Fast Program/Erase Speed
- Flexible Architecture (Uniform Sector of 4K-Byte, Uniform Block of 32/64K-Byte)
- Low Power Consumption (1μA typical deep power down/standby current)
- Advanced Security Features (128-Bit Unique ID, 4x256-Byte security registers with OTP locks, SFDP register)
- Single Power Supply Voltage (2.7~3.6V)
Applications:
- null
Package:
- SOP8 (150mil)
- SOP8 (208mil)
- VSOP8 (208mil)
- DIP8 (300mil)
- USON8 (3*2mm)
- USON8 (3*4mm)
- USON8 (4*4mm)
- WSON8 (6*5mm)
- TFBGA-24 (6*4 ball array)
Features
- ◆ 16M-bit Serial Flash
- -2048K-Byte
- -256 Bytes per programmable page
- ◆ Standard, Dual, Quad SPI
- -Standard SPI: SCLK, CS#, SI, SO, WP#, HOLD#
- -Dual SPI: SCLK, CS#, IO0, IO1, WP#, HOLD#
- -Quad SPI: SCLK, CS#, IO0, IO1, IO2, IO3
- ◆ High Speed Clock Frequency
- -120MHz for fast read with 30PF load
- -Dual I/O Data transfer up to 240Mbits/s
- -Quad I/O Data transfer up to 480Mbits/s
- ◆ Software/Hardware Write Protection -Write protect all/portion of memory via software -Enable/Disable protection with WP# Pin -Top/Bottom Block protection
- ◆ Minimum 100,000 Program/Erase Cycles
- ◆ Data Retention
- -20-year data retention typical
- ◆ Allows XIP (execute in place) Operation
- -Continuous Read With 8/16/32/64-Byte Wrap
- ◆ Fast Program/Erase Speed
- -Page Program time: 0.6ms typical
- -Sector Erase time: 45ms typical
- -Block Erase time: 0.15/0.25s typical
- -Chip Erase time: 7s typical
- ◆ Flexible Architecture -Uniform Sector of 4K-Byte -Uniform Block of 32/64K-Byte
- ◆ Low Power Consumption
- -1μA typical deep power down current
- -1μA typical standby current
- ◆ Advanced Security Features -128-Bit Unique ID for each device
- -4x256-Byte security registers with OTP locks
- -Discoverable parameters (SFDP) register
- ◆ Single Power Supply Voltage -Full voltage range:2.7~3.6V
- ◆ Package Information
- -SOP8 (150mil)
- -SOP8 (208mil)
- -VSOP8 (208mil)
- -DIP8 (300mil)
- -USON8 (3*2mm)
- -USON8 (3*4mm)
- -USON8 (4*4mm)
- -WSON8 (6*5mm)
- -TFBGA-24(6*4 ball array)
Pin Configuration
| Pin Name | I/O | Description |
|---|---|---|
| CS# | I | Chip Select Input |
| SO | I/O | (IO1) Data Output (Data Input Output 1) |
| WP# (IO2) | I/O | Write Protect Input (Data Input Output |
| VSS | Ground | |
| I/O | SI (IO0) Data Input (Data Input Output 0) | |
| SCLK | I | Serial Clock Input |
| HOLD# (IO3) | I/O | Hold Input (Data Input Output 3) |
| VCC | Power Supply |
Note: CS# must be driven high if chip is not selected. Please don't leave CS# floating any time after power is on.
Electrical Characteristics
(T= -40 °C 85 °C , VCC=2.73.6V)
| Symbol | Parameter | Test Condition | Min. | Typ. | Max. | Unit. |
|---|---|---|---|---|---|---|
| I LI | Input Leakage Current | ±2 | μA | |||
| I LO | Output Leakage Current | ±2 | μA | |||
| I CC1 | Standby Current | CS#=VCC, V IN =VCC or VSS | 1 | 5 | μA | |
| I CC2 | Deep Power-Down Current | CS#=VCC, V IN =VCC or VSS | 1 | 5 | μA | |
| I CC3 | Operating Current (Read) | CLK=0.1VCC / 0.9VCC at 120MHz, Q=Open(*1,*2,*4 I/O) | 15 | 20 | mA | |
| I CC3 | Operating Current (Read) | CLK=0.1VCC / 0.9VCC at 80MHz, Q=Open(*1,*2,*4 I/O) | 13 | 18 | mA | |
| I CC4 | Operating Current (PP) | CS#=VCC | 20 | mA | ||
| I CC5 | Operating Current (WRSR) | CS#=VCC | 20 | mA | ||
| I CC6 | Operating Current (SE) | CS#=VCC | 20 | mA | ||
| I CC7 | Operating Current (BE) | CS#=VCC | 20 | mA | ||
| I CC8 | Operating Current (CE) | CS#=VCC | 20 | mA | ||
| I CC9 | High Performance Current | 0.6 | 1.2 | mA | ||
| V IL | Input Low Voltage | 0.2VCC | V | |||
| V IH | Input High Voltage | 0.7VCC | V | |||
| V OL | Output Low Voltage | I OL =100μA | 0.2 | V | ||
| V OH | Output High Voltage | I OH =-100μA | VCC-0.2 | V |
- Typical values given for TA=25° C.
