W25Q256JVPIQ
Serial Flash MemoryThe W25Q256JVPIQ is a serial flash memory from Winbond. View the full W25Q256JVPIQ datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
W25Q256JVPIQ shares its datasheet with W25Q256JV, whose page lists every part number it covers.
Official W25Q256JVPIQ datasheet (PDF) — the source this page was extracted from.
Manufacturer
WinbondCategory
Memory ICsPackage
8-pad WSON 8x6-mm, 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm (5x5-1 Ball Array), 24-ball TFBGA 8x6-mm (6x4 Ball Array)
W25Q256JVPIQ Key Specifications
| Parameter | Value |
|---|---|
| Memory Size | 256 M-bit |
| Power Down Current | <1 μA (typ) |
| Supply Voltage Range | 2.7V to 3.6V |
| Communication Interfaces | Standard SPI, Dual SPI, Quad SPI |
| Operating Temperature Range | -40°C to +85°C |
W25Q256JVPIQ Overview
Part: W25Q256JV — Winbond
Type: Serial Flash Memory
Description: The W25Q256JV is a 256M-bit (32M-byte) Serial Flash memory operating from a 2.7V to 3.6V supply, supporting Standard, Dual, and Quad SPI interfaces with clock frequencies up to 133MHz, enabling equivalent data transfer rates of 532MHz for Quad I/O.
Operating Conditions:
- Supply voltage: 2.7V to 3.6V
- Operating temperature: -40°C to +85°C
- Max SPI clock frequency: 133MHz
Key Specs:
- Capacity: 256M-bit / 32M-byte
- Page size: 256-bytes
- Sector erase size: 4KB
- Block erase sizes: 32KB, 64KB
- Continuous data transfer rate: 66MB/S
- Program-Erase cycles: Min. 100K per sector
- Data retention: More than 20-year
- Power-down current: <1μA (typ.)
Features:
- Standard SPI: CLK, /CS, DI, DO
- Dual SPI: CLK, /CS, IO0, IO1
- Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
- 3 or 4-Byte Addressing Mode
- Software & Hardware Reset
- 266/532MHz equivalent Dual/Quad SPI
- Quad Peripheral Interface
- Allows true XIP (execute in place) operation
- Uniform Sector/Block Erase (4K/32K/64K-Byte)
- Program 1 to 256 byte per programmable page
- Erase/Program Suspend & Resume
- Software Write-Protect
- Power Supply Lock-Down
- Special OTP protection
- Top/Bottom, Complement Array Protection
Package:
- WSON 8x6-mm (8-Pad)
- SOIC 300-mil (16-Pin)
- TFBGA 8x6-mm (24-Ball, 5x5 or 6x4 Ball Array)
W25Q256JVPIQ Features
- Software Write-Protect
- Power Supply Lock-Down
- Special OTP protection
- Top/Bottom, Complement array protection
- Individual Block/Sector array protection
- 64-Bit Unique ID for each device
- Discoverable Parameters (SFDP) Register
- 3X256-Bytes Security Registers with OTP locks
- Volatile & Non-volatile Status Register Bits
W25Q256JVPIQ Pin Configuration
W25Q256JV is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package code F) and two 24-ball 8x6-mm TFBGA (package code B & C) packages as shown in Figure 1a-c respectively. Package diagrams and dimensions are illustrated at the end of this datasheet.
W25Q256JVPIQ Electrical Characteristics
| PARAMETER | SYMBOL | CONDITIONS | SPEC | SPEC | SPEC | UNIT |
|---|---|---|---|---|---|---|
| PARAMETER | SYMBOL | CONDITIONS | MIN | TYP | MAX | UNIT |
| Input Capacitance | CIN (1) | VIN = 0V | 6 | pF | ||
| Output Capacitance | Cout (1) | VOUT = 0V | 8 | pF | ||
| Input Leakage | I LI | ±2 | μA | |||
| I/O Leakage | ILO | ±2 | μA | |||
| Standby Current | ICC1 | /CS = VCC, VIN = GND or VCC | 10 | 60 | μA | |
| Power-down Current | ICC2 | /CS = VCC, VIN = GND or VCC | 1 | 20 | μA | |
| Current Read Data / Dual /Quad 50MHz (2) | ICC3 | C = 0.1 VCC / 0.9 VCC DO = Open | 15 | mA | ||
| Current Read Data / Dual Output Read/Quad Output Read 104MHz (2) | ICC3 | C = 0.1 VCC / 0.9 VCC DO = Open | 20 | mA | ||
| Current Write Status Register | ICC4 | /CS = VCC | 20 | 25 | mA | |
| Current Page Program | ICC5 | /CS = VCC | 20 | 25 | mA | |
| Current Sector/Block Erase | ICC6 | /CS = VCC | 20 | 25 | mA | |
| Current Chip Erase | ICC7 | /CS = VCC | 20 | 25 | mA | |
| Input Low Voltage | VIL | -0.5 | VCC x 0.3 | V | ||
| Input High Voltage | VIH | VCC x 0.7 | VCC + 0.4 | V | ||
| Output Low Voltage | VOL | IOL = 100 μA | 0.2 | V | ||
| Output High Voltage | VOH | IOH = -100 μA | VCC - 0.2 | V |
-
Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 3.0V.
-
Checker Board Pattern.
- 80 - Revision B
W25Q256JVPIQ Absolute Maximum Ratings
| PARAMETERS | SYMBOL | CONDITIONS | RANGE | UNIT |
|---|---|---|---|---|
| Supply Voltage | VCC | -0.6 to +4.6 | V | |
| Voltage Applied to Any Pin | VIO | Relative to Ground | -0.6 to VCC+0.4 | V |
| Transient Voltage on any Pin | VIOT | <20nS Transient Relative to Ground | -2.0 to VCC+2.0 | V |
| Storage Temperature | TSTG | -65 to +150 | °C | |
| Lead Temperature | TLEAD | See Note (2) | °C | |
| Electrostatic Discharge Voltage | VESD | Human Body Model (3) | -2000 to +2000 | V |
- This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device reliability. Exposure beyond absolute maximum ratings may cause permanent damage.
- Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly and the European directive on restrictions on hazardous substances (RoHS) 2002/95/EU.
- JEDEC Std JESD22-A114A (C1=100pF, R1=1500 ohms, R2=500 ohms).
Variants on the same datasheet
These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.
| Part Number | Manufacturer | Package |
|---|---|---|
| W25Q256JV | Winbond | — |
| W25Q256JVBIQ | Winbond | TFBGA-24 8x6mm |
| W25Q256JVCIQ | Winbond | TFBGA-24 8x6mm |
| W25Q256JVEIQ | Winbond | WSON-8 8x6mm |
| W25Q256JVFIQ | Winbond | — |
| W25Q256JWPIQ | Winbond |
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- W25Q32JVSSIQ – Winbond
- 23A1024 – Microchip Technology, Serial SRAM
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