- Value guaranteed by design and/or characterization, not 100% tested in production.
(T= -40 °C 105 °C , VCC=2.73.6V)
| Symbol | Parameter | Test Condition | Min. | Typ. | Max. | Unit. |
|---|---|---|---|---|---|---|
| I LI | Input Leakage Current | ±2 | μA | |||
| I LO | Output Leakage Current | ±2 | μA | |||
| I CC1 | Standby Current | CS#=VCC, V IN =VCC or VSS | 1 | 25 | μA | |
| I CC2 | Deep Power-Down Current | CS#=VCC, V IN =VCC or VSS | 1 | 25 | μA | |
| I CC3 | Operating Current (Read) | CLK=0.1VCC / 0.9VCC at 80MHz, Q=Open(*1 I/O) | 15 | 20 | mA | |
| I CC3 | Operating Current (Read) | CLK=0.1VCC / 0.9VCC at 60MHz, Q=Open(*1,*2,*4 I/O) | 13 | 18 | mA | |
| I CC4 | Operating Current (PP) | CS#=VCC | 25 | mA | ||
| I CC5 | Operating Current(WRSR) | CS#=VCC | 25 | mA | ||
| I CC6 | Operating Current (SE) | CS#=VCC | 25 | mA | ||
| I CC7 | Operating Current (BE) | CS#=VCC | 25 | mA | ||
| I CC8 | Operating Current (CE) | CS#=VCC | 25 | mA | ||
| I CC9 | High Performance Current | 0.6 | 1.5 | mA | ||
| V IL | Input Low Voltage | -0.5 | 0.2VCC | V | ||
| V IH | Input High Voltage | 0.7VCC | VCC+0.4 | V | ||
| V OL | Output Low Voltage | I OL =100μA | 0.2 | V | ||
| V OH | Output High Voltage | I OH =-100μA | VCC-0.2 | V |
- Typical values given for TA=25° C.
- Value guaranteed by design and/or characterization, not 100% tested in production.
(T= -40 °C 125 °C , VCC=2.73.6V)
| Symbol | Parameter | Test Condition | Min. | Typ. | Max. | Unit. |
|---|---|---|---|---|---|---|
| I LI | Input Leakage Current | ±2 | μA | |||
| I LO | Output Leakage Current | ±2 | μA | |||
| I CC1 | Standby Current | CS#=VCC, V IN =VCC or VSS | 1 | 30 | μA | |
| I CC2 | Deep Power-Down Current | CS#=VCC, V IN =VCC or VSS | 1 | 30 | μA | |
| I CC3 | Operating Current (Read) | CLK=0.1VCC / 0.9VCC at 80MHz, Q=Open(*1 I/O) | 15 | 20 | mA | |
| I CC3 | Operating Current (Read) | CLK=0.1VCC / 0.9VCC at 60MHz, Q=Open(*1,*2,*4 I/O) | 13 | 18 | mA | |
| I CC4 | Operating Current (PP) | CS#=VCC | 25 | mA | ||
| I CC5 | Operating Current(WRSR) | CS#=VCC | 25 | mA | ||
| I CC6 | Operating Current (SE) | CS#=VCC | 25 | mA | ||
| I CC7 | Operating Current (BE) | CS#=VCC | 25 | mA | ||
| I CC8 | Operating Current (CE) | CS#=VCC | 25 | mA | ||
| I CC9 | High Performance Current | 0.6 | 1.5 | mA | ||
| V IL | Input Low Voltage | -0.5 | 0.2VCC | V | ||
| V IH | Input High Voltage | 0.7VCC | VCC+0.4 | V | ||
| V OL | Output Low Voltage | I OL =100μA | 0.2 | V | ||
| V OH | Output High Voltage | I OH =-100μA | VCC-0.2 | V |
- Typical values given for TA=25° C.
- Value guaranteed by design and/or characterization, not 100% tested in production.
Absolute Maximum Ratings
| Parameter | Value | Unit |
|---|---|---|
| Ambient Operating Temperature | -40 to 85 | °C |
| Storage Temperature | -40 to 105 -40 to 125 -65 to 150 | °C |
| Applied Input / Output Voltage | -0.6 to VCC+0.4 | V |
| Transient Input / Output Voltage(note: overshoot) | -2.0 to VCC+2.0 | V |
| VCC | -0.6 to 4.2 | V |
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